DDR DRAM Module, 32MX32, 0.75ns, CMOS, LEAD FREE, DIMM-100
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Micron Technology |
零件包装代码 | DIMM |
包装说明 | DIMM, |
针数 | 100 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
访问模式 | SINGLE BANK PAGE BURST |
最长访问时间 | 0.75 ns |
其他特性 | AUTO/SELF REFRESH |
JESD-30 代码 | R-XDMA-N100 |
JESD-609代码 | e4 |
内存密度 | 1073741824 bit |
内存集成电路类型 | DDR DRAM MODULE |
内存宽度 | 32 |
功能数量 | 1 |
端口数量 | 1 |
端子数量 | 100 |
字数 | 33554432 words |
字数代码 | 32000000 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 32MX32 |
封装主体材料 | UNSPECIFIED |
封装代码 | DIMM |
封装形状 | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY |
峰值回流温度(摄氏度) | 260 |
认证状态 | Not Qualified |
自我刷新 | YES |
最大供电电压 (Vsup) | 2.7 V |
最小供电电压 (Vsup) | 2.3 V |
标称供电电压 (Vsup) | 2.5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Gold (Au) |
端子形式 | NO LEAD |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 30 |
MT4VDDT3232UY-75XX | MT4VDDT1632UG-75XX | MT4VDDT1632UY-6XX | MT4VDDT3232UG-75XX | MT4VDDT3232UG-6XX | MT4VDDT3232UY-6XX | MT4VDDT1632UY-75XX | MT4VDDT1632UG-6XX | MT4VDDT1632UG-75B1 | |
---|---|---|---|---|---|---|---|---|---|
描述 | DDR DRAM Module, 32MX32, 0.75ns, CMOS, LEAD FREE, DIMM-100 | DDR DRAM Module, 16MX32, 0.75ns, CMOS, DIMM-100 | DDR DRAM Module, 16MX32, 0.7ns, CMOS, LEAD FREE, DIMM-100 | DDR DRAM Module, 32MX32, 0.75ns, CMOS, DIMM-100 | DDR DRAM Module, 32MX32, 0.7ns, CMOS, DIMM-100 | DDR DRAM Module, 32MX32, 0.7ns, CMOS, LEAD FREE, DIMM-100 | DDR DRAM Module, 16MX32, 0.75ns, CMOS, LEAD FREE, DIMM-100 | DDR DRAM Module, 16MX32, 0.7ns, CMOS, DIMM-100 | DDR DRAM Module, 16MX32, 0.75ns, CMOS, DIMM-100 |
是否Rohs认证 | 符合 | 不符合 | 符合 | 不符合 | 不符合 | 符合 | 符合 | 不符合 | 不符合 |
零件包装代码 | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM |
包装说明 | DIMM, | DIMM, | DIMM, | DIMM, | DIMM, | DIMM, | DIMM, | DIMM, | DIMM-100 |
针数 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | unknown | compliant | compliant | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
访问模式 | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST |
最长访问时间 | 0.75 ns | 0.75 ns | 0.7 ns | 0.75 ns | 0.7 ns | 0.7 ns | 0.75 ns | 0.7 ns | 0.75 ns |
其他特性 | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
JESD-30 代码 | R-XDMA-N100 | R-XDMA-N100 | R-XDMA-N100 | R-XDMA-N100 | R-XDMA-N100 | R-XDMA-N100 | R-XDMA-N100 | R-XDMA-N100 | R-XDMA-N100 |
内存密度 | 1073741824 bit | 536870912 bit | 536870912 bit | 1073741824 bit | 1073741824 bit | 1073741824 bit | 536870912 bit | 536870912 bit | 536870912 bit |
内存集成电路类型 | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE |
内存宽度 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
字数 | 33554432 words | 16777216 words | 16777216 words | 33554432 words | 33554432 words | 33554432 words | 16777216 words | 16777216 words | 16777216 words |
字数代码 | 32000000 | 16000000 | 16000000 | 32000000 | 32000000 | 32000000 | 16000000 | 16000000 | 16000000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 32MX32 | 16MX32 | 16MX32 | 32MX32 | 32MX32 | 32MX32 | 16MX32 | 16MX32 | 16MX32 |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装代码 | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
峰值回流温度(摄氏度) | 260 | 235 | 260 | 235 | 235 | 260 | 260 | 235 | 235 |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
自我刷新 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
最大供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
最小供电电压 (Vsup) | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V |
标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
是否无铅 | 不含铅 | 含铅 | 不含铅 | 含铅 | 含铅 | - | 不含铅 | 含铅 | 含铅 |
厂商名称 | Micron Technology | - | - | - | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
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