128KX32 CACHE SRAM, 8ns, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | Rochester Electronics |
零件包装代码 | QFP |
包装说明 | LQFP, |
针数 | 100 |
Reach Compliance Code | unknown |
最长访问时间 | 8 ns |
其他特性 | FLOW-THROUGH ARCHITECTURE |
JESD-30 代码 | R-PQFP-G100 |
JESD-609代码 | e0 |
长度 | 20 mm |
内存密度 | 4194304 bit |
内存集成电路类型 | CACHE SRAM |
内存宽度 | 32 |
湿度敏感等级 | 3 |
功能数量 | 1 |
端子数量 | 100 |
字数 | 131072 words |
字数代码 | 128000 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 128KX32 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | LQFP |
封装形状 | RECTANGULAR |
封装形式 | FLATPACK, LOW PROFILE |
并行/串行 | PARALLEL |
峰值回流温度(摄氏度) | NOT SPECIFIED |
认证状态 | COMMERCIAL |
座面最大高度 | 1.6 mm |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 3.135 V |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | YES |
温度等级 | INDUSTRIAL |
端子面层 | TIN LEAD |
端子形式 | GULL WING |
端子节距 | 0.65 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 14 mm |
CY7C1338B-100AI | CY7C1338B-100AC | CY7C1338B-100BGCT | CY7C1338B-117AC | CY7C1338B-117BGC | CY7C1338B-100BGC | |
---|---|---|---|---|---|---|
描述 | 128KX32 CACHE SRAM, 8ns, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 | 128KX32 CACHE SRAM, 8ns, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 | 128KX32 CACHE SRAM, 8ns, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119 | 128KX32 CACHE SRAM, 7.5ns, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 | 128KX32 CACHE SRAM, 7.5ns, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119 | 128KX32 CACHE SRAM, 8ns, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119 |
零件包装代码 | QFP | QFP | BGA | QFP | BGA | BGA |
包装说明 | LQFP, | LQFP, | 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119 | LQFP, | 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119 | 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119 |
针数 | 100 | 100 | 119 | 100 | 119 | 119 |
Reach Compliance Code | unknown | unknow | unknown | unknown | unknown | unknown |
最长访问时间 | 8 ns | 8 ns | 8 ns | 7.5 ns | 7.5 ns | 8 ns |
其他特性 | FLOW-THROUGH ARCHITECTURE | FLOW-THROUGH ARCHITECTURE | FLOW-THROUGH ARCHITECTURE | FLOW-THROUGH ARCHITECTURE | FLOW-THROUGH ARCHITECTURE | FLOW-THROUGH ARCHITECTURE |
JESD-30 代码 | R-PQFP-G100 | R-PQFP-G100 | R-PBGA-B119 | R-PQFP-G100 | R-PBGA-B119 | R-PBGA-B119 |
长度 | 20 mm | 20 mm | 22 mm | 20 mm | 22 mm | 22 mm |
内存密度 | 4194304 bit | 4194304 bi | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
内存集成电路类型 | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 100 | 100 | 119 | 100 | 119 | 119 |
字数 | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
字数代码 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 85 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 128KX32 | 128KX32 | 128KX32 | 128KX32 | 128KX32 | 128KX32 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | LQFP | LQFP | BGA | LQFP | BGA | BGA |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | GRID ARRAY | FLATPACK, LOW PROFILE | GRID ARRAY | GRID ARRAY |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
认证状态 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
座面最大高度 | 1.6 mm | 1.6 mm | 2.4 mm | 1.6 mm | 2.4 mm | 2.4 mm |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES |
温度等级 | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | GULL WING | GULL WING | BALL | GULL WING | BALL | BALL |
端子节距 | 0.65 mm | 0.65 mm | 1.27 mm | 0.65 mm | 1.27 mm | 1.27 mm |
端子位置 | QUAD | QUAD | BOTTOM | QUAD | BOTTOM | BOTTOM |
宽度 | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm |
是否无铅 | 含铅 | 含铅 | - | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | - | 不符合 | 不符合 | 不符合 |
厂商名称 | Rochester Electronics | - | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
JESD-609代码 | e0 | e0 | - | e0 | e0 | e0 |
内存宽度 | 32 | 32 | - | 32 | 32 | 32 |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
端子面层 | TIN LEAD | TIN LEAD | - | TIN LEAD | TIN LEAD | TIN LEAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
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