64MX8 DDR DRAM, 0.45ns, PBGA60, GREEN, MO-207, FBGA-60
| 参数名称 | 属性值 |
| 厂商名称 | ProMOS Technologies Inc |
| 零件包装代码 | DSBGA |
| 包装说明 | GREEN, MO-207, FBGA-60 |
| 针数 | 60 |
| Reach Compliance Code | unknown |
| 访问模式 | FOUR BANK PAGE BURST |
| 最长访问时间 | 0.45 ns |
| 其他特性 | AUTO/SELF REFRESH |
| JESD-30 代码 | R-PBGA-B60 |
| 长度 | 12.5 mm |
| 内存密度 | 536870912 bit |
| 内存集成电路类型 | DDR DRAM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端口数量 | 1 |
| 端子数量 | 60 |
| 字数 | 67108864 words |
| 字数代码 | 64000000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 64MX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TFBGA |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY, THIN PROFILE, FINE PITCH |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 最大供电电压 (Vsup) | 1.9 V |
| 最小供电电压 (Vsup) | 1.7 V |
| 标称供电电压 (Vsup) | 1.8 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | BALL |
| 端子节距 | 0.8 mm |
| 端子位置 | BOTTOM |
| 宽度 | 10 mm |
| V59C1512804QAJ-3 | V59C1512164QAJ-3 | V59C1512164QAJ-37 | V59C1512404QAJ-5 | V59C1512804QAJ-5 | V59C1512164QAJ-5 | V59C1512804QAJ-37 | V59C1512404QAJ-37 | V59C1512404QAJ-3 | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | 64MX8 DDR DRAM, 0.45ns, PBGA60, GREEN, MO-207, FBGA-60 | 32MX16 DDR DRAM, 0.45ns, PBGA84, GREEN, MO-207, FBGA-84 | 32MX16 DDR DRAM, 0.5ns, PBGA84, GREEN, MO-207, FBGA-84 | 128MX4 DDR DRAM, 0.6ns, PBGA60, GREEN, MO-207, FBGA-60 | 64MX8 DDR DRAM, 0.6ns, PBGA60, GREEN, MO-207, FBGA-60 | 32MX16 DDR DRAM, 0.6ns, PBGA84, GREEN, MO-207, FBGA-84 | 64MX8 DDR DRAM, 0.5ns, PBGA60, GREEN, MO-207, FBGA-60 | 128MX4 DDR DRAM, 0.5ns, PBGA60, GREEN, MO-207, FBGA-60 | 128MX4 DDR DRAM, 0.45ns, PBGA60, GREEN, MO-207, FBGA-60 |
| 厂商名称 | ProMOS Technologies Inc | ProMOS Technologies Inc | ProMOS Technologies Inc | ProMOS Technologies Inc | ProMOS Technologies Inc | ProMOS Technologies Inc | ProMOS Technologies Inc | ProMOS Technologies Inc | ProMOS Technologies Inc |
| 零件包装代码 | DSBGA | DSBGA | DSBGA | DSBGA | DSBGA | DSBGA | DSBGA | DSBGA | DSBGA |
| 包装说明 | GREEN, MO-207, FBGA-60 | TFBGA, | GREEN, MO-207, FBGA-84 | TFBGA, | GREEN, MO-207, FBGA-60 | TFBGA, | GREEN, MO-207, FBGA-60 | TFBGA, | GREEN, MO-207, FBGA-60 |
| 针数 | 60 | 84 | 84 | 60 | 60 | 84 | 60 | 60 | 60 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
| 访问模式 | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST |
| 最长访问时间 | 0.45 ns | 0.45 ns | 0.5 ns | 0.6 ns | 0.6 ns | 0.6 ns | 0.5 ns | 0.5 ns | 0.45 ns |
| 其他特性 | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
| JESD-30 代码 | R-PBGA-B60 | R-PBGA-B84 | R-PBGA-B84 | R-PBGA-B60 | R-PBGA-B60 | R-PBGA-B84 | R-PBGA-B60 | R-PBGA-B60 | R-PBGA-B60 |
| 长度 | 12.5 mm | 12.5 mm | 12.5 mm | 12.5 mm | 12.5 mm | 12.5 mm | 12.5 mm | 12.5 mm | 12.5 mm |
| 内存密度 | 536870912 bit | 536870912 bit | 536870912 bit | 536870912 bit | 536870912 bit | 536870912 bit | 536870912 bit | 536870912 bit | 536870912 bi |
| 内存集成电路类型 | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM |
| 内存宽度 | 8 | 16 | 16 | 4 | 8 | 16 | 8 | 4 | 4 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 60 | 84 | 84 | 60 | 60 | 84 | 60 | 60 | 60 |
| 字数 | 67108864 words | 33554432 words | 33554432 words | 134217728 words | 67108864 words | 33554432 words | 67108864 words | 134217728 words | 134217728 words |
| 字数代码 | 64000000 | 32000000 | 32000000 | 128000000 | 64000000 | 32000000 | 64000000 | 128000000 | 128000000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 64MX8 | 32MX16 | 32MX16 | 128MX4 | 64MX8 | 32MX16 | 64MX8 | 128MX4 | 128MX4 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TFBGA | TFBGA | TFBGA | TFBGA | TFBGA | TFBGA | TFBGA | TFBGA | TFBGA |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
| 最大供电电压 (Vsup) | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V |
| 最小供电电压 (Vsup) | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V |
| 标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
| 端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 宽度 | 10 mm | 10 mm | 10 mm | 10 mm | 10 mm | 10 mm | 10 mm | 10 mm | 10 mm |
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