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MX29F002BPI-70

产品描述Flash, 256KX8, 70ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32
产品类别存储    存储   
文件大小908KB,共49页
制造商Macronix
官网地址http://www.macronix.com/en-us/Pages/default.aspx
下载文档 详细参数 选型对比 全文预览

MX29F002BPI-70概述

Flash, 256KX8, 70ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32

MX29F002BPI-70规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称Macronix
零件包装代码DIP
包装说明DIP, DIP32,.6
针数32
Reach Compliance Codeunknown
ECCN代码EAR99
最长访问时间70 ns
启动块BOTTOM
命令用户界面YES
数据轮询YES
耐久性100000 Write/Erase Cycles
JESD-30 代码R-PDIP-T32
JESD-609代码e0
长度41.91 mm
内存密度2097152 bit
内存集成电路类型FLASH
内存宽度8
功能数量1
部门数/规模1,2,1,3
端子数量32
字数262144 words
字数代码256000
工作模式ASYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织256KX8
封装主体材料PLASTIC/EPOXY
封装代码DIP
封装等效代码DIP32,.6
封装形状RECTANGULAR
封装形式IN-LINE
并行/串行PARALLEL
峰值回流温度(摄氏度)NOT SPECIFIED
电源5 V
编程电压5 V
认证状态Not Qualified
座面最大高度4.9 mm
部门规模16K,8K,32K,64K
最大待机电流0.000005 A
最大压摆率0.05 mA
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装NO
技术CMOS
温度等级INDUSTRIAL
端子面层Tin/Lead (Sn/Pb)
端子形式THROUGH-HOLE
端子节距2.54 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
切换位YES
类型NOR TYPE
宽度15.24 mm

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MX29F002/002N
2M-BIT [256K x 8] CMOS FLASH MEMORY
FEATURES
262,144x 8 only
Fast access time: 55/70/90/120ns
Low power consumption
- 30mA maximum active current(5MHz)
- 1uA typical standby current
Programming and erasing voltage 5V ± 10%
Command register architecture
- Byte Programming (7us typical)
- Sector Erase (16K-Byte x1, 8K-Byte x 2, 32K-Byte
x1, and 64K-Byte x 3)
Auto Erase (chip & sector) and Auto Program
- Automatically erase any combination of sectors or the
whole chip with Erase Suspend capability.
- Automatically programs and verifies data at specified
address
Erase Suspend/Erase Resume
- Suspends an erase operation to read data from, or
program data to, a sector that is not being erased, then
resumes the erase operation.
Status Reply
- Data polling & Toggle bit for detection of program and
erase cycle completion.
Sector protection
- Hardware method to disable any combination of
sectors from program or erase operations
- Sector protect/unprotect for 5V only system or 5V/
12V system
100,000 minimum erase/program cycles
Latch-up protected to 100mA from -1 to VCC+1V
Boot Code Sector Architecture
- T = Top Boot Sector
- B = Bottom Boot Sector
Hardware RESET pin(only for 29F002T/B)
- Resets internal state machine to read mode
Low VCC write inhibit is equal to or less than 3.2V
Package type:
- 32-pin PDIP
- 32-pin PLCC
- 32-pin TSOP (Type 1)
20 years data retention
GENERAL DESCRIPTION
The MX29F002T/B is a 2-mega bit Flash memory organ-
ized as 256K bytes of 8 bits only. MXIC's Flash memories
offer the most cost-effective and reliable read/write non-
volatile random access memory. The MX29F002T/B is
packaged in 32-pin PDIP,PLCC and 32-pin TSOP(I). It is
designed to be reprogrammed and erased in-system or in-
standard EPROM programmers.
The standard MX29F002T/B offers access time as fast as
55ns, allowing operation of high-speed microprocessors
without wait states. To eliminate bus contention, the
MX29F002T/B has separate chip enable (CE) and output
enable (OE) controls.
MXIC's Flash memories augment EPROM functionality
with in-circuit electrical erasure and programming. The
MX29F002T/B uses a command register to manage this
functionality. The command register allows for 100% TTL
level control inputs and fixed power supply levels during
erase and programming, while maintaining maximum
EPROM compatibility.
MXIC's Flash technology reliably stores memory contents
even after 100,000 erase and program cycles. The MXIC
cell is designed to optimize the erase and programming
mechanisms. In addition, the combination of advanced
tunnel oxide processing and low internal electric fields for
erase and programming operations produces reliable
cycling. The MX29F002T/B uses a 5.0V ± 10% VCC
supply to perform the High Reliability Erase and auto
Program/Erase algorithms.
The highest degree of latch-up protection is achieved with
MXIC's proprietary non-epi process. Latch-up protection
is proved for stresses up to 100 milliamps on address and
data pin from -1V to VCC + 1V.
P/N: PM0547
1
REV. 1.1, JUN. 14, 2001

MX29F002BPI-70相似产品对比

MX29F002BPI-70 MX29F002BTI-70
描述 Flash, 256KX8, 70ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Flash, 256KX8, 70ns, PDSO32, 8 X 20 MM, MO-142, PLASTIC, TSOP1-32
是否Rohs认证 不符合 不符合
厂商名称 Macronix Macronix
零件包装代码 DIP TSOP1
包装说明 DIP, DIP32,.6 TSOP1, TSSOP32,.8,20
针数 32 32
Reach Compliance Code unknown unknown
ECCN代码 EAR99 EAR99
最长访问时间 70 ns 70 ns
启动块 BOTTOM BOTTOM
命令用户界面 YES YES
数据轮询 YES YES
耐久性 100000 Write/Erase Cycles 100000 Write/Erase Cycles
JESD-30 代码 R-PDIP-T32 R-PDSO-G32
JESD-609代码 e0 e0
长度 41.91 mm 18.4 mm
内存密度 2097152 bit 2097152 bit
内存集成电路类型 FLASH FLASH
内存宽度 8 8
功能数量 1 1
部门数/规模 1,2,1,3 1,2,1,3
端子数量 32 32
字数 262144 words 262144 words
字数代码 256000 256000
工作模式 ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 85 °C 85 °C
最低工作温度 -40 °C -40 °C
组织 256KX8 256KX8
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 DIP TSOP1
封装等效代码 DIP32,.6 TSSOP32,.8,20
封装形状 RECTANGULAR RECTANGULAR
封装形式 IN-LINE SMALL OUTLINE, THIN PROFILE
并行/串行 PARALLEL PARALLEL
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED
电源 5 V 5 V
编程电压 5 V 5 V
认证状态 Not Qualified Not Qualified
座面最大高度 4.9 mm 1.2 mm
部门规模 16K,8K,32K,64K 16K,8K,32K,64K
最大待机电流 0.000005 A 0.000005 A
最大压摆率 0.05 mA 0.05 mA
最大供电电压 (Vsup) 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V
表面贴装 NO YES
技术 CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 THROUGH-HOLE GULL WING
端子节距 2.54 mm 0.5 mm
端子位置 DUAL DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED
切换位 YES YES
类型 NOR TYPE NOR TYPE
宽度 15.24 mm 8 mm

 
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