GS8342R08/09/18/36AE-250/200/167
165-Bump BGA
Commercial Temp
Industrial Temp
Features
• Simultaneous Read and Write SigmaDDR-II™ Interface
• Common I/O bus
• JEDEC-standard pinout and package
• Double Data Rate interface
• Byte Write (x36, x18, and x9) and Nybble Write (x8) function
• Burst of 4 Read and Write
• 1.8 V +100/–100 mV core power supply
• 1.5 V or 1.8 V HSTL Interface
• Pipelined read operation with self-timed Late Write
• Fully coherent read and write pipelines
• ZQ pin for programmable output drive strength
• IEEE 1149.1 JTAG-compliant Boundary Scan
• 165-bump, 15 mm x 17 mm, 1 mm bump pitch BGA package
• RoHS-compliant 165-bump BGA package available
• Pin-compatible with present 9Mb, 18Mb, 72Mb and 144Mb
devices
36Mb SigmaDDR-II™
Burst of 4 SRAM
250 MHz–167 MHz
1.8 V V
DD
1.8 V and 1.5 V I/O
Clocking and Addressing Schemes
The GS8342R08/09/18/36AE SigmaDDR-II SRAMs are
synchronous devices. They employ two input register clock
inputs, K and K. K and K are independent single-ended clock
Re
co
m
me
nd
ed
for
The GS8342R08/09/18/36AE are built in compliance with the
SigmaDDR-II SRAM pinout standard for Common I/O
synchronous SRAMs. They are 37,748,736-bit (36Mb)
SRAMs. The GS8342R08/09/18/36AE SigmaDDR-II SRAMs
are just one element in a family of low power, low voltage
HSTL I/O SRAMs designed to operate at the speeds needed to
implement economical high performance networking systems.
Ne
w
Parameter Synopsis
-250
tKHKH
tKHQV
4.0 ns
0.45 ns
-200
5.0 ns
0.45 ns
-167
6.0 ns
0.5 ns
Rev: 1.07 8/2012
No
t
1/34
De
sig
SigmaDDR-II™ Family Overview
n—
Di
sco
nt
inu
ed
Pr
od
u
inputs, not differential inputs to a single differential clock input
buffer. The device also allows the user to manipulate the
output register clock inputs quasi independently with the C and
C clock inputs. C and C are also independent single-ended
clock inputs, not differential inputs. If the C clocks are tied
high, the K clocks are routed internally to fire the output
registers instead.
Each internal read and write operation in a SigmaDDR-II B4
RAM is four times wider than the device I/O bus. An input
data bus de-multiplexer is used to accumulate incoming data
before it is simultaneously written to the memory array. An
output data multiplexer is used to capture the data produced
from a single memory array read and then route it to the
appropriate output drivers as needed.
When a new address is loaded into a x18 or x36 version of the
part, A0 and A1 are used to initialize the pointers that control
the data multiplexer / de-multiplexer so the RAM can perform
"critical word first" operations. From an external address point
of view, regardless of the starting point, the data transfers
always follow the same linear sequence {00, 01, 10, 11} or
{01, 10, 11, 00} or {10, 11, 00, 01} or {11, 00, 01, 10} (where
the digits shown represent A1, A0).
Unlike the x18 and x36 versions, the input and output data
multiplexers of the x8 and x9 versions are not preset by
address inputs and therefore do not allow "critical word first"
operations. The address fields of the x8 and x9 SigmaDDR-II
B4 RAMs are two address pins less than the advertised index
depth (e.g., the 4M x 8 has a 1M addressable index, and A0 and
A1 are not accessible address pins).
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
ct
© 2006, GSI Technology
GS8342R08/09/18/36AE-250/200/167
4M x 9 SigmaDDR-II SRAM—Top View
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
CQ
NC
NC
NC
NC
NC
NC
Doff
NC
NC
NC
NC
NC
NC
TDO
2
NC
NC
NC
NC
NC
NC
NC
V
REF
NC
NC
DQ7
NC
NC
NC
TCK
3
SA
NC
NC
NC
DQ5
NC
DQ6
V
DDQ
NC
NC
NC
NC
NC
DQ8
SA
4
R/W
SA
V
SS
V
SS
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
SS
V
SS
SA
5
NC
NC
SA
V
SS
V
SS
V
DD
V
DD
V
DD
V
DD
V
DD
V
SS
V
SS
SA
6
K
K
7
NC
BW
SA
8
LD
SA
9
SA
10
SA
NC
NC
NC
NC
NC
NC
V
REF
DQ2
NC
NC
NC
NC
NC
TMS
11
CQ
DQ4
NC
NC
DQ3
NC
NC
ZQ
NC
NC
DQ1
NC
NC
DQ0
TDI
De
sig
Ne
w
me
nd
ed
for
SA
SA
SA
11 x 15 Bump BGA—13 x 15 mm
2
Body—1 mm Bump Pitch
Re
co
m
Notes:
1. Unlike the x36 and x18 versions of this device, the x8 and x9 versions do not give the user access to A0 and A1. SA0 and SA1 are set to
0 at the beginning of each access.
2. A2, A7, and B5 are reserved for future use as an address pin for higher density devices. They are not connected to the die on this device.
They may be left floating or be treated as an MCL pin (Must Connect Low) to assure the site will successfully accomodate a future, higher
density device. These pins may be marked as V
SS
, NC, or MCL by some vendors of compatible SRAMs.
No
t
Expansion Address
A2
A7
B5
72Mb
144Mb
288Mb
Rev: 1.07 8/2012
4/34
n—
Di
sco
nt
inu
ed
Pr
od
u
NC
V
SS
NC
NC
NC
NC
NC
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
SA
C
C
V
SS
V
SS
V
SS
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
SS
V
SS
SA
SA
V
DD
V
DD
V
DD
V
DD
V
DD
V
SS
V
SS
SA
SA
SA
NC
NC
NC
NC
NC
NC
SA
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
ct
NC
V
DDQ
© 2006, GSI Technology
GS8342R08/09/18/36AE-250/200/167
4M x 8 SigmaDDR-II SRAM—Top View
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
CQ
NC
NC
NC
NC
NC
NC
Doff
NC
NC
NC
NC
NC
NC
TDO
2
NC
NC
NC
NC
NC
NC
NC
V
REF
NC
NC
DQ6
NC
NC
NC
TCK
3
SA
NC
NC
NC
DQ4
NC
DQ5
V
DDQ
NC
NC
NC
NC
NC
DQ7
SA
4
R/W
SA
V
SS
V
SS
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
SS
V
SS
SA
5
NW1
NC
SA
V
SS
V
SS
V
DD
V
DD
V
DD
V
DD
V
DD
V
SS
V
SS
SA
6
K
K
7
NC
NW0
SA
8
LD
SA
9
SA
10
SA
NC
NC
NC
NC
NC
NC
V
REF
DQ1
NC
NC
NC
NC
NC
TMS
11
CQ
DQ3
NC
NC
DQ2
NC
NC
ZQ
NC
NC
DQ0
NC
NC
NC
TDI
De
sig
Ne
w
me
nd
ed
for
SA
SA
SA
11 x 15 Bump BGA—13 x 15 mm
2
Body—1 mm Bump Pitch
Notes:
1. Unlike the x36 and x18 versions of this device, the x8 and x9 versions do not give the user access to A0 and A1. SA0 and SA1 are set to
0 at the beginning of each access.
2. NW0 controls writes to DQ0:DQ3; NW1 controls writes to DQ4:DQ7
3. A2, A7, and B5 are reserved for future use as an address pin for higher density devices. They are not connected to the die on this device.
They may be left floating or be treated as an MCL pin (Must Connect Low) to assure the site will successfully accomodate a future, higher
density device. These pins may be marked as V
SS
, NC, or MCL by some vendors of compatible SRAMs.
No
t
Re
co
m
Expansion Address
A2
A7
B5
72Mb
144Mb
288Mb
Rev: 1.07 8/2012
5/34
n—
Di
sco
nt
inu
ed
Pr
od
u
NC
V
SS
NC
NC
NC
NC
NC
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
SA
C
C
V
SS
V
SS
V
SS
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
SS
V
SS
SA
SA
V
DD
V
DD
V
DD
V
DD
V
DD
V
SS
V
SS
SA
SA
SA
NC
NC
NC
NC
NC
NC
SA
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
ct
NC
V
DDQ
© 2006, GSI Technology
聊聊、笑笑、闹闹
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
