CYStech Electronics Corp.
3.0Amp. Surface Mount Schottky Barrier Diodes
Spec. No. : C754SA
Issued Date : 2006.07.13
Revised Date :
Page No. : 1/3
SK3XSA Series
Features
•
For surface mounted applications.
•
For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications
•
Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0
•
Low leakage current
•
High surge capability
•
High temperature soldering: 250°C/10 seconds at terminals
•
Exceeds environmental standards of MIL-S-19500/228
•
Pb-free package
Mechanical Data
•
Case: SMA/DO-214AC molded plastic.
•
Terminals: Solder plated, solderable per MIL-STD-750 method 2026
•
Polarity: Indicated by cathode band.
•
Packaging: 12mm tape per EIA STD RS-481.
•
Weight: 0.064 gram, 0.002 ounce
Maximum Ratings and Electrical Characteristics
(
Rating at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz,
resistive or inductive load. For capacitive load, derate current by 20%. )
Parameter
Repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum instantaneous forward voltage,
IF=3A
Maximum average forward rectified current
at T
L
(See Fig. 1 )
Peak forward surge current @8.3ms single half
sine wave superimposed on rated load (JEDEC
method)
Maximum DC reverse current @ T
J
= 25
℃
At Rated DC Blocking Voltage @ T
J
= 100
℃
Maximum thermal resistance, Junction to
ambient
(Note 1)
Diode junction capacitance @
f = 1MHz and applied 4V reverse voltage
Operating Junction and Storage temperature
Rang
SK3XSA
Symbol
V
RRM
V
RMS
V
R
V
F
I
O
I
FSM
SK32
20
14
20
0.5
SK34
40
28
40
Type
SK36
60
42
60
0.7
3.0
80
SK38
80
56
80
SK3B
100
70
100
Units
V
V
V
V
A
A
mA
mA
℃
/W
pF
℃
0.85
I
R
R
th,JA
C
J
T
J,
Tstg
0.5
10
88 (typ)
200 (typ)
-55 ~ +125 / -55 ~ +150
Notes : 1.Mounted on PCB with 14mm² (0.013mm thickness) copper pad area.
CYStek Product Specification
CYStech Electronics Corp.
SMA Dimension
Spec. No. : C754SA
Issued Date : 2006.07.13
Revised Date :
Page No. : 3/3
Marking :
Device SK32
Code SK32
Device SK3B
Code
SK3B
SK34
SK34
SK36
SK36
SK38
SK38
A
B
C
D
H
E
F
G
SMA/DO-214AC Plastic
Surface Mounted Package
CYStek Package Code : SA
*:Typical
DIM
A
B
C
D
Inches
Min.
Max.
0.055
0.062
0.098
0.114
0.157
0.181
0.078
0.096
Millimeters
Min.
Max.
1.40
1.60
2.50
2.90
4.00
4.60
2.00
2.44
DIM
E
F
G
H
Inches
Min.
Max.
0.030
0.060
0.002
0.008
0.188
0.208
0.006
0.012
Millimeters
Min.
Max.
0.76
1.52
0.051
0.203
4.80
5.28
0.152
0.305
Notes :
1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
•
Lead : 42 Alloy ; solder plating
•
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
•
CYStek reserves the right to make changes to its products without notice.
•
CYStek
semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
SK3XSA
CYStek Product Specification
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