512Mb: x16, x32 Mobile LPDDR SDRAM
Features
Mobile Low-Power DDR SDRAM
MT46H32M16LF – 8 Meg x 16 x 4 banks
MT46H16M32LF – 4 Meg x 32 x 4 banks
MT46H16M32LG – 4 Meg x 32 x 4 banks
Features
• V
DD
/V
DDQ
= 1.70–1.95V
• Bidirectional data strobe per byte of data (DQS)
• Internal, pipelined double data rate (DDR)
architecture; two data accesses per clock cycle
• Differential clock inputs (CK and CK#)
• Commands entered on each positive CK edge
• DQS edge-aligned with data for READs; center-
aligned with data for WRITEs
• 4 internal banks for concurrent operation
• Data masks (DM) for masking write data; one mask
per byte
• Programmable burst lengths (BL): 2, 4, 8, or 16
• Concurrent auto precharge option is supported
• Auto refresh and self refresh modes
• 1.8V LVCMOS-compatible inputs
• Temperature-compensated self refresh (TCSR)
• Partial-array self refresh (PASR)
• Deep power-down (DPD)
• Status read register (SRR)
• Selectable output drive strength (DS)
• Clock stop capability
• 64ms refresh, 32ms for automotive temperature
Table 1: Key Timing Parameters (CL = 3)
Speed Grade
-5
-54
-6
-75
Clock Rate
200 MHz
185 MHz
166 MHz
133 MHz
Access Time
5.0ns
5.0ns
5.0ns
6.0ns
Options
• V
DD
/V
DDQ
– 1.8V/1.8V
• Configuration
– 32 Meg x 16 (8 Meg x 16 x 4 banks)
– 16 Meg x 32 (4 Meg x 32 x 4 banks)
• Addressing
– JEDEC-standard addressing
– Reduced page size
1
• Plastic "green" package
– 60-ball VFBGA (8mm x 9mm)
2
– 90-ball VFBGA (8mm x 13mm)
3
• Timing – cycle time
– 5ns @ CL = 3 (200 MHz)
– 5.4ns @ CL = 3 (185 MHz)
– 6ns @ CL = 3 (166 MHz)
– 7.5ns @ CL = 3 (133 MHz)
• Power
– Standard I
DD2
/I
DD6
• Operating temperature range
– Commercial (0˚ to +70˚C)
– Industrial (–40˚C to +85˚C)
– Automotive (–40˚C to +105˚C)
• Design revision
Notes:
Marking
H
32M16
16M32
LF
LG
BF
B5
-5
-54
-6
-75
None
None
IT
AT
:C
1. Contact factory for availability.
2. Only available for x16 configuration.
3. Only available for x32 configuration.
PDF: 09005aef83dd2b3e
t67m_512mb_mobile_lpddr.pdf - Rev. H 06/13 EN
1
Products and specifications discussed herein are subject to change by Micron without notice.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2009 Micron Technology, Inc. All rights reserved.
512Mb: x16, x32 Mobile LPDDR SDRAM
Features
Table 2: Configuration Addressing
Architecture
Configuration
Refresh count
Row addressing
Column addressing
32 Meg x 16
8 Meg x 16 x 4 banks
8K
8K A[12:0]
1K A[9:0]
16 Meg x 32
4 Meg x 32 x 4 banks
8K
8K A[12:0]
512 A[8:0]
Reduced Page Size
16 Meg x 32
4 Meg x 32 x 4 banks
8K
16K A[13:0]
256 A[7:0]
Figure 1: 512Mb Mobile LPDDR Part Numbering
MT 46
Micron Technology
Product Family
46 = Mobile LPDDR
H
32M16 LF BF -6
IT
:C
Design Revision
:C = Third generation
Operating Temperature
Blank = Commercial (0°C to +70°C)
IT = Industrial (–40°C to +85°C)
AT = Automotive (–40°C to +105°C)
Operating Voltage
H = 1.8/1.8V
Configuration
32 Meg x 16
16 Meg x 32
Power
Blank = Standard I
DD2
/I
DD6
Cycle Time (CL = 3)
Addressing
LF = JEDEC-standard
LG = Reduced page size
-5 = 5ns
t
CK
-54 = 5.4ns
t
CK
-6 = 6ns
t
CK
-75 = 7.5ns
t
CK
Package Codes
BF = 60-ball (8mm x 9mm) VFBGA, “green”
B5 = 90-ball (8mm x 13mm) VFBGA, “green”
FBGA Part Marking Decoder
Due to space limitations, FBGA-packaged components have an abbreviated part marking that is different from the
part number. Micron’s FBGA part marking decoder is available at
www.micron.com/decoder.
PDF: 09005aef83dd2b3e
t67m_512mb_mobile_lpddr.pdf - Rev. H 06/13 EN
2
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2009 Micron Technology, Inc. All rights reserved.
512Mb: x16, x32 Mobile LPDDR SDRAM
Features
Contents
General Description ......................................................................................................................................... 8
Functional Block Diagrams ............................................................................................................................... 9
Ball Assignments ............................................................................................................................................ 11
Ball Descriptions ............................................................................................................................................ 13
Package Dimensions ....................................................................................................................................... 15
Electrical Specifications .................................................................................................................................. 17
Electrical Specifications – I
DD
Parameters ........................................................................................................ 20
Electrical Specifications – AC Operating Conditions ......................................................................................... 26
Output Drive Characteristics ........................................................................................................................... 31
Functional Description ................................................................................................................................... 34
Commands .................................................................................................................................................... 35
DESELECT ................................................................................................................................................. 36
NO OPERATION ......................................................................................................................................... 36
LOAD MODE REGISTER ............................................................................................................................. 36
ACTIVE ...................................................................................................................................................... 36
READ ......................................................................................................................................................... 37
WRITE ....................................................................................................................................................... 38
PRECHARGE .............................................................................................................................................. 39
BURST TERMINATE ................................................................................................................................... 40
AUTO REFRESH ......................................................................................................................................... 40
SELF REFRESH ........................................................................................................................................... 41
DEEP POWER-DOWN ................................................................................................................................. 41
Truth Tables ................................................................................................................................................... 42
State Diagram ................................................................................................................................................ 47
Initialization .................................................................................................................................................. 48
Standard Mode Register .................................................................................................................................. 51
Burst Length .............................................................................................................................................. 52
Burst Type .................................................................................................................................................. 52
CAS Latency ............................................................................................................................................... 53
Operating Mode ......................................................................................................................................... 54
Extended Mode Register ................................................................................................................................. 55
Temperature-Compensated Self Refresh ...................................................................................................... 55
Partial-Array Self Refresh ............................................................................................................................ 56
Output Drive Strength ................................................................................................................................ 56
Status Read Register ....................................................................................................................................... 57
Bank/Row Activation ...................................................................................................................................... 59
READ Operation ............................................................................................................................................. 60
WRITE Operation ........................................................................................................................................... 71
PRECHARGE Operation .................................................................................................................................. 83
Auto Precharge ............................................................................................................................................... 83
Concurrent Auto Precharge ......................................................................................................................... 84
AUTO REFRESH Operation ............................................................................................................................. 89
SELF REFRESH Operation ............................................................................................................................... 90
Power-Down .................................................................................................................................................. 91
Deep Power-Down ..................................................................................................................................... 93
Clock Change Frequency ................................................................................................................................ 95
Revision History ............................................................................................................................................. 96
Rev. H – 06/13 ............................................................................................................................................. 96
Rev. G – 10/11 ............................................................................................................................................. 96
Rev. F – 10/11 ............................................................................................................................................. 96
PDF: 09005aef83dd2b3e
t67m_512mb_mobile_lpddr.pdf - Rev. H 06/13 EN
3
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2009 Micron Technology, Inc. All rights reserved.
512Mb: x16, x32 Mobile LPDDR SDRAM
Features
Rev. E – 6/11 ...............................................................................................................................................
Rev. D – 4/11 ..............................................................................................................................................
Rev. C – 1/11 ...............................................................................................................................................
Rev. B – 02/10 .............................................................................................................................................
Rev. A – 01/10 .............................................................................................................................................
96
96
96
96
96
PDF: 09005aef83dd2b3e
t67m_512mb_mobile_lpddr.pdf - Rev. H 06/13 EN
4
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2009 Micron Technology, Inc. All rights reserved.
512Mb: x16, x32 Mobile LPDDR SDRAM
Features
List of Figures
Figure 1: 512Mb Mobile LPDDR Part Numbering .............................................................................................. 2
Figure 2: Functional Block Diagram (x16) ......................................................................................................... 9
Figure 3: Functional Block Diagram (x32) ....................................................................................................... 10
Figure 4: 60-Ball VFBGA – Top View, x16 only .................................................................................................. 11
Figure 5: 90-Ball VFBGA – Top View, x32 only .................................................................................................. 12
Figure 6: 60-Ball VFBGA (8mm x 9mm), Package Code: BF .............................................................................. 15
Figure 7: 90-Ball VFBGA (8mm x 13mm), Package Code: B5 ............................................................................. 16
Figure 8: Typical Self Refresh Current vs. Temperature .................................................................................... 25
Figure 9: ACTIVE Command .......................................................................................................................... 37
Figure 10: READ Command ........................................................................................................................... 38
Figure 11: WRITE Command ......................................................................................................................... 39
Figure 12: PRECHARGE Command ................................................................................................................ 40
Figure 13: DEEP POWER-DOWN Command ................................................................................................... 41
Figure 14: Simplified State Diagram ............................................................................................................... 47
Figure 15: Initialize and Load Mode Registers ................................................................................................. 49
Figure 16: Alternate Initialization with CKE LOW ............................................................................................ 50
Figure 17: Standard Mode Register Definition ................................................................................................. 51
Figure 18: CAS Latency .................................................................................................................................. 54
Figure 19: Extended Mode Register ................................................................................................................ 55
Figure 20: Status Read Register Timing ........................................................................................................... 57
Figure 21: Status Register Definition .............................................................................................................. 58
Figure 22: READ Burst ................................................................................................................................... 61
Figure 23: Consecutive READ Bursts .............................................................................................................. 62
Figure 24: Nonconsecutive READ Bursts ........................................................................................................ 63
Figure 25: Random Read Accesses .................................................................................................................. 64
Figure 26: Terminating a READ Burst ............................................................................................................. 65
Figure 27: READ-to-WRITE ............................................................................................................................ 66
Figure 28: READ-to-PRECHARGE .................................................................................................................. 67
Figure 29: Data Output Timing –
t
DQSQ,
t
QH, and Data Valid Window (x16) .................................................... 68
Figure 30: Data Output Timing –
t
DQSQ,
t
QH, and Data Valid Window (x32) .................................................... 69
Figure 31: Data Output Timing –
t
AC and
t
DQSCK .......................................................................................... 70
Figure 32: Data Input Timing ......................................................................................................................... 72
Figure 33: Write – DM Operation .................................................................................................................... 73
Figure 34: WRITE Burst ................................................................................................................................. 74
Figure 35: Consecutive WRITE-to-WRITE ....................................................................................................... 75
Figure 36: Nonconsecutive WRITE-to-WRITE ................................................................................................. 75
Figure 37: Random WRITE Cycles .................................................................................................................. 76
Figure 38: WRITE-to-READ – Uninterrupting ................................................................................................. 77
Figure 39: WRITE-to-READ – Interrupting ...................................................................................................... 78
Figure 40: WRITE-to-READ – Odd Number of Data, Interrupting ..................................................................... 79
Figure 41: WRITE-to-PRECHARGE – Uninterrupting ....................................................................................... 80
Figure 42: WRITE-to-PRECHARGE – Interrupting ........................................................................................... 81
Figure 43: WRITE-to-PRECHARGE – Odd Number of Data, Interrupting .......................................................... 82
Figure 44: Bank Read – With Auto Precharge ................................................................................................... 85
Figure 45: Bank Read – Without Auto Precharge .............................................................................................. 86
Figure 46: Bank Write – With Auto Precharge .................................................................................................. 87
Figure 47: Bank Write – Without Auto Precharge ............................................................................................. 88
Figure 48: Auto Refresh Mode ........................................................................................................................ 89
Figure 49: Self Refresh Mode .......................................................................................................................... 91
Figure 50: Power-Down Entry (in Active or Precharge Mode) ........................................................................... 92
PDF: 09005aef83dd2b3e
t67m_512mb_mobile_lpddr.pdf - Rev. H 06/13 EN
5
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2009 Micron Technology, Inc. All rights reserved.
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