Operational Amplifier, 1 Func, 10000uV Offset-Max, BIPolar, 0.049 X 0.056 INCH, DIE-8
参数名称 | 属性值 |
厂商名称 | AMD(超微) |
零件包装代码 | DIE |
包装说明 | DIE, DIE OR CHIP |
针数 | 8 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
放大器类型 | OPERATIONAL AMPLIFIER |
架构 | VOLTAGE-FEEDBACK |
最大平均偏置电流 (IIB) | 2 µA |
25C 时的最大偏置电流 (IIB) | 1.5 µA |
标称共模抑制比 | 90 dB |
频率补偿 | NO |
最大输入失调电压 | 10000 µV |
JESD-30 代码 | R-XUUC-N8 |
低-失调 | NO |
标称负供电电压 (Vsup) | -15 V |
功能数量 | 1 |
端子数量 | 8 |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | UNSPECIFIED |
封装代码 | DIE |
封装等效代码 | DIE OR CHIP |
封装形状 | RECTANGULAR |
封装形式 | UNCASED CHIP |
电源 | +-5/+-20 V |
认证状态 | Not Qualified |
最大压摆率 | 3 mA |
标称供电电压 (Vsup) | 15 V |
表面贴装 | YES |
技术 | BIPOLAR |
温度等级 | COMMERCIAL |
端子形式 | NO LEAD |
端子位置 | UPPER |
LD301 | LM301H | AD7484_17 | LM201H | LD101 | LM201D | LM101D | |
---|---|---|---|---|---|---|---|
描述 | Operational Amplifier, 1 Func, 10000uV Offset-Max, BIPolar, 0.049 X 0.056 INCH, DIE-8 | Operational Amplifier, 1 Func, 10000uV Offset-Max, BIPolar, MBCY8, HERMETIC SEALED, METAL CAN, TO-99, 8 PIN | 3 MSPS, 14-Bit SAR ADC | Operational Amplifier, 1 Func, 6000uV Offset-Max, BIPolar, MBCY8, HERMETIC SEALED, METAL CAN, TO-99, 8 PIN | Operational Amplifier, 1 Func, 6000uV Offset-Max, 0.049 X 0.056 INCH, DIE-8 | Operational Amplifier, 1 Func, 6000uV Offset-Max, BIPolar, CDIP14, HERMETIC SEALED, DIP-14 | Operational Amplifier, 1 Func, 6000uV Offset-Max, BIPolar, CDIP14, HERMETIC SEALED, DIP-14 |
厂商名称 | AMD(超微) | AMD(超微) | - | AMD(超微) | AMD(超微) | AMD(超微) | - |
零件包装代码 | DIE | TO-99 | - | TO-99 | DIE | DIP | DIP |
包装说明 | DIE, DIE OR CHIP | TO-99, CAN8,.2 | - | TO-99, CAN8,.2 | DIE, | DIP, DIP14,.3 | DIP, DIP14,.3 |
针数 | 8 | 8 | - | 8 | 8 | 14 | 14 |
Reach Compliance Code | unknown | unknown | - | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 |
放大器类型 | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | - | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
架构 | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | - | VOLTAGE-FEEDBACK | - | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
最大平均偏置电流 (IIB) | 2 µA | 2 µA | - | 1.5 µA | 1.5 µA | 1.5 µA | 1.5 µA |
25C 时的最大偏置电流 (IIB) | 1.5 µA | 1.5 µA | - | 0.5 µA | - | 0.5 µA | 0.5 µA |
标称共模抑制比 | 90 dB | 90 dB | - | 90 dB | 90 dB | 90 dB | 90 dB |
频率补偿 | NO | NO | - | NO | - | NO | NO |
最大输入失调电压 | 10000 µV | 10000 µV | - | 6000 µV | 6000 µV | 6000 µV | 6000 µV |
JESD-30 代码 | R-XUUC-N8 | O-MBCY-W8 | - | O-MBCY-W8 | R-XUUC-N8 | R-CDIP-T14 | R-CDIP-T14 |
低-失调 | NO | NO | - | NO | - | NO | NO |
标称负供电电压 (Vsup) | -15 V | -15 V | - | -15 V | -15 V | -15 V | -15 V |
功能数量 | 1 | 1 | - | 1 | 1 | 1 | 1 |
端子数量 | 8 | 8 | - | 8 | 8 | 14 | 14 |
最高工作温度 | 70 °C | 70 °C | - | 85 °C | 125 °C | 85 °C | 125 °C |
最低工作温度 | - | - | - | -25 °C | -55 °C | -25 °C | -55 °C |
封装主体材料 | UNSPECIFIED | METAL | - | METAL | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DIE | TO-99 | - | TO-99 | DIE | DIP | DIP |
封装等效代码 | DIE OR CHIP | CAN8,.2 | - | CAN8,.2 | - | DIP14,.3 | DIP14,.3 |
封装形状 | RECTANGULAR | ROUND | - | ROUND | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | UNCASED CHIP | CYLINDRICAL | - | CYLINDRICAL | UNCASED CHIP | IN-LINE | IN-LINE |
电源 | +-5/+-20 V | +-5/+-20 V | - | +-5/+-20 V | - | +-5/+-20 V | +-5/+-20 V |
认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大压摆率 | 3 mA | 3 mA | - | 3 mA | 3 mA | 3 mA | 3 mA |
标称供电电压 (Vsup) | 15 V | 15 V | - | 15 V | 15 V | 15 V | 15 V |
表面贴装 | YES | NO | - | NO | YES | NO | NO |
技术 | BIPOLAR | BIPOLAR | - | BIPOLAR | - | BIPOLAR | BIPOLAR |
温度等级 | COMMERCIAL | COMMERCIAL | - | OTHER | MILITARY | OTHER | MILITARY |
端子形式 | NO LEAD | WIRE | - | WIRE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE |
端子位置 | UPPER | BOTTOM | - | BOTTOM | UPPER | DUAL | DUAL |
是否Rohs认证 | - | 不符合 | - | 不符合 | - | 不符合 | 不符合 |
JESD-609代码 | - | e0 | - | e0 | - | e0 | e0 |
端子面层 | - | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
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