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LCMXO2280E-4M100I

产品描述Flash PLD, PBGA100, 8 X 8 MM, CSBGA-100
产品类别可编程逻辑器件    可编程逻辑   
文件大小917KB,共74页
制造商Lattice(莱迪斯)
官网地址http://www.latticesemi.com
下载文档 详细参数 选型对比 全文预览

LCMXO2280E-4M100I概述

Flash PLD, PBGA100, 8 X 8 MM, CSBGA-100

LCMXO2280E-4M100I规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称Lattice(莱迪斯)
零件包装代码BGA
包装说明8 X 8 MM, CSBGA-100
针数100
Reach Compliance Codecompliant
ECCN代码EAR99
JESD-30 代码S-PBGA-B100
JESD-609代码e0
长度8 mm
湿度敏感等级3
专用输入次数6
I/O 线路数量73
端子数量100
组织6 DEDICATED INPUTS, 73 I/O
输出函数MACROCELL
封装主体材料PLASTIC/EPOXY
封装代码LFBGA
封装形状SQUARE
封装形式GRID ARRAY, LOW PROFILE, FINE PITCH
峰值回流温度(摄氏度)240
可编程逻辑类型FLASH PLD
认证状态Not Qualified
座面最大高度1.35 mm
最大供电电压1.26 V
最小供电电压1.14 V
标称供电电压1.2 V
表面贴装YES
端子面层Tin/Lead (Sn/Pb)
端子形式BALL
端子节距0.5 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间30
宽度8 mm

LCMXO2280E-4M100I文档预览

MachXO Family Data Sheet
Version 01.0, July 2005
MachXO Family Data Sheet
Introduction
July 2005
Advance Data Sheet
Features
Non-volatile, Infinitely Reconfigurable
• Instant-on – powers up in microseconds
• Single chip, no external configuration memory
required
• Excellent design security, no bit stream to
intercept
• Reconfigure SRAM based logic in milliseconds
• SRAM and non-volatile memory programmable
through JTAG port
• Supports background programming of
non-volatile memory
Flexible I/O Buffer
• Programmable sysIO™ buffer supports wide
range of interfaces:
LVCMOS 3.3/2.5/1.8/1.5/1.2
LVTTL
PCI
LVDS, Bus-LVDS, LVPECL, RSDS
sysCLOCK™ PLLs
• Up to two analog PLLs per device
• Clock multiply, divide and phase shifting
System Level Support
• IEEE Standard 1149.1 Boundary Scan, plus
ispTRACY™ internal logic analyzer capability
• Onboard oscillator
• Devices operate with 3.3V, 2.5V, 1.8V or 1.2V
power supply
• IEEE 1532 compliant in-system programming
Sleep Mode
• Allows up to 100x static current reduction
TransFR™ Reconfiguration (TFR)
• In-field logic update while system operates
High I/O to Logic Density
256 to 2280 LUT4s
73 to 271 I/Os with extensive package options
Density migration supported
Lead free/RoHS compliant packaging
Introduction
The MachXO is optimized to meet the requirements of
applications traditionally addressed by CPLDs and low
capacity FPGAs: glue logic, bus bridging, bus interfac-
ing, power-up control and control logic. The devices do
this by bringing together on a single chip the best fea-
tures of CPLD and FPGA devices.
Embedded and Distributed Memory
• Up to 27 Kbits sysMEM™ Embedded Block RAM
• Up to 7.7 Kbits distributed RAM
• Dedicated FIFO control logic
Table 1-1. MachXO Family Selection Guide
Device
LUTs
Dist. RAM (Kbits)
EBR SRAM (Bits)
Number of EBR SRAM Blocks (9 Kbits)
V
CC
Voltage
Number of PLLs
Max. I/O
Packages
100-pin TQFP (14x14 mm)
144-pin TQFP (20x20 mm)
100-ball csBGA (8x8 mm)
132-ball csBGA (8x8 mm)
256-ball fpBGA/ftBGA (17x17 mm)
324-ball ftBGA (19x19 mm)
78
78
LCMXO256
256
2.0
0
0
LCMXO640
640
6.1
0
0
1.2/1.8/2.5/3.3V
0
159
74
113
74
101
159
LCMXO1200
1200
6.4
9216
1
1.2/1.8/2.5/3.3V
1
211
73
113
101
211
LCMXO2280
2280
7.7
27648
3
1.2/1.8/2.5/3.3V
2
271
73
113
101
211
271
1.2/1.8/2.5/3.3V
0
78
© 2005 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand
or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
www.latticesemi.com
1-1
Introduction_01.0
Lattice Semiconductor
Introduction
MachXO Family Data Sheet
The devices use look-up tables (LUTs) and embedded block memories traditionally associated with FPGAs for flex-
ible and efficient logic implementation. Through non-volatile technology the devices provide the single-chip, high-
security, instant-on capabilities traditionally associated with CPLDs. Finally, advanced process technology and
careful design provides the high pin-to-pin performance also associated with CPLDs.
The ispLEVER
®
design tools from Lattice allow complex designs to be efficiently implemented using the MachXO
family of devices. Synthesis library support for MachXO is available for popular logic synthesis tools. The
ispLEVER tools use the synthesis tool output along with the constraints from its floor planning tools to place and
route the design in the MachXO device. The ispLEVER tool extracts the timing from the routing and back-annotates
it into the design for timing verification.
1-2
MachXO Family Data Sheet
Architecture
July 2005
Advance Data Sheet
Architecture Overview
The MachXO family architecture contains an array of logic blocks surrounded by Programmable I/O (PIO). Some
devices in this family have sysCLOCK PLLs and blocks of sysMEM™ Embedded Block RAM (EBRs). Figures 2-1,
2-2 and 2-3 show the block diagrams of the various family members.
The logic blocks are arranged in a two-dimensional grid with rows and columns. The EBR blocks are arranged in a
column to the left of the logic array. The PIOs are located at the periphery of the device, arranged into banks. The
PIOs utilize a flexible I/O buffer referred to as a sysIO interface that supports operation with a variety of interface
standards. The blocks are connected with many vertical and horizontal routing channel resources. The place and
route software tool automatically allocates these routing resources.
There are two kinds of logic blocks, the Programmable Functional Unit (PFU) and the Programmable Functional
unit without RAM/ROM (PFF). The PFU contains the building blocks for logic, arithmetic, RAM, ROM and register
functions. The PFF block contains building blocks for logic, arithmetic and ROM functions. Both PFU and PFF
blocks are optimized for flexibility, allowing complex designs to be implemented quickly and effectively. Logic blocks
are arranged in a two-dimensional array. Only one type of block is used per row.
In the MachXO family, the number of banks vary by device. There are different types of I/O Buffers on different
banks. See detail in later sections of this document. The sysMEM EBRs are large, dedicated fast memory blocks;
these blocks are found only in the larger devices. These blocks can be configured as RAM, ROM or FIFO. FIFO
support includes dedicated FIFO pointer and flag “hard” control logic to minimize LUT use.
The MachXO architecture provides up to two sysCLOCK™ Phase Locked Loop (PLL) on larger devices. These
blocks are located at either end of the memory blocks. These PLLs have multiply, divide and phase shifting capabil-
ities; they are used to manage the phase relationship of the clocks.
Every device in the family has a JTAG Port that supports programming and configuration of the device as well as
access to the user logic. The MachXO devices are available for operation from 3.3V, 2.5V, 1.8V and 1.2V power
supplies, providing easy integration into the overall system.
© 2005 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand
or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
www.latticesemi.com
2-1
Architecture_01.0
Lattice Semiconductor
Figure 2-1. Top View of MachXO1200 Device
1
Architecture
MachXO Family Data Sheet
PIOs Arranged into
sysIO Banks
sysMEM Embedded
Block RAM (EBR)
Programmable
Functional Units
(PFUs) with RAM
Programmable
Functional Units
(PFFs) without
RAM
sysCLOCK
PLL
JTAG Port
1. Top view of MachXO2280 device is similar but with higher LUT count, two PLLs and three EBR blocks.
Figure 2-2. Top View of MachXO640 Device
PIOs Arranged into
sysIO Banks
Programmable
Function Units (PFFs)
without RAM
Programmable
Function Units
(PFUs) with RAM
JTAG Port
2-2

LCMXO2280E-4M100I相似产品对比

LCMXO2280E-4M100I LCMXO2280E-3M100I
描述 Flash PLD, PBGA100, 8 X 8 MM, CSBGA-100 Flash PLD, PBGA100, 8 X 8 MM, CSBGA-100
是否无铅 含铅 含铅
是否Rohs认证 不符合 不符合
厂商名称 Lattice(莱迪斯) Lattice(莱迪斯)
零件包装代码 BGA BGA
包装说明 8 X 8 MM, CSBGA-100 8 X 8 MM, CSBGA-100
针数 100 100
Reach Compliance Code compliant compliant
ECCN代码 EAR99 EAR99
JESD-30 代码 S-PBGA-B100 S-PBGA-B100
JESD-609代码 e0 e0
长度 8 mm 8 mm
湿度敏感等级 3 3
专用输入次数 6 6
I/O 线路数量 73 73
端子数量 100 100
组织 6 DEDICATED INPUTS, 73 I/O 6 DEDICATED INPUTS, 73 I/O
输出函数 MACROCELL MACROCELL
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LFBGA LFBGA
封装形状 SQUARE SQUARE
封装形式 GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
峰值回流温度(摄氏度) 240 240
可编程逻辑类型 FLASH PLD FLASH PLD
认证状态 Not Qualified Not Qualified
座面最大高度 1.35 mm 1.35 mm
最大供电电压 1.26 V 1.26 V
最小供电电压 1.14 V 1.14 V
标称供电电压 1.2 V 1.2 V
表面贴装 YES YES
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 BALL BALL
端子节距 0.5 mm 0.5 mm
端子位置 BOTTOM BOTTOM
处于峰值回流温度下的最长时间 30 30
宽度 8 mm 8 mm

 
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