
LV/LV-A/LVX/H SERIES, DUAL MONOSTABLE MULTIVIBRATOR, PDSO16, PLASTIC, SO-16
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, SOP16,.3 |
| 针数 | 16 |
| Reach Compliance Code | unknown |
| 系列 | LV/LV-A/LVX/H |
| JESD-30 代码 | R-PDSO-G16 |
| JESD-609代码 | e4 |
| 长度 | 10.2 mm |
| 逻辑集成电路类型 | MONOSTABLE MULTIVIBRATOR |
| 湿度敏感等级 | 1 |
| 数据/时钟输入次数 | 2 |
| 功能数量 | 2 |
| 端子数量 | 16 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出极性 | COMPLEMENTARY |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度(摄氏度) | 260 |
| 电源 | 3.3 V |
| 传播延迟(tpd) | 42 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 2.5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 5.3 mm |
| SN74LV221ANS | SN54LV221AJ | SN54LV221AFK | SN54LV221AW | |
|---|---|---|---|---|
| 描述 | LV/LV-A/LVX/H SERIES, DUAL MONOSTABLE MULTIVIBRATOR, PDSO16, PLASTIC, SO-16 | LV/LV-A/LVX/H SERIES, DUAL MONOSTABLE MULTIVIBRATOR, CDIP16, CERAMIC, DIP-16 | LV/LV-A/LVX/H SERIES, DUAL MONOSTABLE MULTIVIBRATOR, CQCC20, CERAMIC, CC-20 | LV/LV-A/LVX/H SERIES, DUAL MONOSTABLE MULTIVIBRATOR, CDFP16, CERAMIC, FP-16 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | SOIC | DIP | QFN | DFP |
| 包装说明 | SOP, SOP16,.3 | DIP, | QCCN, | DFP, |
| 针数 | 16 | 16 | 20 | 16 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| 系列 | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H |
| JESD-30 代码 | R-PDSO-G16 | R-GDIP-T16 | S-CQCC-N20 | R-GDFP-F16 |
| 长度 | 10.2 mm | 19.56 mm | 8.89 mm | 10.2 mm |
| 逻辑集成电路类型 | MONOSTABLE MULTIVIBRATOR | MONOSTABLE MULTIVIBRATOR | MONOSTABLE MULTIVIBRATOR | MONOSTABLE MULTIVIBRATOR |
| 数据/时钟输入次数 | 2 | 2 | 2 | 2 |
| 功能数量 | 2 | 2 | 2 | 2 |
| 端子数量 | 16 | 16 | 20 | 16 |
| 最高工作温度 | 85 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -55 °C | -55 °C | -55 °C |
| 输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
| 封装代码 | SOP | DIP | QCCN | DFP |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | IN-LINE | CHIP CARRIER | FLATPACK |
| 传播延迟(tpd) | 42 ns | 42 ns | 42 ns | 42 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2 mm | 5.08 mm | 2.03 mm | 2.03 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2 V | 2 V | 2 V | 2 V |
| 标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 表面贴装 | YES | NO | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | MILITARY | MILITARY | MILITARY |
| 端子形式 | GULL WING | THROUGH-HOLE | NO LEAD | FLAT |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | QUAD | DUAL |
| 宽度 | 5.3 mm | 7.62 mm | 8.89 mm | 6.73 mm |
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