Comparator, 1 Func, 6000uV Offset-Max, 22ns Response Time, BIPolar, PDSO14,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) |
| 包装说明 | SOP, SOP14,.25 |
| Reach Compliance Code | unknown |
| 放大器类型 | COMPARATOR |
| 25C 时的最大偏置电流 (IIB) | 0.00002 µA |
| 最大输入失调电压 | 6000 µV |
| JESD-30 代码 | R-PDSO-G14 |
| JESD-609代码 | e0 |
| 功能数量 | 1 |
| 端子数量 | 14 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP14,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 电源 | 5,+-10 V |
| 认证状态 | Not Qualified |
| 标称响应时间 | 22 ns |
| 表面贴装 | YES |
| 技术 | BIPOLAR |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| NE529D-T | 529/BDA | NE529F | NE529N-B | SE529F | |
|---|---|---|---|---|---|
| 描述 | Comparator, 1 Func, 6000uV Offset-Max, 22ns Response Time, BIPolar, PDSO14, | Comparator, 1 Func, 6000uV Offset-Max, 12ns Response Time, BIPolar, CDFP14, | Comparator, 1 Func, 10000uV Offset-Max, 12ns Response Time, BIPolar, CDIP14, | Comparator, 1 Func, 10000uV Offset-Max, 22ns Response Time, BIPolar, PDIP14, | Comparator, 1 Func, 6000uV Offset-Max, 12ns Response Time, BIPolar, CDIP14, |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
| 包装说明 | SOP, SOP14,.25 | DFP, FL14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| 放大器类型 | COMPARATOR | COMPARATOR | COMPARATOR | COMPARATOR | COMPARATOR |
| 25C 时的最大偏置电流 (IIB) | 0.00002 µA | 1.2 µA | 20 µA | 0.00002 µA | 12 µA |
| 最大输入失调电压 | 6000 µV | 6000 µV | 10000 µV | 10000 µV | 6000 µV |
| JESD-30 代码 | R-PDSO-G14 | R-XDFP-F14 | R-XDIP-T14 | R-PDIP-T14 | R-XDIP-T14 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 14 | 14 | 14 | 14 | 14 |
| 最高工作温度 | 70 °C | 125 °C | 70 °C | 70 °C | 125 °C |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC |
| 封装代码 | SOP | DFP | DIP | DIP | DIP |
| 封装等效代码 | SOP14,.25 | FL14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | FLATPACK | IN-LINE | IN-LINE | IN-LINE |
| 电源 | 5,+-10 V | 5,+-10 V | 5,+-10 V | 5,+-10 V | 5,+-10 V |
| 标称响应时间 | 22 ns | 12 ns | 12 ns | 22 ns | 12 ns |
| 表面贴装 | YES | YES | NO | NO | NO |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 温度等级 | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | FLAT | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
单片机
单片机
ARM技术
DSP 与 ARM 处理器
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