Operational Amplifier, 1 Func, 500uV Offset-Max, CDIP14, CERAMIC, DIP-14
| 参数名称 | 属性值 |
| 厂商名称 | Force Technologies Ltd |
| 包装说明 | DIP, |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 放大器类型 | OPERATIONAL AMPLIFIER |
| 最大平均偏置电流 (IIB) | 0.002 µA |
| 标称共模抑制比 | 96 dB |
| 最大输入失调电压 | 500 µV |
| JESD-30 代码 | R-CDIP-T14 |
| 长度 | 19.2 mm |
| 负供电电压上限 | -22 V |
| 标称负供电电压 (Vsup) | -5 V |
| 功能数量 | 1 |
| 端子数量 | 14 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -60 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 座面最大高度 | 5 mm |
| 供电电压上限 | 22 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 温度等级 | MILITARY |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.5 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |
| FT108RF5U | FT108UF7U | FT108UF5U | FT108RH7U | FT108RH5U | FT108RF7U | FT108SH5U | |
|---|---|---|---|---|---|---|---|
| 描述 | Operational Amplifier, 1 Func, 500uV Offset-Max, CDIP14, CERAMIC, DIP-14 | Operational Amplifier, 1 Func, 500uV Offset-Max, CQCC20, CERAMIC, LCC-20 | Operational Amplifier, 1 Func, 500uV Offset-Max, CQCC20, CERAMIC, LCC-20 | Operational Amplifier, 1 Func, 500uV Offset-Max, CDIP8, CERAMIC, DIP-8 | Operational Amplifier, 1 Func, 500uV Offset-Max, CDIP8, CERAMIC, DIP-8 | Operational Amplifier, 1 Func, 500uV Offset-Max, CDIP14, CERAMIC, DIP-14 | Operational Amplifier, 1 Func, 500uV Offset-Max, MBCY8, METAL CAN, TO-5, 8 PIN |
| 厂商名称 | Force Technologies Ltd | Force Technologies Ltd | Force Technologies Ltd | Force Technologies Ltd | Force Technologies Ltd | Force Technologies Ltd | Force Technologies Ltd |
| 包装说明 | DIP, | QCCN, | QCCN, | DIP, | DIP, | DIP, | , |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 放大器类型 | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| 最大平均偏置电流 (IIB) | 0.002 µA | 0.002 µA | 0.002 µA | 0.002 µA | 0.002 µA | 0.002 µA | 0.002 µA |
| 标称共模抑制比 | 96 dB | 96 dB | 96 dB | 96 dB | 96 dB | 96 dB | 96 dB |
| 最大输入失调电压 | 500 µV | 500 µV | 500 µV | 500 µV | 500 µV | 500 µV | 500 µV |
| JESD-30 代码 | R-CDIP-T14 | S-CQCC-N20 | S-CQCC-N20 | R-CDIP-T8 | R-CDIP-T8 | R-CDIP-T14 | O-MBCY-W8 |
| 负供电电压上限 | -22 V | -22 V | -22 V | -22 V | -22 V | -22 V | -22 V |
| 标称负供电电压 (Vsup) | -5 V | -5 V | -5 V | -5 V | -5 V | -5 V | -5 V |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 14 | 20 | 20 | 8 | 8 | 14 | 8 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -60 °C | -60 °C | -60 °C | -60 °C | -60 °C | -60 °C | -60 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | METAL |
| 封装形状 | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | ROUND |
| 封装形式 | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | CYLINDRICAL |
| 供电电压上限 | 22 V | 22 V | 22 V | 22 V | 22 V | 22 V | 22 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | NO | NO | NO | NO |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | NO LEAD | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | WIRE |
| 端子位置 | DUAL | QUAD | QUAD | DUAL | DUAL | DUAL | BOTTOM |
| 长度 | 19.2 mm | 8.89 mm | 8.89 mm | 10.2 mm | 10.2 mm | 19.2 mm | - |
| 封装代码 | DIP | QCCN | QCCN | DIP | DIP | DIP | - |
| 座面最大高度 | 5 mm | 1.76 mm | 1.76 mm | 3.7 mm | 3.7 mm | 5 mm | - |
| 端子节距 | 2.5 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.5 mm | - |
| 宽度 | 7.62 mm | 8.89 mm | 8.89 mm | 7.62 mm | 7.62 mm | 7.62 mm | - |
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