1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, BGA8, LEAD FREE, DSBGA-8
| 参数名称 | 属性值 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | BGA |
| 包装说明 | VFBGA, BGA8,2X4,20 |
| 针数 | 8 |
| Reach Compliance Code | unknown |
| 模拟集成电路 - 其他类型 | SPDT |
| JESD-30 代码 | R-XBGA-B8 |
| 长度 | 1.9 mm |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 标称断态隔离度 | 64 dB |
| 通态电阻匹配规范 | 0.16 Ω |
| 最大通态电阻 (Ron) | 2.7 Ω |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出 | SEPARATE OUTPUT |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | VFBGA |
| 封装等效代码 | BGA8,2X4,20 |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 电源 | 1.8/5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.5 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1.65 V |
| 标称供电电压 (Vsup) | 1.8 V |
| 表面贴装 | YES |
| 最长断开时间 | 27.5 ns |
| 最长接通时间 | 20.5 ns |
| 切换 | MAKE-BEFORE-BREAK |
| 温度等级 | INDUSTRIAL |
| 端子形式 | BALL |
| 端子节距 | 0.5 mm |
| 端子位置 | BOTTOM |
| 宽度 | 0.9 mm |
| TS5A3154YZAR | TS5A3154YEAR | TS5A3154DCTRE6 | TS5A3154YEPR | |
|---|---|---|---|---|
| 描述 | 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, BGA8, LEAD FREE, DSBGA-8 | 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, BGA8, DSBGA-8 | 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, PDSO8, LEAD FREE, SSOP-8 | 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, BGA8, DSBGA-8 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | BGA | BGA | SOIC | BGA |
| 包装说明 | VFBGA, BGA8,2X4,20 | DSBGA-8 | LEAD FREE, SSOP-8 | VFBGA, BGA8,2X4,20 |
| 针数 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| 模拟集成电路 - 其他类型 | SPDT | SPDT | SPDT | SPDT |
| JESD-30 代码 | R-XBGA-B8 | R-XBGA-B8 | R-PDSO-G8 | R-XBGA-B8 |
| 长度 | 1.9 mm | 1.9 mm | 2.95 mm | 1.9 mm |
| 信道数量 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 |
| 标称断态隔离度 | 64 dB | 64 dB | 64 dB | 64 dB |
| 通态电阻匹配规范 | 0.16 Ω | 0.16 Ω | 0.16 Ω | 0.16 Ω |
| 最大通态电阻 (Ron) | 2.7 Ω | 2.7 Ω | 2.7 Ω | 2.7 Ω |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出 | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED |
| 封装代码 | VFBGA | VFBGA | LSSOP | VFBGA |
| 封装等效代码 | BGA8,2X4,20 | BGA8,2X4,20 | SSOP8,.16 | BGA8,2X4,20 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 电源 | 1.8/5 V | 1.8/5 V | 1.8/5 V | 1.8/5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 0.5 mm | 0.5 mm | 1.3 mm | 0.5 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 1.65 V | 1.65 V | 1.65 V | 1.65 V |
| 标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 表面贴装 | YES | YES | YES | YES |
| 最长断开时间 | 27.5 ns | 27.5 ns | 27.5 ns | 27.5 ns |
| 最长接通时间 | 20.5 ns | 20.5 ns | 20.5 ns | 20.5 ns |
| 切换 | MAKE-BEFORE-BREAK | MAKE-BEFORE-BREAK | MAKE-BEFORE-BREAK | MAKE-BEFORE-BREAK |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | BALL | BALL | GULL WING | BALL |
| 端子节距 | 0.5 mm | 0.5 mm | 0.65 mm | 0.5 mm |
| 端子位置 | BOTTOM | BOTTOM | DUAL | BOTTOM |
| 宽度 | 0.9 mm | 0.9 mm | 2.8 mm | 0.9 mm |
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