CYStech Electronics Corp.
1.0Amp. Surface Mount Schottky Barrier Diodes
Spec. No. : C752SA
Issued Date : 2006.07.13
Revised Date :2014.02.05
Page No. : 1/6
SK12SA thru SK1BSA
Features
•
For surface mounted applications.
•
For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications.
•
Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0.
•
Low leakage current.
•
High surge capability.
•
High temperature soldering: 250°C/10 seconds at terminals.
•
Exceeds environmental standards of MIL-S-19500/228.
Mechanical Data
•
Case: Molded plastic, JEDEC DO-214AC/SMA.
•
Terminals: Solder plated, solderable per MIL-STD-750 method 2026.
•
Polarity: Indicated by cathode band.
•
Mounting position: Any.
•
Weight: 0.064 gram, 0.002 ounce.
Ordering Information
Device
SK12SA-0-T4-G
SK13SA-0-T4-G
SK14SA-0-T4-G
SK15SA-0-T4-G
SK16SA-0-T4-G
SK18SA-0-T4-G
SK1BSA-0-T4-G
Package
Shipping
Marking
SK12
SK13
SK14
SK15
SK16
SK18
SK1B
SMA
(Pb-free lead plating and halogen-free
package)
7500 pcs / Tape & Reel
Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and
green compound products
Packing spec, T4 : 7500 pcs / tape & reel, 13” reel
Product rank, zero for no rank products
Product name
SK12SA thru SK1BSA
CYStek Product Specification
CYStech Electronics Corp.
Maximum Ratings and Electrical Characteristics
Spec. No. : C752SA
Issued Date : 2006.07.13
Revised Date :2014.02.05
Page No. : 2/6
(Rating
at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%. )
Parameter
Repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum instantaneous forward
Voltage @ I
F
=1A
(Note 1)
Maximum average forward
rectified current @ T
L
=100°C
Peak forward surge current @
8.3ms, single half sine-wave
superimposed on rated load
(JEDEC method)
Maximum DC reverse current at
Rated DC blocking
TJ=25°C
voltage
TJ=100°C
Typical thermal resistance,
junction to lead
Typical thermal resistance,
junction to case
Power
T
A
=25°C
Dissipation
T
C
=25°C
Typical diode junction
capacitance @ f=1MHz and
applied 4V reverse voltage
Storage temperature
Operating temperature
Symbol
V
RRM
V
RMS
V
R
V
F
I
O
SK12
20
14
20
SK13 SK14
30
40
21
28
30
40
0.5
Type
SK15 SK16 SK18
50
60
80
35
42
56
50
60
80
0.7
1
SK1B
100
70
100
0.85
Units
V
V
V
V
A
I
FSM
30
A
I
R
R
th, JA
R
th, JC
P
D
C
J
Tstg
T
J
0.5
10
85
18
1.5
7
120
-55 ~ +150
-55 ~ +125
mA
°C/W
°C/W
W
pF
°C
°C
Recommended soldering footprint
SK12SA thru SK1BSA
CYStek Product Specification
CYStech Electronics Corp.
Characteristic Curves
Spec. No. : C752SA
Issued Date : 2006.07.13
Revised Date :2014.02.05
Page No. : 3/6
SK12-SK14
SK16
SK18-SK1B
SK12SA thru SK1BSA
CYStek Product Specification
CYStech Electronics Corp.
Reel Dimension
Spec. No. : C752SA
Issued Date : 2006.07.13
Revised Date :2014.02.05
Page No. : 4/6
Carrier Tape Dimension
SK12SA thru SK1BSA
CYStek Product Specification
CYStech Electronics Corp.
Recommended wave soldering condition
Product
Pb-free devices
Peak Temperature
260 +0/-5
°C
Spec. No. : C752SA
Issued Date : 2006.07.13
Revised Date :2014.02.05
Page No. : 5/6
Soldering Time
5 +1/-1 seconds
Recommended temperature profile for IR reflow
Note : All temperatures refer to topside of the package, measured on the package body surface.
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Preheat
−Temperature
Min(T
S
min)
−Temperature
Max(T
S
max)
−Time(ts
min
to ts
max
)
Time maintained above:
−Temperature
(T
L
)
−
Time (t
L
)
Peak Temperature(T
P
)
Time within 5°C of actual peak
temperature(tp)
Ramp down rate
Time 25
°C
to peak temperature
Sn-Pb eutectic Assembly
3°C/second max.
100°C
150°C
60-120 seconds
183°C
60-150 seconds
240 +0/-5
°C
10-30 seconds
6°C/second max.
6 minutes max.
Pb-free Assembly
3°C/second max.
150°C
200°C
60-180 seconds
217°C
60-150 seconds
260 +0/-5
°C
20-40 seconds
6°C/second max.
8 minutes max.
SK12SA thru SK1BSA
CYStek Product Specification
FPGA/CPLD
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