CYStech Electronics Corp.
3.0Amp Schottky Barrier Rectifiers
Reverse Voltage 150V and 200V
Forward Current 3A
Spec. No. : C771LD
Issued Date : 2009.08.03
Revised Date : 2013.09.30
Page No. : 1/6
SB3150 and SB3200
Features
•
Low forward voltage drop
•
High current capability
•
High reliability
•
High surge current capability
•
Epitaxial construction
Outline
DO-201AD
Mechanical Data
•
Case : JEDEC DO-201AD molded plastic body
•
Epoxy : UL94V-0 rate flame retardant
•
Terminals: Plated axial leads, solderable per MIL-STD-202, method 208 guaranteed
•
Polarity: Color band denotes cathode end.
•
Mounting Position : Any.
•
Weight: 1.10 grams
Ordering Information
Device
SB3150- 0-TC-G
SB3200- 0-TC-G
Package
DO-201AD
(Pb-free lead plating and halogen-free package)
Shipping
1200 pcs / Tape & Box
Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and
green compound products
Packing spec, TC : 1200 pcs / tape & box
Product rank, zero for no rank products
Product name
SB3150 and SB3200
CYStek Product Specification
CYStech Electronics Corp.
Maximum Ratings and Electrical Characteristics
Spec. No. : C771LD
Issued Date : 2009.08.03
Revised Date : 2013.09.30
Page No. : 2/6
(Rating
at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%)
Parameter
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
1
Maximum instantaneous forward voltage at 3A
Maximum average forward rectified current
Peak forward surge current @8.3ms single half sine
wave superimposed on rated load (JEDEC method)
T
A
=25°C
Maximum DC reverse current at
1
rated DC blocking voltage
T
A
=100°C
Typical junction capacitance
Typical thermal resistance
Operating junction temperature range
Storage temperature range
Note: 1.Pulse test: pulse width≤300μs, duty cycle≤2%
Symbol
V
RRM
V
RMS
V
DC
V
F
I
F(AV)
I
FSM
I
R
C
J
R
θJA
T
J
T
STG
Type
SB3150
150
105
150
0.89
3
80
0.5
10
250
20
-55 ~ +150
-55 ~ +150
SB3200
200
140
200
Units
V
V
V
V
A
A
mA
pF
℃
/W
℃
℃
SB3150 and SB3200
CYStek Product Specification
CYStech Electronics Corp.
Characteristic Curves
Forward Current Derating Curve
3.5
Average Forward Current---I
F(AV)
(A)
3
2.5
2
1.5
1
0.5
0
0
20
40
60
80
100
120
140
160
Ambient Temperature---T
A
(℃)
Instantaneous Forward Current---I
F
(A)
Spec. No. : C771LD
Issued Date : 2009.08.03
Revised Date : 2013.09.30
Page No. : 3/6
Forward Current vs Forward Voltage
100
10
1
0.1
Tj=25℃, Pulse width=300μs,
1% Duty cycle
0.01
0.1
0.3
0.5
0.7
0.9
1.1
Forward Voltage---V
F
(V)
1.3
1.5
Maximum Non-Repetitive Forward Surge Current
100
80
60
40
20
0
1
10
Number of Cycles at 60Hz
100
Tj=25℃, 8.3ms Single
Half Sine Wave
JEDEC method
Reverse Leakage Current vs Reverse Voltage
100
Reverse Leakage Current---I
R
(mA)
Peak Forward Surge Current---I
FSM
(A)
10
1
Tj=75℃
0.1
Tj=25℃
0.01
0
20
40
60
80
100 120 140
Percent of Rated Peak
Reverse Voltage---(%)
Junction Capacitance vs Reverse Voltage
700
Junction Capacitance---C
J
(pF)
600
500
400
300
200
100
0
0.01
0.1
1
10
100
Reverse Voltage---V
R
(V)
SB3150 and SB3200
CYStek Product Specification
CYStech Electronics Corp.
Taping Dimension
Spec. No. : C771LD
Issued Date : 2009.08.03
Revised Date : 2013.09.30
Page No. : 4/6
SB3150 and SB3200
CYStek Product Specification
CYStech Electronics Corp.
Recommended wave soldering condition
Product
Pb-free devices
Peak Temperature
260 +0/-5
°C
Spec. No. : C771LD
Issued Date : 2009.08.03
Revised Date : 2013.09.30
Page No. : 5/6
Soldering Time
5 +1/-1 seconds
Recommended temperature profile for IR reflow
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Preheat
−Temperature
Min(T
S
min)
−Temperature
Max(T
S
max)
−Time(ts
min
to ts
max
)
Time maintained above:
−Temperature
(T
L
)
−
Time (t
L
)
Peak Temperature(T
P
)
Time within 5°C of actual peak
temperature(tp)
Ramp down rate
Time 25
°C
to peak
temperature
Sn-Pb eutectic Assembly
3°C/second max.
100°C
150°C
60-120 seconds
183°C
60-150 seconds
240 +0/-5
°C
10-30 seconds
6°C/second max.
6 minutes max.
Pb-free Assembly
3°C/second max.
150°C
200°C
60-180 seconds
217°C
60-150 seconds
260 +0/-5
°C
20-40 seconds
6°C/second max.
8 minutes max.
Note : All temperatures refer to topside of the package, measured on the package body surface.
SB3150 and SB3200
CYStek Product Specification
嵌入式系统
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