PD - 96040C
Features
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IRF1404ZPbF
IRF1404ZSPbF
IRF1404ZLPbF
HEXFET
®
Power MOSFET
D
Advanced Process Technology
Ultra Low On-Resistance
175°C Operating Temperature
Fast Switching
Repetitive Avalanche Allowed up to Tjmax
Lead-Free
V
(BR)DSS
R
DS(on)
typ.
max.
40V
2.7m
Ω
3.7m
Ω
180A
120A
G
S
Description
I
D (Silicon Limited)
I
D (Package Limited)
l
This HEXFET
®
Power MOSFET utilizes the latest
processing techniques to achieve extremely low on-
resistance per silicon area. Additional features of
this design are a 175°C junction operating temperature,
fast switching speed and improved repetitive
avalanche rating . These features combine to make
this design an extremely efficient and reliable device
for use in a wide variety of applications.
TO-220AB
IRF1404ZPbF
D
2
Pak
IRF1404ZSPbF
TO-262
IRF1404ZLPbF
Absolute Maximum Ratings
Parameter
I
D
@ T
C
= 25°C
I
D
@ T
C
= 100°C
I
D
@ T
C
= 25°C
I
DM
P
D
@T
C
= 25°C
V
GS
E
AS (Thermally limited)
E
AS
(Tested )
I
AR
E
AR
T
J
T
STG
Continuous Drain Current, V
GS
@ 10V
(S ilicon Limited)
Continuous Drain Current, V
GS
@ 10V
Continuous Drain Current, V
GS
@ 10V
(P ackage L imited)
Pulsed Drain Current
Max.
180
120
120
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Units
A
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Single Pulse Avalanche Energy Tested Value
Avalanche Current
Repetitive Avalanche Energy
710
200
1.3
± 20
330
480
See Fig.12a, 12b, 15, 16
-55 to + 175
W
W/°C
V
mJ
A
mJ
°C
d
Ã
h
g
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Mounting Torque, 6-32 or M3 screw
Thermal Resistance
R
θJC
R
θCS
R
θJA
R
θJA
i
300 (1.6mm from case )
10 lbf in (1.1N m)
y
y
Parameter
Junction-to-Case
Case-to-Sink, Flat Greased Surface
Junction-to-Ambient
Typ.
Max.
0.75
62
40
–––
i
i
–––
0.50
–––
–––
k
Units
°C/W
Junction-to-Ambient (PCB Mount)
j
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1
06/19/12
IRF1404Z/S/LPbF
Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
Parameter
V
(BR)DSS
ΔV
(BR)DSS
/ΔT
J
R
DS(on)
V
GS(th)
gfs
I
DSS
I
GSS
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
L
D
L
S
C
iss
C
oss
C
rss
C
oss
C
oss
C
oss
eff.
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
Forward Transconductance
Drain-to-Source Leakage Current
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Internal Drain Inductance
Internal Source Inductance
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Output Capacitance
Output Capacitance
Effective Output Capacitance
Min.
40
–––
–––
2.0
170
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
Typ. Max. Units
–––
0.033
2.7
–––
–––
–––
–––
–––
–––
100
31
42
18
110
36
58
4.5
7.5
4340
1030
550
3300
920
1350
–––
–––
3.7
4.0
–––
20
250
200
-200
150
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
Conditions
V V
GS
= 0V, I
D
= 250μA
V/°C Reference to 25°C, I
D
= 1mA
mΩ V
GS
= 10V, I
D
= 75A **
V V
DS
= V
GS
, I
D
= 150μA
V V
DS
= 25V, I
D
= 75A**
μA
V
DS
= 40V, V
GS
= 0V
V
DS
= 40V, V
GS
= 0V, T
J
= 125°C
nA V
GS
= 20V
V
GS
= -20V
I
D
= 75A**
nC V
DS
= 32V
V
GS
= 10V
V
DD
= 20V
I
D
= 75A**
ns R
G
= 3.0
Ω
e
e
e
V
GS
= 10V
Between lead,
nH
6mm (0.25in.)
from package
and center of die contact
V
GS
= 0V
V
DS
= 25V
ƒ = 1.0MHz
V
GS
= 0V, V
DS
= 1.0V, ƒ = 1.0MHz
V
GS
= 0V, V
DS
= 32V, ƒ = 1.0MHz
V
GS
= 0V, V
DS
= 0V to 32V
pF
f
Source-Drain Ratings and Characteristics
Parameter
I
S
I
SM
V
SD
t
rr
Q
rr
t
on
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode)
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
Forward Turn-On Time
Min.
–––
–––
–––
–––
–––
Typ. Max. Units
–––
–––
–––
28
34
120
l
Conditions
MOSFET symbol
showing the
integral reverse
p-n junction diode.
T
J
= 25°C, I
S
= 75A**,V
GS
= 0V
T
J
= 25°C, I
F
= 75A**, V
DD
= 20V
di/dt = 100A/μs
A
750
1.3
42
51
V
ns
nC
Ã
e
e
Intrins ic turn-on time is negligib (turn-on is d
le
ominated b LS+LD)
y
2
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IRF1404Z/S/LPbF
1000
TOP
V
GS
1000
TOP
V
GS
15V
10V
8.0V
7.0V
6.0V
5.5V
5.0V
BOTTOM 4.5V
ID, Drain-to-Source Current (A)
100
10
ID, Drain-to-Source Current (A)
15V
10V
8.0V
7.0V
6.0V
5.5V
5.0V
BOTTOM 4.5V
100
1
4.5V
20μs PULSE WIDTH
Tj = 25°C
0.1
1
10
100
4.5V
10
0.1
1
0.1
20μs PULSE WIDTH
Tj = 175°C
10
100
VDS, Drain-to-Source Voltage (V)
VDS, Drain-to-Source Voltage (V)
Fig 1.
Typical Output Characteristics
Fig 2.
Typical Output Characteristics
1000
200
T J = 175°C
Gfs, Forward Transconductance (S)
ID, Drain-to-Source Current
(
A)
T J = 25°C
160
T J = 175°C
100
120
T J = 25°C
80
10
40
1
4.0
5.0
6.0
7.0
VDS = 15V
20μs PULSE WIDTH
8.0
9.0
10.0
11.0
VDS = 15V
20μs PULSE WIDTH
0
40
80
120
160
0
ID, Drain-to-Source Current (A)
VGS , Gate-to-Source Voltage (V)
Fig 3.
Typical Transfer Characteristics
Fig 4.
Typical Forward Transconductance
Vs. Drain Current
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3
IRF1404Z/S/LPbF
8000
VGS = 0V,
f = 1 MHZ
Ciss = Cgs + Cgd, C ds SHORTED
Crss = Cgd
Coss = Cds + Cgd
20
VGS, Gate-to-Source Voltage (V)
ID= 75A
VDS= 32V
VDS= 20V
6000
16
C, Capacitance (pF)
Ciss
4000
12
8
2000
Coss
Crss
4
0
1
10
100
0
0
40
80
120
160
VDS, Drain-to-Source Voltage (V)
Q G Total Gate Charge (nC)
Fig 5.
Typical Capacitance Vs.
Drain-to-Source Voltage
Fig 6.
Typical Gate Charge Vs.
Gate-to-Source Voltage
1000.0
10000
OPERATION IN THIS AREA
LIMITED BY R DS(on)
ISD, Reverse Drain Current (A)
100.0
T J = 175°C
ID, Drain-to-Source Current (A)
1000
10.0
T J = 25°C
1.0
100
100μsec
10
Tc = 25°C
Tj = 175°C
Single Pulse
0
1
10
1msec
0.1
0.2
0.6
1.0
VGS = 0V
1.4
1.8
1
10msec
100
1000
VSD, Source-toDrain Voltage (V)
VDS , Drain-toSource Voltage (V)
Fig 7.
Typical Source-Drain Diode
Forward Voltage
Fig 8.
Maximum Safe Operating Area
4
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IRF1404Z/S/LPbF
200
RDS(on) , Drain-to-Source On Resistance
2.0
LIMITED BY PACKAGE
160
ID , Drain Current (A)
ID = 75A
VGS = 10V
80
(Normalized)
120
1.5
1.0
40
0
25
50
75
100
125
150
175
T C , Case Temperature (°C)
0.5
-60 -40 -20
0
20 40 60 80 100 120 140 160 180
T J , Junction Temperature (°C)
Fig 9.
Maximum Drain Current Vs.
Case Temperature
Fig 10.
Normalized On-Resistance
Vs. Temperature
1
D = 0.50
Thermal Response ( Z thJC )
0.20
0.1
0.10
0.05
0.02
0.01
SINGLE PULSE
( THERMAL RESPONSE )
0.01
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
0.001
0.01
0.1
0.001
1E-006
1E-005
0.0001
t1 , Rectangular Pulse Duration (sec)
Fig 11.
Maximum Effective Transient Thermal Impedance, Junction-to-Case
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