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Datasheet> 器件分类 > 模拟混合信号IC> 驱动程序和接口> AM26LS33DM

AM26LS33DM: 产品描述Line Receiver, 4 Func, 4 Rcvr, BIPolar, CDIP16, HERMETIC SEALED, DIP-16; 产品类别模拟混合信号IC 驱动程序和接口; 文件大小182KB，共5页; 制造商AMD(超微); 官网地址http://www.amd.com

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AM26LS33DM概述

Line Receiver, 4 Func, 4 Rcvr, BIPolar, CDIP16, HERMETIC SEALED, DIP-16

AM26LS33DM规格参数

参数名称	属性值
是否Rohs认证	不符合
厂商名称	AMD(超微)
零件包装代码	DIP
包装说明	DIP, DIP16,.3
针数	16
Reach Compliance Code	unknown
ECCN代码	EAR99
输入特性	DIFFERENTIAL SCHMITT TRIGGER
接口集成电路类型	LINE RECEIVER
接口标准	GENERAL PURPOSE
JESD-30 代码	R-CDIP-T16
JESD-609代码	e0
长度	19.431 mm
功能数量	4
端子数量	16
最高工作温度	125 °C
最低工作温度	-55 °C
输出特性	3-STATE
最大输出低电流	0.008 A
输出极性	TRUE
封装主体材料	CERAMIC, METAL-SEALED COFIRED
封装代码	DIP
封装等效代码	DIP16,.3
封装形状	RECTANGULAR
封装形式	IN-LINE
峰值回流温度（摄氏度）	NOT SPECIFIED
电源	5 V
认证状态	Not Qualified
最大接收延迟
接收器位数	4
筛选级别	MIL-STD-883 Class C
座面最大高度	5.08 mm
最大压摆率	70 mA
标称供电电压	5 V
表面贴装	NO
技术	BIPOLAR
温度等级	MILITARY
端子面层	Tin/Lead (Sn/Pb)
端子形式	THROUGH-HOLE
端子节距	2.54 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED
宽度	7.62 mm

AM26LS33DM相似产品对比

	AM26LS33DM	AM26LS32DM	AM26LS32DM8	AM26LS33XC	AM26LS33XM	AM26LS32FM	AM26LS33FM	AM26LS32XM	AM26LS32XC
描述	Line Receiver, 4 Func, 4 Rcvr, BIPolar, CDIP16, HERMETIC SEALED, DIP-16	Line Receiver, 4 Func, 4 Rcvr, BIPolar, CDIP16, HERMETIC SEALED, DIP-16	Line Receiver, 4 Func, 4 Rcvr, BIPolar, CDIP16, HERMETIC SEALED, DIP-16	Line Receiver, 4 Func, 4 Rcvr, BIPolar, 0.087 X 0.059 INCH, DIE-16	Line Receiver, 4 Func, 4 Rcvr, BIPolar, 0.087 X 0.059 INCH, DIE-16	Line Receiver, 4 Func, 4 Rcvr, BIPolar, CDFP16, CERPACK-16	Line Receiver, 4 Func, 4 Rcvr, BIPolar, CDFP16, CERPACK-16	Line Receiver, 4 Func, 4 Rcvr, BIPolar, 0.087 X 0.059 INCH, DIE-16	Line Receiver, 4 Func, 4 Rcvr, BIPolar, 0.087 X 0.059 INCH, DIE-16
零件包装代码	DIP	DIP	DIP	DIE	DIE	DFP	DFP	DIE	DIE
包装说明	DIP, DIP16,.3	DIP, DIP16,.3	DIP,	DIE,	DIE, DIE OR CHIP	DFP, FL16,.3	CERPACK-16	DIE, DIE OR CHIP	DIE, DIE OR CHIP
针数	16	16	16	16	16	16	16	16	16
Reach Compliance Code	unknown	unknow	unknow	unknown	unknown	unknown	unknown	unknown	unknow
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
输入特性	DIFFERENTIAL SCHMITT TRIGGER	DIFFERENTIAL SCHMITT TRIGGER	DIFFERENTIAL SCHMITT TRIGGER	DIFFERENTIAL SCHMITT TRIGGER	DIFFERENTIAL SCHMITT TRIGGER	DIFFERENTIAL SCHMITT TRIGGER	DIFFERENTIAL SCHMITT TRIGGER	DIFFERENTIAL SCHMITT TRIGGER	DIFFERENTIAL SCHMITT TRIGGER
接口集成电路类型	LINE RECEIVER	LINE RECEIVER	LINE RECEIVER	LINE RECEIVER	LINE RECEIVER	LINE RECEIVER	LINE RECEIVER	LINE RECEIVER	LINE RECEIVER
接口标准	GENERAL PURPOSE	EIA-422; EIA-423; FED STD 1020; FED STD 1030	EIA-422; EIA-423; FED STD 1020; FED STD 1030	GENERAL PURPOSE	GENERAL PURPOSE	EIA-422; EIA-423; FED STD 1020; FED STD 1030	GENERAL PURPOSE	EIA-422; EIA-423; FED STD 1020; FED STD 1030	EIA-422; EIA-423; FED STD 1020; FED STD 1030
JESD-30 代码	R-CDIP-T16	R-CDIP-T16	R-CDIP-T16	R-XUUC-N16	R-XUUC-N16	R-CDFP-F16	R-CDFP-F16	R-XUUC-N16	R-XUUC-N16
功能数量	4	4	4	4	4	4	4	4	4
端子数量	16	16	16	16	16	16	16	16	16
最高工作温度	125 °C	125 °C	125 °C	70 °C	125 °C	125 °C	125 °C	125 °C	70 °C
最低工作温度	-55 °C	-55 °C	-55 °C	-	-55 °C	-55 °C	-55 °C	-55 °C	-
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
输出极性	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE
封装主体材料	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	UNSPECIFIED	UNSPECIFIED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	UNSPECIFIED	UNSPECIFIED
封装代码	DIP	DIP	DIP	DIE	DIE	DFP	DFP	DIE	DIE
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	IN-LINE	IN-LINE	IN-LINE	UNCASED CHIP	UNCASED CHIP	FLATPACK	FLATPACK	UNCASED CHIP	UNCASED CHIP
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
接收器位数	4	4	4	4	4	4	4	4	4
标称供电电压	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	NO	NO	NO	YES	YES	YES	YES	YES	YES
技术	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR
温度等级	MILITARY	MILITARY	MILITARY	COMMERCIAL	MILITARY	MILITARY	MILITARY	MILITARY	COMMERCIAL
端子形式	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	NO LEAD	FLAT	FLAT	NO LEAD	NO LEAD
端子位置	DUAL	DUAL	DUAL	UPPER	UPPER	DUAL	DUAL	UPPER	UPPER
长度	19.431 mm	19.431 mm	19.431 mm	-	-	10.0965 mm	10.0965 mm	-	-
最大输出低电流	0.008 A	0.008 A	-	-	0.008 A	0.008 A	0.008 A	0.008 A	0.008 A
封装等效代码	DIP16,.3	DIP16,.3	-	-	DIE OR CHIP	FL16,.3	FL16,.3	DIE OR CHIP	DIE OR CHIP
电源	5 V	5 V	-	-	5 V	5 V	5 V	5 V	5 V
筛选级别	MIL-STD-883 Class C	MIL-STD-883 Class C	-	-	MIL-STD-883 Class C	MIL-STD-883 Class C	MIL-STD-883 Class C	MIL-STD-883 Class C	-
座面最大高度	5.08 mm	5.08 mm	5.08 mm	-	-	2.159 mm	2.159 mm	-	-
最大压摆率	70 mA	70 mA	-	70 mA	70 mA	70 mA	70 mA	70 mA	70 mA
端子节距	2.54 mm	2.54 mm	2.54 mm	-	-	1.27 mm	1.27 mm	-	-
宽度	7.62 mm	7.62 mm	7.62 mm	-	-	6.731 mm	6.731 mm	-	-
Base Number Matches	-	1	1	1	1	1	-	-	-

AM26LS33DM

AM26LS33DM概述

AM26LS33DM规格参数

AM26LS33DM相似产品对比

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