IC,SYNC SRAM,128KX32,CMOS,QFP,100PIN,PLASTIC
参数名称 | 属性值 |
厂商名称 | NXP(恩智浦) |
零件包装代码 | QFP |
包装说明 | LQFP, |
针数 | 100 |
Reach Compliance Code | unknown |
最长访问时间 | 8.5 ns |
其他特性 | FLOW-THROUGH ARCHITECTURE |
JESD-30 代码 | R-PQFP-G100 |
长度 | 20 mm |
内存密度 | 4194304 bit |
内存集成电路类型 | CACHE SRAM |
内存宽度 | 32 |
功能数量 | 1 |
端子数量 | 100 |
字数 | 131072 words |
字数代码 | 128000 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 128KX32 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | LQFP |
封装形状 | RECTANGULAR |
封装形式 | FLATPACK, LOW PROFILE |
并行/串行 | PARALLEL |
认证状态 | Not Qualified |
座面最大高度 | 1.6 mm |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 3.135 V |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子形式 | GULL WING |
端子节距 | 0.65 mm |
端子位置 | QUAD |
宽度 | 14 mm |
MCM63F733ATQ8.5 | MCM63F733ATQ8.5R | MCM63F733ATQ11 | MCM63F733ATQ9 | MCM63F733ATQ10 | MCM63F733ATQ11R | MCM63F733ATQ9R | MCM63F733ATQ10R | |
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描述 | IC,SYNC SRAM,128KX32,CMOS,QFP,100PIN,PLASTIC | 128KX32 CACHE SRAM, 8.5ns, PQFP100, TQFP-100 | 128KX32 CACHE SRAM, 11ns, PQFP100, TQFP-100 | 128KX32 CACHE SRAM, 9ns, PQFP100, TQFP-100 | 128KX32 CACHE SRAM, 10ns, PQFP100, TQFP-100 | IC,SYNC SRAM,128KX32,CMOS,QFP,100PIN,PLASTIC | IC,SYNC SRAM,128KX32,CMOS,QFP,100PIN,PLASTIC | 128KX32 CACHE SRAM, 10ns, PQFP100, TQFP-100 |
厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
零件包装代码 | QFP | QFP | QFP | QFP | QFP | QFP | QFP | QFP |
包装说明 | LQFP, | LQFP, | LQFP, | LQFP, | LQFP, | LQFP, | LQFP, | LQFP, |
针数 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
最长访问时间 | 8.5 ns | 8.5 ns | 11 ns | 9 ns | 10 ns | 11 ns | 9 ns | 10 ns |
其他特性 | FLOW-THROUGH ARCHITECTURE | FLOW-THROUGH ARCHITECTURE | FLOW-THROUGH ARCHITECTURE | FLOW-THROUGH ARCHITECTURE | FLOW-THROUGH ARCHITECTURE | FLOW-THROUGH ARCHITECTURE | FLOW-THROUGH ARCHITECTURE | FLOW-THROUGH ARCHITECTURE |
JESD-30 代码 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 |
长度 | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm |
内存密度 | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
内存集成电路类型 | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM |
内存宽度 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
字数 | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
字数代码 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 128KX32 | 128KX32 | 128KX32 | 128KX32 | 128KX32 | 128KX32 | 128KX32 | 128KX32 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | LQFP | LQFP | LQFP | LQFP | LQFP | LQFP | LQFP | LQFP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
宽度 | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm |
ECCN代码 | - | 3A991 | 3A991 | 3A991 | 3A991 | 3A991 | 3A991 | 3A991 |
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