CYStech Electronics Corp.
Schottky Barrier Rectifiers
Reverse Voltage 70V to 100V Forward Current 2.0 Amperes
Spec. No. : C777LG
Issued Date : 2011.08.16
Revised Date :
Page No. : 1/3
SB270 thru SB2B0
Features
•
Metal semiconductor junction with guard ring
•
Epitaxial construction
•
Low forward voltage drop
•
High current capability
•
The plastic material carries UL recognition 94V-0
•
For use in low voltage, high frequency inverters, free wheeling,
and polarity protection applications
Mechanical Characteristics:
•Case: JEDEC DO-204AC(DO-15) molded plastic
•Terminals: Tin plated axial leads, solderable per MIL-STD-750, method 2026
•Polarity: Color band denotes cathode
•Mounting position: Any
•Weight : 0.014oz., 0.39grams
Maximum Ratings and Electrical Characteristics
(Rating
at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load. For
capacitive load, derate current by 20%)
Parameter
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
T
J
=25°C
T
J
=100°C
Maximum average forward rectified current @ T
L
=100
°
C
Peak forward surge current @8.3ms single half sine wave
superimposed on rated load (JEDEC method)
T
J
=25°C
Maximum DC reverse current at
rated DC blocking voltage
T
J
=100°C
Maximum forward voltage at 2A
Typical thermal resistance
(Note 1)
Typical junction capacitance
(Note 2)
Operating junction temperature range
Storage temperature range
Note: 1.Thermal resistance, junction to ambient.
2.Measured at1.0MHz and applied reverse voltage of 4.0V
DC
Symbol
V
RRM
V
RMS
V
DC
V
F
I
F(AV)
I
FSM
I
R
R
θJA
C
J
T
J
T
STG
Type
Units
SB270 SB280 SB290 SB2B0
70
80
90
100
V
49
56
81
70
V
70
80
90
100
V
0.79
V
0.69
2
A
60
0.5
10
20
50
-55 ~ +125
-55 ~ +150
A
mA
°
C/W
pF
°
C
°
C
SB270 thru SB2B0
CYStek Product Specification
CYStech Electronics Corp.
DO-204AC(DO-15) Dimension
Spec. No. : C777LG
Issued Date : 2011.08.16
Revised Date :
Page No. : 3/3
E
A
B
C
D
*:Typical
DIM
A
B
C
Inches
Min.
Max.
φ0.028 φ0.034
1.000
-
0.2300 0.3000
Millimeters
Min.
Max.
φ0.70
φ0.90
25.40
-
5.80
7.60
DIM
D
E
Inches
Min.
Max.
1.000
-
φ0.104 φ0.140
Millimeters
Min.
Max.
25.40
-
φ2.60
φ3.60
Notes :
1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
•
CYStek reserves the right to make changes to its products without notice.
•
CYStek
semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
SB270 thru SB2B0
CYStek Product Specification