1Gb: x4, x8, x16 DDR2 SDRAM
Features
DDR2 SDRAM
MT47H256M4 – 32 Meg x 4 x 8 banks
MT47H128M8 – 16 Meg x 8 x 8 banks
MT47H64M16 – 8 Meg x 16 x 8 banks
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
V
DD
= +1.8V ±0.1V, V
DDQ
= +1.8V ±0.1V
JEDEC-standard 1.8V I/O (SSTL_18-compatible)
Differential data strobe (DQS, DQS#) option
4n-bit prefetch architecture
Duplicate output strobe (RDQS) option for x8
DLL to align DQ and DQS transitions with CK
8 internal banks for concurrent operation
Programmable CAS latency (CL)
Posted CAS additive latency (AL)
WRITE latency = READ latency - 1
t
CK
Selectable burst lengths (BL): 4 or 8
Adjustable data-output drive strength
64ms, 8192-cycle refresh
On-die termination (ODT)
Industrial temperature (IT) option
Automotive temperature (AT) option
RoHS-compliant
Supports JEDEC clock jitter specification
Options
1
•
Configuration
–
256 Meg x 4 (32 Meg x 4 x 8 banks)
–
128 Meg x 8 (16 Meg x 8 x 8 banks)
–
64 Meg x 16 (8 Meg x 16 x 8 banks)
•
FBGA package (Pb-free) – x16
–
84-ball FBGA (8mm x 12.5mm)
Rev. G, H
•
FBGA package (Pb-free) – x4, x8
–
60-ball FBGA (8mm x 11.5mm)
Rev. G
•
FBGA package (Pb-free) – x4, x8
–
60-ball FBGA (8mm x 10mm) Rev. H
•
FBGA package (lead solder) – x16
–
84-ball FBGA (8mm x 12.5mm)
Rev. G, H
•
FBGA package (lead solder) – x4, x8
–
60-ball FBGA (8mm x 11.5mm)
Rev. G
•
FBGA package (lead solder) – x4, x8
–
60-ball FBGA (8mm x 10mm) Rev. H
•
Timing – cycle time
–
1.875ns @ CL = 7 (DDR2-1066)
–
2.5ns @ CL = 5 (DDR2-800)
–
2.5ns @ CL = 6 (DDR2-800)
–
3.0ns @ CL = 4 (DDR2-667)
–
3.0ns @ CL = 5 (DDR2-667)
–
3.75ns @ CL = 4 (DDR2-533)
•
Self refresh
–
Standard
–
Low-power
•
Operating temperature
–
Commercial (0°C
≤
T
C
≤
85°C)
–
Industrial (–40°C
≤
T
C
≤
95°C;
–40°C
≤
T
A
≤
85°C)
–
Automotive (–40°C
≤
T
C
, T
A
≤
105ºC)
•
Revision
Note:
Marking
256M4
128M8
64M16
HR
HQ
CF
HW
HV
JN
-187E
-25E
-25
-3E
-3
-37E
None
L
None
IT
AT
:G/:H
1. Not all options listed can be combined to
define an offered product. Use the Part
Catalog Search on
www.micron.com
for
product offerings and availability.
PDF: 09005aef821ae8bf
1GbDDR2.pdf – Rev. V 6/10 EN
1
Products and specifications discussed herein are subject to change by Micron without notice.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2004 Micron Technology, Inc. All rights reserved.
1Gb: x4, x8, x16 DDR2 SDRAM
Features
Table 1: Key Timing Parameters
Data Rate (MT/s)
Speed Grade
-187E
-25E
-25
-3E
-3
-37E
CL = 3
400
400
400
400
400
400
CL = 4
533
533
533
667
533
533
CL = 5
667
800
667
667
667
n/a
CL = 6
800
800
800
n/a
n/a
n/a
CL = 7
1066
n/a
n/a
n/a
n/a
n/a
t
RC
(ns)
54
55
55
54
55
55
Table 2: Addressing
Parameter
Configuration
Refresh count
Row address
Bank address
Column address
256 Meg x 4
32 Meg x 4 x 8 banks
8K
A[13:0] (16K)
BA[2:0] (8)
A[11, 9:0] (2K)
128 Meg x 8
16 Meg x 8 x 8 banks
8K
A[13:0] (16K)
BA[2:0] (8)
A[9:0] (1K)
64 Meg x 16
8 Meg x 16 x 8 banks
8K
A[12:0] (8K)
BA[2:0] (8)
A[9:0] (1K)
Figure 1: 1Gb DDR2 Part Numbers
Example Part Number: MT47H128M8CF-25
-
MT47H
Configuration
Package
Speed
:
Revision
{
:G/:H
Configuration
256 Meg x 4
128 Meg x 8
64 Meg x 16
Package
Pb-free
84-ball 8mm x 12.5mm FBGA
60-ball 8mm x 11.5mm FBGA
60-ball 8mm x 10.0mm FBGA
Lead solder
84-ball 8mm x 12.5mm FBGA
60-ball 8mm x 10mm FBGA
60-ball 8mm x 11.5mm FBGA
HW
JN
HV
HR
HQ
CF
256M4
128M8
64M16
-187E
-25E
-25
-3E
-3
-37E
Speed Grade
tCK = 1.875ns, CL = 7
tCK = 2.5ns, CL = 5
tCK = 2.5ns, CL = 6
tCK = 3ns, CL = 4
tCK = 3ns, CL = 5
tCK = 3.75ns, CL = 4
Revision
L Low power
IT Industrial temperature
AT Automotive temperature
Note:
1. Not all speeds and configurations are available in all packages.
PDF: 09005aef821ae8bf
1GbDDR2.pdf – Rev. V 6/10 EN
2
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2004 Micron Technology, Inc. All rights reserved.
1Gb: x4, x8, x16 DDR2 SDRAM
Features
FBGA Part Number System
Due to space limitations, FBGA-packaged components have an abbreviated part marking that is different from the
part number. For a quick conversion of an FBGA code, see the FBGA Part Marking Decoder on Micron’s Web site:
http://www.micron.com.
PDF: 09005aef821ae8bf
1GbDDR2.pdf – Rev. V 6/10 EN
3
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2004 Micron Technology, Inc. All rights reserved.
1Gb: x4, x8, x16 DDR2 SDRAM
State Diagram .................................................................................................................................................. 9
Functional Description ................................................................................................................................... 10
Industrial Temperature .............................................................................................................................. 10
Automotive Temperature ........................................................................................................................... 11
General Notes ............................................................................................................................................ 11
Functional Block Diagrams ............................................................................................................................. 12
Ball Assignments and Descriptions ................................................................................................................. 15
Packaging ...................................................................................................................................................... 19
Package Dimensions .................................................................................................................................. 19
FBGA Package Capacitance ......................................................................................................................... 22
Electrical Specifications – Absolute Ratings ..................................................................................................... 23
Temperature and Thermal Impedance ........................................................................................................ 23
Electrical Specifications – I
DD
Parameters ........................................................................................................ 26
I
DD
Specifications and Conditions ............................................................................................................... 26
I
DD7
Conditions .......................................................................................................................................... 27
AC Timing Operating Specifications ................................................................................................................ 34
AC and DC Operating Conditions .................................................................................................................... 44
ODT DC Electrical Characteristics ................................................................................................................... 45
Input Electrical Characteristics and Operating Conditions ............................................................................... 46
Output Electrical Characteristics and Operating Conditions ............................................................................. 49
Output Driver Characteristics ......................................................................................................................... 51
Power and Ground Clamp Characteristics ....................................................................................................... 55
AC Overshoot/Undershoot Specification ......................................................................................................... 56
Input Slew Rate Derating ................................................................................................................................ 58
Commands .................................................................................................................................................... 71
Truth Tables ............................................................................................................................................... 71
DESELECT ................................................................................................................................................. 75
NO OPERATION (NOP) .............................................................................................................................. 76
LOAD MODE (LM) ..................................................................................................................................... 76
ACTIVATE .................................................................................................................................................. 76
READ ......................................................................................................................................................... 76
WRITE ....................................................................................................................................................... 76
PRECHARGE .............................................................................................................................................. 77
REFRESH ................................................................................................................................................... 77
SELF REFRESH ........................................................................................................................................... 77
Mode Register (MR) ........................................................................................................................................ 77
Burst Length .............................................................................................................................................. 78
Burst Type ................................................................................................................................................. 79
Operating Mode ......................................................................................................................................... 79
DLL RESET ................................................................................................................................................. 79
Write Recovery ........................................................................................................................................... 80
Power-Down Mode .................................................................................................................................... 80
CAS Latency (CL) ........................................................................................................................................ 81
Extended Mode Register (EMR) ....................................................................................................................... 82
DLL Enable/Disable ................................................................................................................................... 83
Output Drive Strength ................................................................................................................................ 83
DQS# Enable/Disable ................................................................................................................................. 83
RDQS Enable/Disable ................................................................................................................................. 83
Output Enable/Disable ............................................................................................................................... 83
On-Die Termination (ODT) ........................................................................................................................ 84
Contents
PDF: 09005aef821ae8bf
1GbDDR2.pdf – Rev. V 6/10 EN
4
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2004 Micron Technology, Inc. All rights reserved.
1Gb: x4, x8, x16 DDR2 SDRAM
Off-Chip Driver (OCD) Impedance Calibration ............................................................................................ 84
Posted CAS Additive Latency (AL) ............................................................................................................... 84
Extended Mode Register 2 (EMR2) .................................................................................................................. 86
Extended Mode Register 3 (EMR3) .................................................................................................................. 87
Initialization .................................................................................................................................................. 88
ACTIVATE ...................................................................................................................................................... 91
READ ............................................................................................................................................................. 93
READ with Precharge ................................................................................................................................. 97
READ with Auto Precharge .......................................................................................................................... 99
WRITE .......................................................................................................................................................... 104
PRECHARGE ................................................................................................................................................. 114
REFRESH ...................................................................................................................................................... 115
SELF REFRESH .............................................................................................................................................. 116
Power-Down Mode ....................................................................................................................................... 118
Precharge Power-Down Clock Frequency Change .......................................................................................... 125
Reset ............................................................................................................................................................. 126
CKE Low Anytime ...................................................................................................................................... 126
ODT Timing .................................................................................................................................................. 128
MRS Command to ODT Update Delay ........................................................................................................ 130
PDF: 09005aef821ae8bf
1GbDDR2.pdf – Rev. V 6/10 EN
5
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2004 Micron Technology, Inc. All rights reserved.
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