Cache DRAM, 1MX16, CMOS, PDSO68, 0.400 INCH, 0.65 MM PITCH, PLASTIC, TSOP2-70/68
| 参数名称 | 属性值 |
| 厂商名称 | Mitsubishi(日本三菱) |
| 零件包装代码 | TSOP2 |
| 包装说明 | TSOP2, |
| 针数 | 70/68 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 访问模式 | PAGE |
| 其他特性 | AUTO/SELF REFRESH |
| JESD-30 代码 | R-PDSO-G68 |
| 长度 | 23.49 mm |
| 内存密度 | 16777216 bit |
| 内存集成电路类型 | CACHE DRAM |
| 内存宽度 | 16 |
| 功能数量 | 1 |
| 端口数量 | 1 |
| 端子数量 | 68 |
| 字数 | 1048576 words |
| 字数代码 | 1000000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 1MX16 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSOP2 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE |
| 认证状态 | Not Qualified |
| 刷新周期 | 4096 |
| 座面最大高度 | 1.2 mm |
| 自我刷新 | YES |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 宽度 | 10.16 mm |
| M5M4V16169TP-15T | M5M4V16169TP-20T | M5M4V16169TP-20 | M5M4V16169TP-12T | M5M4V16169TP-10T | |
|---|---|---|---|---|---|
| 描述 | Cache DRAM, 1MX16, CMOS, PDSO68, 0.400 INCH, 0.65 MM PITCH, PLASTIC, TSOP2-70/68 | Cache DRAM, 1MX16, CMOS, PDSO68, 0.400 INCH, 0.65 MM PITCH, PLASTIC, TSOP2-70/68 | Cache DRAM, 1MX16, 70ns, CMOS, PDSO68, 0.400 INCH, 0.65 MM PITCH, PLASTIC, TSOP2-70/68 | Cache DRAM, 1MX16, CMOS, PDSO68, 0.400 INCH, 0.65 MM PITCH, PLASTIC, TSOP2-70/68 | Cache DRAM, 1MX16, CMOS, PDSO68, 0.400 INCH, 0.65 MM PITCH, PLASTIC, TSOP2-70/68 |
| 厂商名称 | Mitsubishi(日本三菱) | Mitsubishi(日本三菱) | Mitsubishi(日本三菱) | Mitsubishi(日本三菱) | Mitsubishi(日本三菱) |
| 零件包装代码 | TSOP2 | TSOP2 | TSOP2 | TSOP2 | TSOP2 |
| 包装说明 | TSOP2, | TSOP2, | TSOP2, TSSOP68/70,.46 | TSOP2, | TSOP2, |
| 针数 | 70/68 | 70/68 | 70/68 | 70/68 | 70/68 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 访问模式 | PAGE | PAGE | PAGE | PAGE | PAGE |
| 其他特性 | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH; 1024 X 16 SRAM | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
| JESD-30 代码 | R-PDSO-G68 | R-PDSO-G68 | R-PDSO-G68 | R-PDSO-G68 | R-PDSO-G68 |
| 长度 | 23.49 mm | 23.49 mm | 23.49 mm | 23.49 mm | 23.49 mm |
| 内存密度 | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit |
| 内存集成电路类型 | CACHE DRAM | CACHE DRAM | CACHE DRAM | CACHE DRAM | CACHE DRAM |
| 内存宽度 | 16 | 16 | 16 | 16 | 16 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 68 | 68 | 68 | 68 | 68 |
| 字数 | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
| 字数代码 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 1MX16 | 1MX16 | 1MX16 | 1MX16 | 1MX16 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSOP2 | TSOP2 | TSOP2 | TSOP2 | TSOP2 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 刷新周期 | 4096 | 4096 | 4096 | 4096 | 4096 |
| 座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
| 自我刷新 | YES | YES | YES | YES | YES |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm |
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