IC,COUNTER,UP,BI-QUINARY,HC-CMOS,DIP,16PIN,CERAMIC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 包装说明 | DIP, DIP16,.3 |
| Reach Compliance Code | not_compliant |
| 计数方向 | UP |
| JESD-30 代码 | R-XDIP-T16 |
| 负载/预设输入 | NO |
| 工作模式 | ASYNCHRONOUS |
| 功能数量 | 2 |
| 端子数量 | 16 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 2/6 V |
| 认证状态 | Not Qualified |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| SN74HC390J | SN74HC390FN | SN74HC390N1 | SNJ54HC390FH | SN74HC390NP1 | SN54HC390FH | |
|---|---|---|---|---|---|---|
| 描述 | IC,COUNTER,UP,BI-QUINARY,HC-CMOS,DIP,16PIN,CERAMIC | IC,COUNTER,UP,BI-QUINARY,HC-CMOS,LDCC,20PIN,PLASTIC | IC,COUNTER,UP,BI-QUINARY,HC-CMOS,DIP,16PIN,PLASTIC | IC,COUNTER,UP,BI-QUINARY,HC-CMOS,LLCC,20PIN,CERAMIC | IC,COUNTER,UP,BI-QUINARY,HC-CMOS,DIP,16PIN,PLASTIC | IC,COUNTER,UP,BI-QUINARY,HC-CMOS,LLCC,20PIN,CERAMIC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 包装说明 | DIP, DIP16,.3 | QCCJ, LDCC20,.4SQ | DIP, DIP16,.3 | QCCN, LCC20,.35SQ | DIP, DIP16,.3 | QCCN, LCC20,.35SQ |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | _compli |
| 计数方向 | UP | UP | UP | UP | UP | UP |
| JESD-30 代码 | R-XDIP-T16 | S-PQCC-J20 | R-PDIP-T16 | S-XQCC-N20 | R-PDIP-T16 | S-XQCC-N20 |
| 负载/预设输入 | NO | NO | NO | NO | NO | NO |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 功能数量 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 16 | 20 | 16 | 20 | 16 | 20 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 125 °C | 85 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -55 °C | -40 °C | -55 °C |
| 封装主体材料 | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | CERAMIC |
| 封装代码 | DIP | QCCJ | DIP | QCCN | DIP | QCCN |
| 封装等效代码 | DIP16,.3 | LDCC20,.4SQ | DIP16,.3 | LCC20,.35SQ | DIP16,.3 | LCC20,.35SQ |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE |
| 封装形式 | IN-LINE | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE | CHIP CARRIER |
| 电源 | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | NO | YES | NO | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | MILITARY | INDUSTRIAL | MILITARY |
| 端子形式 | THROUGH-HOLE | J BEND | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | NO LEAD |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | QUAD | DUAL | QUAD | DUAL | QUAD |
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