UVPROM, 64KX8, 75ns, CMOS, CDIP28, 0.300 INCH, WINDOWED, CERDIP-28
参数名称 | 属性值 |
厂商名称 | Cypress(赛普拉斯) |
零件包装代码 | DIP |
包装说明 | DIP, |
针数 | 28 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
最长访问时间 | 75 ns |
其他特性 | FAST COLUMN ACCESS PROM |
JESD-30 代码 | R-GDIP-T28 |
内存密度 | 524288 bit |
内存集成电路类型 | UVPROM |
内存宽度 | 8 |
功能数量 | 1 |
端子数量 | 28 |
字数 | 65536 words |
字数代码 | 64000 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 64KX8 |
输出特性 | 3-STATE |
封装主体材料 | CERAMIC, GLASS-SEALED |
封装代码 | DIP |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
并行/串行 | PARALLEL |
认证状态 | Not Qualified |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子形式 | THROUGH-HOLE |
端子位置 | DUAL |
CY7C289-75WI | CY7C285-65PI | CY7C285-85PI | CY7C285-75PI | CY7C289-85WI | CY7C285-85WI | CY7C289-65WI | CY7C285-65WI | CY7C285-75WI | |
---|---|---|---|---|---|---|---|---|---|
描述 | UVPROM, 64KX8, 75ns, CMOS, CDIP28, 0.300 INCH, WINDOWED, CERDIP-28 | OTP ROM, 64KX8, 65ns, CMOS, PDIP28, 0.300 INCH, SLIM, PLASTIC, DIP-28 | OTP ROM, 64KX8, 85ns, CMOS, PDIP28, 0.300 INCH, SLIM, PLASTIC, DIP-28 | OTP ROM, 64KX8, 75ns, CMOS, PDIP28, 0.300 INCH, SLIM, PLASTIC, DIP-28 | UVPROM, 64KX8, 85ns, CMOS, CDIP28, 0.300 INCH, WINDOWED, CERDIP-28 | UVPROM, 64KX8, 85ns, CMOS, CDIP28, 0.300 INCH, WINDOWED, CERDIP-28 | UVPROM, 64KX8, 65ns, CMOS, CDIP28, 0.300 INCH, WINDOWED, CERDIP-28 | UVPROM, 64KX8, 65ns, CMOS, CDIP28, 0.300 INCH, WINDOWED, CERDIP-28 | UVPROM, 64KX8, 75ns, CMOS, CDIP28, 0.300 INCH, WINDOWED, CERDIP-28 |
零件包装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
包装说明 | DIP, | DIP, | DIP, | DIP, | DIP, | DIP, | DIP, | DIP, | DIP, |
针数 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最长访问时间 | 75 ns | 65 ns | 85 ns | 75 ns | 85 ns | 85 ns | 65 ns | 65 ns | 75 ns |
其他特性 | FAST COLUMN ACCESS PROM | FAST COLUMN ACCESS PROM | FAST COLUMN ACCESS PROM | FAST COLUMN ACCESS PROM | FAST COLUMN ACCESS PROM | FAST COLUMN ACCESS PROM | FAST COLUMN ACCESS PROM | FAST COLUMN ACCESS PROM | FAST COLUMN ACCESS PROM |
JESD-30 代码 | R-GDIP-T28 | R-PDIP-T28 | R-PDIP-T28 | R-PDIP-T28 | R-GDIP-T28 | R-GDIP-T28 | R-GDIP-T28 | R-GDIP-T28 | R-GDIP-T28 |
内存密度 | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit |
内存集成电路类型 | UVPROM | OTP ROM | OTP ROM | OTP ROM | UVPROM | UVPROM | UVPROM | UVPROM | UVPROM |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
字数 | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words |
字数代码 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 |
工作模式 | SYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | SYNCHRONOUS | ASYNCHRONOUS | SYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
组织 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
封装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
厂商名称 | Cypress(赛普拉斯) | - | - | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) |
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