CYStech Electronics Corp.
2.0Amp. Surface Mount Schottky Barrier Diodes
Spec. No. : C753SA
Issued Date : 2006.07.13
Revised Date :2013.05.22
Page No. : 1/6
SK2XSA Series
Features
•
For surface mounted applications.
•
For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications
•
Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0
•
Low leakage current
•
High surge capability
•
High temperature soldering: 250°C/10 seconds at terminals
•
Exceeds environmental standards of MIL-S-19500/228
Mechanical Data
•
Case: SMA/DO-214AC molded plastic.
•
Terminals: Solder plated, solderable per MIL-STD-750 method 2026
•
Polarity: Indicated by cathode band.
•
Packaging: 12mm tape per EIA STD RS-481.
•
Weight: 0.064 gram, 0.002 ounce
Maximum Ratings and Electrical Characteristics
(
Rating at 25°C ambient temperature unless otherwise specified. )
Parameter
Repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum instantaneous
forward voltage, I
F
=2A
(Note 1)
Average forward rectified current
Peak forward surge current @8.3ms single half
sine wave superimposed on rated load (JEDEC
method)
Maximum DC reverse current
V
R
=V
RRM
,T
A
=25
℃
(Note 1)
V
R
=V
RRM
,T
A
=125
℃
(Note 1)
Maximum thermal resistance, Junction to
ambient
(Note 2)
Maximum thermal resistance, Junction to case
T
A
=25
°
C
(Note 2)
Power dissipation
T
C
=25
°
C
Diode junction capacitance @ f=1MHz and
applied 4V reverse voltage
Storage temperature
Operating temperature
Symbol
V
RRM
V
RMS
V
R
V
F
I
O
I
FSM
SK22
20
14
20
0.5
SK24
40
28
40
0.5
Type
SK26
60
42
60
0.7
2
80
SK28
80
56
80
0.85
SK2B
100
70
100
0.85
Units
V
V
V
V
A
A
I
R
R
θJA
R
θJC
P
D
C
J
Tstg
T
J
0.5
20
80
32
1.3
3.1
110 (typ)
-55 ~ +150
-55 ~ +125
mA
mA
℃
/W
W
pF
℃
℃
Notes : 1.Pulse test, pulse width=300μsec, 2% duty cycle
2.Mounted on PCB with 14mm² (0.013mm thickness) copper pad area.
SK2XSA
CYStek Product Specification
CYStech Electronics Corp.
Recommended wave soldering condition
Product
Pb-free devices
Peak Temperature
265 +0/-5
°C
Spec. No. : C753SA
Issued Date : 2006.07.13
Revised Date :2013.05.22
Page No. : 5/6
Soldering Time
5 +1/-1 seconds
Recommended temperature profile for IR reflow
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Preheat
−Temperature
Min(T
S
min)
−Temperature
Max(T
S
max)
−Time(ts
min
to ts
max
)
Time maintained above:
−Temperature
(T
L
)
−
Time (t
L
)
Peak Temperature(T
P
)
Time within 5°C of actual peak
temperature(tp)
Ramp down rate
Time 25
°C
to peak
temperature
Sn-Pb eutectic Assembly
3°C/second max.
100°C
150°C
60-120 seconds
183°C
60-150 seconds
240 +0/-5
°C
10-30 seconds
6°C/second max.
6 minutes max.
Pb-free Assembly
3°C/second max.
150°C
200°C
60-180 seconds
217°C
60-150 seconds
265 +0/-5
°C
20-40 seconds
6°C/second max.
8 minutes max.
Note : All temperatures refer to topside of the package, measured on the package body surface.
SK2XSA
CYStek Product Specification
DSP 与 ARM 处理器
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