ZBT SRAM, 256KX36, 4.2ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Rochester Electronics |
| 零件包装代码 | BGA |
| 包装说明 | 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119 |
| 针数 | 119 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A991.B.2.A |
| 最长访问时间 | 4.2 ns |
| 其他特性 | PIPELINED ARCHITECTURE |
| JESD-30 代码 | R-PBGA-B119 |
| JESD-609代码 | e0 |
| 长度 | 22 mm |
| 内存密度 | 9437184 bit |
| 内存集成电路类型 | ZBT SRAM |
| 内存宽度 | 36 |
| 功能数量 | 1 |
| 端子数量 | 119 |
| 字数 | 262144 words |
| 字数代码 | 256000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 256KX36 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | BGA |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.4 mm |
| 最大供电电压 (Vsup) | 3.465 V |
| 最小供电电压 (Vsup) | 3.135 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | BALL |
| 端子节距 | 1.27 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 14 mm |
| CY7C1354A-133BGC | CY7C1354A-133BGI | 0402WGF1620TD | 0402WGF1622BAE | 0603SAF8250B1 | 0603SAF8250CCE | 0603WGF8250BA | 0603WGF8250CD | CY7C1354A-166AC | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | ZBT SRAM, 256KX36, 4.2ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119 | ZBT SRAM, 256KX36, 4.2ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119 | Fixed Resistor, Metal Glaze/thick Film, 0.0625W, 162ohm, 50V, 1% +/-Tol, -100,100ppm/Cel, 0402, | Fixed Resistor, Metal Glaze/thick Film, 0.0625W, 16200ohm, 50V, 1% +/-Tol, -100,100ppm/Cel, 0402, | Fixed Resistor, Metal Glaze/thick Film, 0.1W, 825ohm, 50V, 1% +/-Tol, -100,100ppm/Cel, 0603, | Fixed Resistor, Metal Glaze/thick Film, 0.1W, 825ohm, 50V, 1% +/-Tol, -100,100ppm/Cel, 0603, | Fixed Resistor, Metal Glaze/thick Film, 0.0625W, 825ohm, 50V, 1% +/-Tol, -100,100ppm/Cel, 0603, | Fixed Resistor, Metal Glaze/thick Film, 0.0625W, 825ohm, 50V, 1% +/-Tol, -100,100ppm/Cel, 0603, | ZBT SRAM, 256KX36, 3.6ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 |
| Reach Compliance Code | unknown | unknown | compliant | compliant | compliant | compliant | compliant | compliant | unknown |
| 端子数量 | 119 | 119 | 2 | 2 | 2 | 2 | 2 | 2 | 100 |
| 最高工作温度 | 70 °C | 85 °C | 155 °C | 155 °C | 155 °C | 155 °C | 155 °C | 155 °C | 70 °C |
| 最低工作温度 | - | -40 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | - |
| 封装形式 | GRID ARRAY | GRID ARRAY | SMT | SMT | SMT | SMT | SMT | SMT | FLATPACK, LOW PROFILE |
| 技术 | CMOS | CMOS | METAL GLAZE/THICK FILM | METAL GLAZE/THICK FILM | METAL GLAZE/THICK FILM | METAL GLAZE/THICK FILM | METAL GLAZE/THICK FILM | METAL GLAZE/THICK FILM | CMOS |
| ECCN代码 | 3A991.B.2.A | 3A991.B.2.A | EAR99 | EAR99 | EAR99 | EAR99 | - | EAR99 | 3A991.B.2.A |
| Objectid | - | - | 7195076154 | 917471697 | 917534164 | 917534197 | 917578400 | 917578424 | - |
| 构造 | - | - | Chip | Chip | Chip | Chip | Chip | Chip | - |
| 封装高度 | - | - | 0.35 mm | 0.35 mm | 0.45 mm | 0.45 mm | 0.45 mm | 0.45 mm | - |
| 封装长度 | - | - | 1 mm | 1 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | - |
| 封装宽度 | - | - | 0.5 mm | 0.5 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | - |
| 额定功率耗散 (P) | - | - | 0.0625 W | 0.0625 W | 0.1 W | 0.1 W | 0.0625 W | 0.0625 W | - |
| 电阻 | - | - | 162 Ω | 16200 Ω | 825 Ω | 825 Ω | 825 Ω | 825 Ω | - |
| 电阻器类型 | - | - | FIXED RESISTOR | FIXED RESISTOR | FIXED RESISTOR | FIXED RESISTOR | FIXED RESISTOR | FIXED RESISTOR | - |
| 尺寸代码 | - | - | 0402 | 0402 | 0603 | 0603 | 0603 | 0603 | - |
| 温度系数 | - | - | 100 ppm/°C | 100 ppm/°C | 100 ppm/°C | 100 ppm/°C | 100 ppm/°C | 100 ppm/°C | - |
| 容差 | - | - | 1% | 1% | 1% | 1% | 1% | 1% | - |
| 工作电压 | - | - | 50 V | 50 V | 50 V | 50 V | 50 V | 50 V | - |
| 系列 | - | - | - | 0402(1/16W,F TOL) | 0603(1/10WS,F TOL) | 0603(1/10WS,F TOL) | 0603(1/16W,F TOL) | 0603(1/16W,F TOL) | - |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
