CYStech Electronics Corp.
5.0Amp. Surface Mount Schottky Barrier Diodes
Spec. No. : C337SC
Issued Date : 2011.03.10
Revised Date :
Page No. : 1/5
SK520SC thru SK5100SC
Features
•
For surface mounted applications.
•
For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications
•
Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0
•
Low leakage current
•
High surge capability
•
High temperature soldering: 250°C/10 seconds at terminals
•
Exceeds environmental standards of MIL-S-19500/228
Mechanical Data
•
Case: Molded plastic, SMC/JEDEC DO-214AB.
•
Terminals: Solder plated, solderable per MIL-STD-750 method 2026
•
Polarity: Indicated by cathode band.
•
Mounting Position : Any.
•
Weight: 0.195 gram, 0.00585 ounce
Maximum Ratings and Electrical Characteristics
(
Rating at 25°C ambient temperature unless otherwise specified. )
Type
Parameter
Repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum instantaneous
forward voltage, I
F
=5A
(Note 1)
Average forward rectified current
Peak forward surge current @8.3ms
single half sine wave superimposed
on rated load (JEDEC method)
Maximum DC reverse current
V
R
=V
RRM
,T
A
=25
℃
V
R
=V
RRM
,T
A
=125
℃
Maximum thermal resistance,
Junction to ambient
Maximum thermal resistance,
Junction to case
Diode junction capacitance @
f=1MHz and applied 4VDC reverse
voltage
Storage temperature
Operating temperature
SK520SC-SK5100SC
Symbol
V
RRM
V
RMS
V
R
V
F
I
O
I
FSM
SK520 SK530 SK540 SK550 SK560 SK580 SK5100
20
14
20
0.55
30
21
30
0.55
40
28
40
0.55
50
35
50
0.7
5
150
60
42
60
0.7
80
56
80
0.85
100
70
100
0.85
Units
V
V
V
V
A
A
mA
mA
℃
/W
℃
/W
pF
℃
℃
I
R
R
th,JA
R
th,JC
C
J
Tstg
T
J
0.5
50
46(typ)
24(typ)
380(typ)
-55 ~ +150
-55 ~ +125
-55 ~ +150
CYStek Product Specification
CYStech Electronics Corp.
Characteristic Curves
Forward Current Derating Curve
6
Peak Forward Surge Current---I
FSM
(A)
160
Spec. No. : C337SC
Issued Date : 2011.03.10
Revised Date :
Page No. : 2/5
Maximum Non-Repetitive Forward Surge Current
Average Forward Current---Io(A)
5
4
3
2
1
0
0
50
100
CSMC520-540
CSMC550-5100
140
120
100
80
60
40
20
0
Tj=25℃, 8.3ms Single Half
Sine Wave
JEDEC method
150
200
1
10
100
Ambient Temperature---T
A
(℃)
Number of Cycles at 60Hz
Forward Current vs Forward Voltage
100
SK520-540
10
SK550-560
1
SK580-5100
0.1
Tj=25℃, Pulse width=300μs,
1% Duty cycle
Junction Capacitance vs Reverse Voltage
1400
Junction Capacitance---C
J
(pF)
1200
1000
800
600
400
200
0
0.01
Forward Current---I
F
(A)
0.01
0.1
0.3
0.5
0.7
0.9
1.1
1.3
1.5
0.1
1
10
100
Forward Voltage---V
F
(V)
Reverse Voltage---V
R
(V)
Reverse Leakage Current vs Reverse Voltage
100
Reverse Leakage Current---I
R
(mA)
10
Tj=75℃
1
0.1
Tj=25℃
0.01
0
20
40
60
80
100
120
140
Percent of Rated Peak
Reverse Voltage---(%)
SK520SC-SK5100SC
CYStek Product Specification
CYStech Electronics Corp.
Ordering Information
Device
SK520SC
SK530SC
SK540SC
SK550SC
SK560SC
SK580SC
SK5100SC
Package
SMC
SMC
SMC
SMC
SMC
SMC
SMC
Shipping
3000 pcs / Tape & Reel
3000 pcs / Tape & Reel
3000 pcs / Tape & Reel
3000 pcs / Tape & Reel
3000 pcs / Tape & Reel
3000 pcs / Tape & Reel
3000 pcs / Tape & Reel
Spec. No. : C337SC
Issued Date : 2011.03.10
Revised Date :
Page No. : 3/5
Marking
SS52
SS53
SS54
SS55
SS56
SS58
S510
SK520SC-SK5100SC
CYStek Product Specification
CYStech Electronics Corp.
Recommended temperature profile for IR reflow
Spec. No. : C337SC
Issued Date : 2011.03.10
Revised Date :
Page No. : 4/5
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Preheat
−Temperature
Min(T
S
min)
−Temperature
Max(T
S
max)
−Time(ts
min
to ts
max
)
Time maintained above:
−Temperature
(T
L
)
−
Time (t
L
)
Peak Temperature(T
P
)
Time within 5°C of actual peak
temperature(tp)
Ramp down rate
Time 25
°C
to peak
temperature
Sn-Pb eutectic Assembly
3°C/second max.
100°C
150°C
60-120 seconds
183°C
60-150 seconds
240 +0/-5
°C
10-30 seconds
6°C/second max.
6 minutes max.
Pb-free Assembly
3°C/second max.
150°C
200°C
60-180 seconds
217°C
60-150 seconds
260 +0/-5
°C
20-40 seconds
6°C/second max.
8 minutes max.
Note : All temperatures refer to topside of the package, measured on the package body surface.
SK520SC-SK5100SC
CYStek Product Specification
CYStech Electronics Corp.
DO-214AB/SMC Dimension
Spec. No. : C337SC
Issued Date : 2011.03.10
Revised Date :
Page No. : 5/5
DO-214AB/SMC Plastic
Surface Mounted Package
CYStek Package Code : SC
*:Typical
DIM
A
B
C
D
Inches
Min.
Max.
0.114
0.126
0.220
0.245
0.260
0.280
0.078
0.103
Millimeters
Min.
Max.
2.90
3.20
5.59
6.22
6.60
7.11
1.98
2.62
DIM
E
F
G
H
Inches
Min.
Max.
0.006
0.012
0.004
0.008
0.030
0.060
0.305
0.320
Millimeters
Min.
Max.
0.15
0.31
0.10
0.20
0.76
1.52
7.75
8.13
Notes :
1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
•
Lead : Pure tin plated.
•
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0.
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
•
CYStek reserves the right to make changes to its products without notice.
•
CYStek
semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
SK520SC-SK5100SC
CYStek Product Specification
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