SN74LV368ADBLE概述

LV/LV-A/LVX/H SERIES, 6-BIT DRIVER, INVERTED OUTPUT, PDSO16, PLASTIC, SSOP-16

SN74LV368ADBLE规格参数

参数名称	属性值
厂商名称	Texas Instruments(德州仪器)
零件包装代码	SOIC
包装说明	SSOP,
针数	16
Reach Compliance Code	unknown
其他特性	ONE FUNCTION WITH TWO BITS
系列	LV/LV-A/LVX/H
JESD-30 代码	R-PDSO-G16
长度	6.2 mm
逻辑集成电路类型	BUS DRIVER
位数	6
功能数量	1
端口数量	2
端子数量	16
最高工作温度	85 °C
最低工作温度	-40 °C
输出特性	3-STATE
输出极性	INVERTED
封装主体材料	PLASTIC/EPOXY
封装代码	SSOP
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE, SHRINK PITCH
认证状态	Not Qualified
座面最大高度	2 mm
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	2 V
标称供电电压 (Vsup)	2.5 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子形式	GULL WING
端子节距	0.65 mm
端子位置	DUAL
宽度	5.3 mm

SN74LV368ADBLE相似产品对比

	SN74LV368ADBLE	SN74LV368APWR	SN74LV368APWLE	SN74LV368ADBR	SN74LV368ANSR	SN74LV368ADR
描述	LV/LV-A/LVX/H SERIES, 6-BIT DRIVER, INVERTED OUTPUT, PDSO16, PLASTIC, SSOP-16	LV/LV-A/LVX/H SERIES, 6-BIT DRIVER, INVERTED OUTPUT, PDSO16, PLASTIC, TSSOP-16	LV/LV-A/LVX/H SERIES, 6-BIT DRIVER, INVERTED OUTPUT, PDSO16, PLASTIC, TSSOP-16	LV/LV-A/LVX/H SERIES, 6-BIT DRIVER, INVERTED OUTPUT, PDSO16, PLASTIC, SSOP-16	LV/LV-A/LVX/H SERIES, 6-BIT DRIVER, INVERTED OUTPUT, PDSO16, PLASTIC, SOP-16	LV/LV-A/LVX/H SERIES, 6-BIT DRIVER, INVERTED OUTPUT, PDSO16, PLASTIC, SO-16
厂商名称	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)
零件包装代码	SOIC	TSSOP	TSSOP	SOIC	SOIC	SOIC
包装说明	SSOP,	PLASTIC, TSSOP-16	PLASTIC, TSSOP-16	SSOP, SSOP16,.3	SOP,	SOP,
针数	16	16	16	16	16	16
Reach Compliance Code	unknown	not_compliant	unknown	not_compliant	unknown	unknow
系列	LV/LV-A/LVX/H	LV/LV-A/LVX/H	LV/LV-A/LVX/H	LV/LV-A/LVX/H	LV/LV-A/LVX/H	LV/LV-A/LVX/H
JESD-30 代码	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16
长度	6.2 mm	5 mm	5 mm	6.2 mm	10.2 mm	9.9 mm
逻辑集成电路类型	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER
位数	6	6	6	6	6	6
功能数量	1	1	1	1	1	1
端口数量	2	2	2	2	2	2
端子数量	16	16	16	16	16	16
最高工作温度	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
输出极性	INVERTED	INVERTED	INVERTED	INVERTED	INVERTED	INVERTED
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	SSOP	TSSOP	TSSOP	SSOP	SOP	SOP
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE	SMALL OUTLINE
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	2 mm	1.2 mm	1.2 mm	2 mm	2 mm	1.75 mm
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	2 V	2 V	2 V	2 V	2 V	2 V
标称供电电压 (Vsup)	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
表面贴装	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子形式	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
端子节距	0.65 mm	0.65 mm	0.65 mm	0.65 mm	1.27 mm	1.27 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
宽度	5.3 mm	4.4 mm	4.4 mm	5.3 mm	5.3 mm	3.9 mm
其他特性	ONE FUNCTION WITH TWO BITS	-	ONE FUNCTION WITH TWO BITS	-	ONE FUNCTION WITH TWO BITS	ONE FUNCTION WITH TWO BITS

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