32-BIT, FLASH, 204MHz, RISC MICROCONTROLLER, PBGA180, SOT570-3, TFBGA-180
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | NXP(恩智浦) |
包装说明 | SOT570-3, TFBGA-180 |
Reach Compliance Code | compliant |
具有ADC | YES |
地址总线宽度 | 24 |
位大小 | 32 |
最大时钟频率 | 25 MHz |
DAC 通道 | YES |
DMA 通道 | YES |
外部数据总线宽度 | 32 |
JESD-30 代码 | S-PBGA-B180 |
JESD-609代码 | e1 |
长度 | 12 mm |
湿度敏感等级 | 3 |
I/O 线路数量 | 118 |
端子数量 | 180 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
PWM 通道 | YES |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TFBGA |
封装形状 | SQUARE |
封装形式 | GRID ARRAY, THIN PROFILE, FINE PITCH |
ROM可编程性 | FLASH |
座面最大高度 | 1.2 mm |
速度 | 204 MHz |
最大供电电压 | 3.6 V |
最小供电电压 | 2.2 V |
标称供电电压 | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式 | BALL |
端子节距 | 0.8 mm |
端子位置 | BOTTOM |
宽度 | 12 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC |
935296292551 | 935296291518 | 935306617551 | 935296293551 | 935294171551 | 935294172551 | 935294169551 | 935296292518 | |
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描述 | 32-BIT, FLASH, 204MHz, RISC MICROCONTROLLER, PBGA180, SOT570-3, TFBGA-180 | 32-BIT, FLASH, 204MHz, RISC MICROCONTROLLER, PBGA100, 9 X 9 MM, 0.70 MM HEIGHT, PLASTIC, SOT926-1, TFBGA-100 | 32-BIT, FLASH, 204MHz, RISC MICROCONTROLLER, PBGA180, SOT570-3, TFBGA-180 | 32-BIT, FLASH, 204MHz, RISC MICROCONTROLLER, PBGA180, SOT570-3, TFBGA-180 | 32-BIT, FLASH, 204MHz, RISC MICROCONTROLLER, PBGA100, 9 X 9 MM, 0.70 MM HEIGHT, PLASTIC, SOT926-1, TFBGA-100 | 32-BIT, FLASH, 204MHz, RISC MICROCONTROLLER, PBGA256, 17 X 17 MM, 1 MM HEIGHT, PLASTIC, MO-192, SOT740-2, LBGA-256 | 32-BIT, FLASH, 204MHz, RISC MICROCONTROLLER, PBGA100, 9 X 9 MM, 0.70 MM HEIGHT, PLASTIC, SOT926-1, TFBGA-100 | 32-BIT, FLASH, 204MHz, RISC MICROCONTROLLER, PBGA180, SOT570-3, TFBGA-180 |
包装说明 | SOT570-3, TFBGA-180 | TFBGA, | SOT570-3, TFBGA-180 | TFBGA, | 9 X 9 MM, 0.70 MM HEIGHT, PLASTIC, SOT926-1, TFBGA-100 | 17 X 17 MM, 1 MM HEIGHT, PLASTIC, MO-192, SOT740-2, LBGA-256 | 9 X 9 MM, 0.70 MM HEIGHT, PLASTIC, SOT926-1, TFBGA-100 | SOT570-3, TFBGA-180 |
Reach Compliance Code | compliant | unknow | unknown | unknown | unknown | unknown | unknown | compliant |
具有ADC | YES | YES | YES | YES | YES | YES | YES | YES |
地址总线宽度 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
位大小 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
最大时钟频率 | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
DAC 通道 | YES | YES | YES | YES | YES | YES | YES | YES |
DMA 通道 | YES | YES | YES | YES | YES | YES | YES | YES |
外部数据总线宽度 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
JESD-30 代码 | S-PBGA-B180 | S-PBGA-B100 | S-PBGA-B180 | S-PBGA-B180 | S-PBGA-B100 | S-PBGA-B256 | S-PBGA-B100 | S-PBGA-B180 |
长度 | 12 mm | 9 mm | 12 mm | 12 mm | 9 mm | 17 mm | 9 mm | 12 mm |
I/O 线路数量 | 118 | 49 | 118 | 118 | 49 | 164 | 49 | 118 |
端子数量 | 180 | 100 | 180 | 180 | 100 | 256 | 100 | 180 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
PWM 通道 | YES | NO | YES | YES | NO | YES | NO | YES |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TFBGA | TFBGA | TFBGA | TFBGA | TFBGA | LBGA | TFBGA | TFBGA |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH |
ROM可编程性 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.55 mm | 1.2 mm | 1.2 mm |
速度 | 204 MHz | 204 MHz | 204 MHz | 204 MHz | 204 MHz | 204 MHz | 204 MHz | 204 MHz |
最大供电电压 | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 | 2.2 V | 2.2 V | 2.2 V | 2.2 V | 2.2 V | 2.2 V | 2.2 V | 2.2 V |
标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
端子节距 | 0.8 mm | 0.5 mm | 0.8 mm | 0.8 mm | 0.5 mm | 1 mm | 0.5 mm | 0.8 mm |
端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
宽度 | 12 mm | 9 mm | 12 mm | 12 mm | 9 mm | 17 mm | 9 mm | 12 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC |
厂商名称 | NXP(恩智浦) | - | NXP(恩智浦) | NXP(恩智浦) | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
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