If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage
Storage Temperature
Input Voltage
Power Dissipation (Note 4)
ESD Susceptibility (Note 5)
ESD Susceptibility (Note 6)
Junction Temperature
Soldering Information (Note 1)
Small Outline Package
Vapor Phase (60 seconds)
Infrared (15 seconds)
Thermal Resistance
215˚C
220˚C
6.0V
−65˚C to +150˚C
−0.3V to V
DD
+ 0.3V
Internally limited
3500V
250V
150˚C
Operating Ratings
Temperature Range
T
MIN
≤
T
A
≤
T
MAX
Supply Voltage
−40˚C
≤
T
A
≤
85˚C
2.0V
≤
V
DD
≤
5.5V
Note 1:
See AN-450 “Surface Mounting and their Effects on Product Reli-
ability” for other methods of soldering surface mount devices.
Electrical Characteristics
(Notes 2, 3)
The following specifications apply for V
DD
= 5V unless otherwise specified, limits apply to T
A
= 25˚C.
Symbol
Parameter
Conditions
LM4808
Typ
(Note
Limit
(Note
7)
8)
V
DD
I
DD
P
tot
V
OS
Ibias
V
CM
G
V
Io
R
O
V
O
PSRR
Crosstalk
THD+N
Supply Voltage
Supply Current
Total Power Dissipation
Input Offset Voltage
Input Bias Current
Common Mode Voltage
Open-Loop Voltage Gain
Max Output Current
Output Resistance
Output Swing
Power Supply Rejection Ratio
Channel Separation
Total Harmonic Distortion + Noise
R
L
= 32Ω, 0.1% THD+N, Min
R
L
= 32Ω, 0.1% THD+N, Max
Cb = 1.0µF, Vripple = 100mV
PP
,
f = 100Hz
R
L
= 32Ω
f = 1 kHz
R
L
= 16Ω,
V
O
=3.5V
PP
(at 0 dB)
R
L
= 32Ω,
V
O
=3.5V
PP
(at 0 dB)
SNR
f
G
P
o
Signal-to-Noise Ratio
Unity Gain Frequency
Output Power
V
O
= 3.5V
pp
(at 0 dB)
Open Loop, R
L
= 5kΩ
THD+N = 0.1%, f = 1 kHz
R
L
= 16Ω
R
L
= 32Ω
THD+N = 10%, f = 1 kHz
R
L
= 16Ω
R
L
= 32Ω
C
I
Input Capacitance
3
Units
(Limits)
V (min)
V (max)
mA (max)
mW (max)
mV (max)
pA
V
V
dB
mA
Ω
V
dB
dB
%
dB
%
dB
dB
MHz
mW
2.0
5.5
V
IN
= 0V, I
O
= 0A
V
IN
= 0V, I
O
= 0A
V
IN
= 0V
1.2
6
10
10
0
4.3
R
L
= 5kΩ
THD+N
<
0.1 %
67
70
0.1
.3
4.7
89
75
0.05
66
0.05
66
105
5.5
105
70
150
90
3
60
3.0
16.5
50
mW
mW
mW
pF
www.national.com
LM4808
Electrical Characteristics
(Notes 2, 3)
The following specifications apply for V
DD
Symbol
Parameter
(Continued)
= 5V unless otherwise specified, limits apply to T
A
= 25˚C.
Conditions
LM4808
Typ
(Note
Limit
(Note
7)
8)
Units
(Limits)
pF
V/µs
C
L
SR
Load Capacitance
Slew Rate
Unity Gain Inverting
3
200
Electrical Characteristics
(Notes 2, 3)
The following specifications apply for V
DD
= 3.3V unless otherwise specified, limits apply to T
A
= 25˚C.
Symbol
Parameter
Conditions
Conditions
Typ
(Note
Limit
(Note
7)
8)
I
DD
V
OS
P
o
Supply Current
Input Offset Voltage
Output Power
V
IN
= 0V, I
O
= 0A
V
IN
= 0V
THD+N = 0.1%, f = 1 kHz
R
L
= 16Ω
R
L
= 32Ω
THD+N = 10%, f = 1 kHz
R
L
= 16Ω
R
L
= 32Ω
56
38
mW
mW
40
28
mW
mW
1.0
7
Units
(Limits)
mA (max)
mV (max)
Electrical Characteristics
(Notes 2, 3)
The following specifications apply for V
DD
= 2.6V unless otherwise specified, limits apply to T
A
= 25˚C.
Symbol
Parameter
Conditions
Conditions
Typ
(Note
Limit
(Note
7)
8)
I
DD
V
OS
P
o
Supply Current
Input Offset Voltage
Output Power
V
IN
= 0V, I
O
= 0A
V
IN
= 0V
THD+N = 0.1%, f = 1 kHz
R
L
= 16Ω
R
L
= 32Ω
THD+N = 10%, f = 1 kHz
R
L
= 16Ω
R
L
= 32Ω
Note 2:
All voltages are measured with respect to the ground pin, unless otherwise specified.
Note 3:
Absolute Maximum Ratings
indicate limits beyond which damage to the device may occur.
Operating Ratings
indicate conditions for which the device is
functional, but do not guarantee specific performance limits.
Electrical Characteristics
state DC and AC electrical specifications under particular test conditions which
guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit
is given, however, the typical value is a good indication of device performance.
Note 4:
The maximum power dissipation must be derated at elevated temperatures and is dictated by T
JMAX
,
θ
JA
, and the ambient temperature T
A
. The maximum
allowable power dissipation is P
DMAX
= (T
JMAX
− T
A
) /
θ
JA
. For the LM4808, T
JMAX
= 150˚C, and the typical junction-to-ambient thermal resistance, when board
mounted, is 210˚C/W for package MUA08A and 170˚C/W for package M08A.
Note 5:
Human body model, 100 pF discharged through a 1.5 kΩ resistor.
Note 6:
Machine Model, 220 pF–240 pF discharged through all pins.
Note 7:
Typicals are measured at 25˚C and represent the parametric norm.
Note 8:
Tested limits are guaranteed to National’s AOQL (Average Outgoing Quality Level). Datasheet min/max specification limits are guaranteed by design, test,
or statistical analysis.
Note 9:
The given
θ
JA
is for an LM4808 packaged in an LDA08B with the Exposed-DAP soldered to a printed circuit board copper pad with an area equivalent to
that of the Exposed-DAP itself.
Note 10:
The given
θ
JA
is for an LM4808 packaged in an LDA08B with the Exposed-DAP not soldered to any printed circuit board copper.
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