Standard SRAM, 32KX8, 10ns, BICMOS, PDSO28, 0.300 INCH, SOJ-28
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | SOJ |
| 包装说明 | 0.300 INCH, SOJ-28 |
| 针数 | 28 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| 最长访问时间 | 10 ns |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-PDSO-J28 |
| JESD-609代码 | e0 |
| 长度 | 17.9324 mm |
| 内存密度 | 262144 bit |
| 内存集成电路类型 | STANDARD SRAM |
| 内存宽度 | 8 |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 端口数量 | 1 |
| 端子数量 | 28 |
| 字数 | 32768 words |
| 字数代码 | 32000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 32KX8 |
| 输出特性 | 3-STATE |
| 可输出 | YES |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOJ |
| 封装等效代码 | SOJ28,.34 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 并行/串行 | PARALLEL |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 3.556 mm |
| 最大压摆率 | 0.18 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | BICMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 宽度 | 7.5184 mm |
| IDT71B256SA10Y | PTN1010K2640BGTI | IDT71B256SA12TP | IDT71B256SA15Y8 | IDT71B256SA12Y | IDT71B256SA15Y | IDT71B256SA10Y8 | IDT71B256SA15TP | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Standard SRAM, 32KX8, 10ns, BICMOS, PDSO28, 0.300 INCH, SOJ-28 | Fixed Resistor, Thin Film, 0.5W, 264ohm, 150V, 0.1% +/-Tol, 100ppm/Cel, Surface Mount, 1010, CHIP | Standard SRAM, 32KX8, 12ns, BICMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 | Standard SRAM, 32KX8, 15ns, BICMOS, PDSO28, 0.300 INCH, SOJ-28 | Standard SRAM, 32KX8, 12ns, BICMOS, PDSO28, 0.300 INCH, SOJ-28 | Standard SRAM, 32KX8, 15ns, BICMOS, PDSO28, 0.300 INCH, SOJ-28 | Standard SRAM, 32KX8, 10ns, BICMOS, PDSO28, 0.300 INCH, SOJ-28 | Standard SRAM, 32KX8, 15ns, BICMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 |
| 是否Rohs认证 | 不符合 | 符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | 0.300 INCH, SOJ-28 | CHIP | 0.300 INCH, PLASTIC, DIP-28 | SOJ, | 0.300 INCH, SOJ-28 | 0.300 INCH, SOJ-28 | SOJ, | 0.300 INCH, PLASTIC, DIP-28 |
| Reach Compliance Code | not_compliant | compliant | not_compliant | compliant | not_compliant | not_compliant | compliant | _compli |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| JESD-609代码 | e0 | e4 | e0 | e0 | e0 | e0 | e0 | e0 |
| 端子数量 | 28 | 2 | 28 | 28 | 28 | 28 | 28 | 28 |
| 最高工作温度 | 70 °C | 155 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 封装形式 | SMALL OUTLINE | SMT | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
| 表面贴装 | YES | YES | NO | YES | YES | YES | YES | NO |
| 技术 | BICMOS | THIN FILM | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
| 端子面层 | Tin/Lead (Sn85Pb15) | Gold (Au) - with Nickel (Ni) barrier | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn85Pb15) |
| 厂商名称 | IDT (Integrated Device Technology) | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| 零件包装代码 | SOJ | - | DIP | SOJ | SOJ | SOJ | SOJ | DIP |
| 针数 | 28 | - | 28 | 28 | 28 | 28 | 28 | 28 |
| 最长访问时间 | 10 ns | - | 12 ns | 15 ns | 12 ns | 15 ns | 10 ns | 15 ns |
| I/O 类型 | COMMON | - | COMMON | - | COMMON | COMMON | - | COMMON |
| JESD-30 代码 | R-PDSO-J28 | - | R-PDIP-T28 | R-PDSO-J28 | R-PDSO-J28 | R-PDSO-J28 | R-PDSO-J28 | R-PDIP-T28 |
| 长度 | 17.9324 mm | - | 34.544 mm | 17.9324 mm | 17.9324 mm | 17.9324 mm | 17.9324 mm | 34.544 mm |
| 内存密度 | 262144 bit | - | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bi |
| 内存集成电路类型 | STANDARD SRAM | - | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 内存宽度 | 8 | - | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 |
| 字数 | 32768 words | - | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
| 字数代码 | 32000 | - | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 |
| 工作模式 | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 组织 | 32KX8 | - | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 |
| 输出特性 | 3-STATE | - | 3-STATE | - | 3-STATE | 3-STATE | - | 3-STATE |
| 可输出 | YES | - | YES | YES | YES | YES | YES | YES |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOJ | - | DIP | SOJ | SOJ | SOJ | SOJ | DIP |
| 封装等效代码 | SOJ28,.34 | - | DIP28,.3 | - | SOJ28,.34 | SOJ28,.34 | - | DIP28,.3 |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 并行/串行 | PARALLEL | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 电源 | 5 V | - | 5 V | - | 5 V | 5 V | - | 5 V |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 3.556 mm | - | 4.57 mm | 3.556 mm | 3.556 mm | 3.556 mm | 3.556 mm | 4.57 mm |
| 最大压摆率 | 0.18 mA | - | 0.17 mA | - | 0.17 mA | 0.16 mA | - | 0.16 mA |
| 最大供电电压 (Vsup) | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 温度等级 | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | J BEND | - | THROUGH-HOLE | J BEND | J BEND | J BEND | J BEND | THROUGH-HOLE |
| 端子节距 | 1.27 mm | - | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | - | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 7.5184 mm | - | 7.62 mm | 7.5184 mm | 7.5184 mm | 7.5184 mm | 7.5184 mm | 7.62 mm |
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