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UPD23C64040BLGY-XXX-MKH

产品描述MASK ROM, 4MX16, 100ns, CMOS, PDSO48, 12 X 18 MM, PLASTIC, REVERSE, TSOP1-48
产品类别存储    存储   
文件大小87KB,共16页
制造商NEC(日电)
下载文档 详细参数 选型对比 全文预览

UPD23C64040BLGY-XXX-MKH概述

MASK ROM, 4MX16, 100ns, CMOS, PDSO48, 12 X 18 MM, PLASTIC, REVERSE, TSOP1-48

UPD23C64040BLGY-XXX-MKH规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称NEC(日电)
零件包装代码TSOP1
包装说明TSOP1-R,
针数48
Reach Compliance Codecompliant
ECCN代码EAR99
最长访问时间100 ns
备用内存宽度8
JESD-30 代码R-PDSO-G48
JESD-609代码e0
长度16.4 mm
内存密度67108864 bit
内存集成电路类型MASK ROM
内存宽度16
功能数量1
端子数量48
字数4194304 words
字数代码4000000
工作模式ASYNCHRONOUS
最高工作温度70 °C
最低工作温度-10 °C
组织4MX16
封装主体材料PLASTIC/EPOXY
封装代码TSOP1-R
封装形状RECTANGULAR
封装形式SMALL OUTLINE, THIN PROFILE
并行/串行PARALLEL
峰值回流温度(摄氏度)NOT SPECIFIED
认证状态Not Qualified
座面最大高度1.2 mm
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)2.7 V
标称供电电压 (Vsup)3 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层TIN LEAD
端子形式GULL WING
端子节距0.5 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度12 mm

UPD23C64040BLGY-XXX-MKH文档预览

DATA SHEET
MOS INTEGRATED CIRCUIT
µ
PD23C64040BL
64M-BIT MASK-PROGRAMMABLE ROM
8M-WORD BY 8-BIT (BYTE MODE) / 4M-WORD BY 16-BIT (WORD MODE)
PAGE ACCESS MODE
Description
The
µ
PD23C64040BL is a 67,108,864 bits mask-programmable ROM. The word organization is selectable (BYTE
mode : 8,388,608 words by 8 bits, WORD mode : 4,194,304 words by 16 bits).
The active levels of OE (Output Enable Input) can be selected with mask-option.
The
µ
PD23C64040BL is packed in 48-pin PLASTIC TSOP (I).
Features
Word organization
8,388,608 words by 8 bits (BYTE mode)
4,194,304 words by 16 bits (WORD mode)
Page access mode
BYTE mode : 8 byte random page access
WORD mode : 4 word random page access
Operating supply voltage : V
CC
= 2.7 to 3.6 V
Operating supply voltage Access time / Page access time Power supply current (Active mode) Standby current (CMOS level input)
V
CC
3.3 V
±
0.3 V
3.0 V
±
0.3 V
ns (MAX.)
90 / 25
100 / 25
mA (MAX.)
65
55
µ
A (MAX.)
30
30
Ordering Information
Part number
Package
48-pin PLASTIC TSOP (I) (12
×
18) (Normal bent)
48-pin PLASTIC TSOP (I) (12
×
18) (Reverse bent)
µ
PD23C64040BLGY-xxx-MJH
µ
PD23C64040BLGY-xxx-MKH
(xxx : ROM code suffix No.)
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. M15277EJ2V0DS00 (2nd edition)
Date Published July 2001 NS CP (K)
Printed in Japan
©
2001
µ
PD23C64040BL
Pin Configurations (Marking Side)
/xxx indicates active low signal.
48-pin PLASTIC TSOP (I) (12
×
18) (Normal bent)
[
µ
PD23C64040BLGY-xxx-MJH ]
WORD, /BYTE
A16
A15
A14
A13
A12
A11
A10
A9
A8
A19
A21
A20
A18
A17
A7
A6
A5
A4
A3
A2
A1
A0
/CE
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
GND
GND
O15, A−1
O7
O14
O6
O13
O5
O12
O4
V
CC
V
CC
NC
O11
O3
O10
O2
O9
O1
O8
O0
/OE, OE, DC
GND
GND
A0 - A21
O0 - O7, O8 - O14
O15, A−1
WORD, /BYTE
/CE
/OE, OE
V
CC
GND
NC
DC
Note
: Address inputs
: Data outputs
: Data output 15 (WORD mode),
LSB Address input (BYTE mode)
: Mode select
: Chip Enable
: Output Enable
: Supply voltage
: Ground
: No Connection
: Don’t Care
Note
Some signals can be applied because this pin is not connected to the inside of the chip.
Remark
Refer to
Package Drawings
for the 1-pin index mark.
2
Data Sheet M15277EJ2V0DS
µ
PD23C64040BL
48-pin PLASTIC TSOP (I) (12
×
18) (Reverse bent)
[
µ
PD23C64040BLGY-xxx-MKH ]
GND
GND
O15, A−1
O7
O14
O6
O13
O5
O12
O4
V
CC
V
CC
NC
O11
O3
O10
O2
O9
O1
O8
O0
/OE, OE, DC
GND
GND
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
WORD, /BYTE
A16
A15
A14
A13
A12
A11
A10
A9
A8
A19
A21
A20
A18
A17
A7
A6
A5
A4
A3
A2
A1
A0
/CE
A0 - A21
O0 - O7, O8 - O14
O15, A−1
WORD, /BYTE
/CE
/OE, OE
V
CC
GND
NC
DC
Note
: Address inputs
: Data outputs
: Data output 15 (WORD mode),
LSB Address input (BYTE mode)
: Mode select
: Chip Enable
: Output Enable
: Supply voltage
: Ground
: No Connection
: Don’t Care
Note
Some signals can be applied because this pin is not connected to the inside of the chip.
Remark
Refer to
Package Drawings
for the 1-pin index mark.
Data Sheet M15277EJ2V0DS
3
µ
PD23C64040BL
Input / Output Pin Functions
Pin name
WORD, /BYTE
Input / Output
Input
Function
The pin for switching WORD mode and BYTE mode.
High level
: WORD mode (4M-word by 16-bit)
Low level
: BYTE mode (8M-word by 8-bit)
Address input pins.
A0 to A21 are used differently in the WORD mode and the BYTE mode.
WORD mode (4M-word by 16-bit)
A0 to A21 are used as 22 bits address signals.
BYTE mode (8M-word by 8-bit)
A0 to A21 are used as the upper 22 bits of total 23 bits of address signal.
(The least significant bit (A−1) is combined to O15.)
Data output pins.
O0 to O7, O8 to O14 are used differently in the WORD mode and the BYTE
mode.
WORD mode (4M-word by 16-bit)
The lower 15 bits of 16 bits data outputs to O0 to O14.
(The most significant bit (O15) combined to A−1.)
BYTE mode (8M-word by 8-bit)
8 bits data outputs to O0 to O7 and also O8 to O14 are high impedance.
O15, A−1 are used differently in the WORD mode and the BYTE mode.
WORD mode (4M-word by 16-bit)
The most significant output data bus (O15).
BYTE mode (8M-word by 8-bit)
The least significant address bus (A−1).
Chip activating signal.
When the OE is active, output states are following.
High level:
High impedance
Low level
: Data out
Output enable signal. The active level of OE is mask option. The active level
of OE can be selected from high active, low active and Don’t care at order.
Supply voltage
Ground
Not internally connected (The signal can be connected).
A0 to A21
(Address inputs)
Input
O0 to O7, O8 to O14
(Data outputs)
Output
O15, A−1
(Data output 15,
LSB Address input)
Output, Input
/CE
(Chip Enable)
Input
/OE, OE, DC
(Output Enable, Don't Care)
V
CC
GND
NC
Input
4
Data Sheet M15277EJ2V0DS
µ
PD23C64040BL
Block Diagram
O8
O0
O1
O9
O2
O10
O11
O3
O12
O4
O5
O13
O6
O14
O15, A–1
O7
A0
A1
A2
A3
A4
A5
A6
A7
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
A20
A21
A8
Output Buffer
Y-Decoder
Logic/Input
WORD, /BYTE
/OE, OE, DC
Y-Selector
Address Input Buffer
Memory Cell Matrix
X-Decoder
Input Buffer
4,194,304 words by 16 bits /
8,388,608 words by 8 bits
/CE
Data Sheet M15277EJ2V0DS
5

UPD23C64040BLGY-XXX-MKH相似产品对比

UPD23C64040BLGY-XXX-MKH UPD23C64040BLGY-XXX-MJH
描述 MASK ROM, 4MX16, 100ns, CMOS, PDSO48, 12 X 18 MM, PLASTIC, REVERSE, TSOP1-48 MASK ROM, 4MX16, 100ns, CMOS, PDSO48, 12 X 18 MM, PLASTIC, TSOP1-48
是否无铅 含铅 含铅
是否Rohs认证 不符合 不符合
厂商名称 NEC(日电) NEC(日电)
零件包装代码 TSOP1 TSOP1
包装说明 TSOP1-R, TSOP1,
针数 48 48
Reach Compliance Code compliant compliant
ECCN代码 EAR99 EAR99
最长访问时间 100 ns 100 ns
备用内存宽度 8 8
JESD-30 代码 R-PDSO-G48 R-PDSO-G48
JESD-609代码 e0 e0
长度 16.4 mm 16.4 mm
内存密度 67108864 bit 67108864 bit
内存集成电路类型 MASK ROM MASK ROM
内存宽度 16 16
功能数量 1 1
端子数量 48 48
字数 4194304 words 4194304 words
字数代码 4000000 4000000
工作模式 ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 70 °C 70 °C
最低工作温度 -10 °C -10 °C
组织 4MX16 4MX16
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSOP1-R TSOP1
封装形状 RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
并行/串行 PARALLEL PARALLEL
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED
认证状态 Not Qualified Not Qualified
座面最大高度 1.2 mm 1.2 mm
最大供电电压 (Vsup) 3.6 V 3.6 V
最小供电电压 (Vsup) 2.7 V 2.7 V
标称供电电压 (Vsup) 3 V 3 V
表面贴装 YES YES
技术 CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL
端子面层 TIN LEAD TIN LEAD
端子形式 GULL WING GULL WING
端子节距 0.5 mm 0.5 mm
端子位置 DUAL DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED
宽度 12 mm 12 mm

 
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