CYStech Electronics Corp.
2.0Amp. Surface Mount Schottky Barrier Diodes
Spec. No. : C347SC
Issued Date : 2011.05.30
Revised Date :
Page No. : 1/ 5
SK220SC-SK2150SC Series
Features
•
For surface mounted applications.
•
For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications
•
Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0
•
Low leakage current
•
High surge capability
•
High temperature soldering: 250°C/10 seconds at terminals
•
Exceeds environmental standards of MIL-S-19500/228
Mechanical Data
•
Case: Molded plastic, SMC/JEDEC DO-214AB.
•
Terminals: Solder plated, solderable per MIL-STD-750 method 2026
•
Polarity: Indicated by cathode band.
•
Mounting Position : Any.
•
Weight: 0.195 gram, 0.00585 ounce
Maximum Ratings and Electrical Characteristics
(
Rating at 25°C ambient temperature unless otherwise specified. )
Parameter
Repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum instantaneous
forward voltage, I
F
=2A
Average forward rectified current
Peak forward surge current @8.3ms single half sine
wave superimposed on rated load (JEDEC method)
Maximum DC reverse current
V
R
=V
RRM
,T
A
=25
℃
V
R
=V
RRM
,T
A
=125
℃
Maximum thermal resistance, Junction to ambient
Maximum thermal resistance, Junction to lead
Diode junction capacitance @ f=1MHz and applied
4VDC reverse voltage
Storage temperature
Operating temperature
Note : Measure on PCB with 0.2”×0.2”(5mm×5mm) copper pad area.
Symbol
V
RRM
V
RMS
V
R
V
F
I
O
I
FSM
I
R
R
th,JA
R
th,JL
C
J
Tstg
T
J
Type
Units
SK220 SK240 SK260 SK2100 SK2150
20
40
60
100
150
V
14
28
42
70
105
V
20
40
60
100
150
V
0.50
0.7
2
50
0.5
10
55
20
(Note)
170(typ)
-55 ~ +125
-55 ~ +150
-55 ~ +150
0.85
0.9
V
A
A
mA
mA
℃
/W
pF
℃
℃
SK220SC-SK2150SC
CYStek Product Specification
CYStech Electronics Corp.
Characteristic Curves
Forward Current Derating Curve
2.5
Average Forward Current---Io(A)
Peak Forward Surge Current---I
FSM
(A)
Spec. No. : C347SC
Issued Date : 2011.05.30
Revised Date :
Page No. : 2/ 5
Maximum Non-Repetitive Forward Surge Current
60
50
40
30
20
10
0
Tj=25℃, 8.3ms Single Half
Sine Wave
JEDEC method
2
1.5
1
0.5
0
0
50
100
150
200
Ambient Temperature---T
A
(℃)
1
10
Number of Cycles at 60Hz
100
Forward Current vs Forward Voltage
10
Instantaneous Forward Current---I
F
(A)
Junction Capacitance vs Reverse Voltage
700
Junction Capacitance---C
J
(pF)
SK22-SK24
600
500
400
300
200
100
0
1
SK26
SK28-SK2B
Tj=25℃, Pulse width=300μs,
1% Duty cycle
0.1
0.01
0.1
0.3
0.5
0.7
0.9
1.1
Forward Voltage---V
F
(V)
1.3
1.5
0.01
0.1
1
10
100
Reverse Voltage---V
R
(V)
Reverse Leakage Current vs Reverse Voltage
100
Reverse Leakage Current---I
R
(mA)
10
1
Tj=75℃
0.1
Tj=25℃
0.01
0
20
40
60
80
100 120 140
Percent of Rated Peak
Reverse Voltage---(%)
SK220SC-SK2150SC
CYStek Product Specification
CYStech Electronics Corp.
Ordering Information
Device
SK220SC
SK240SC
SK260SC
SK2100SC
SK2150SC
Package
SMC
SMC
SMC
SMC
SMC
Shipping
3000 pcs / Tape & Reel
3000 pcs / Tape & Reel
3000 pcs / Tape & Reel
3000 pcs / Tape & Reel
3000 pcs / Tape & Reel
Spec. No. : C347SC
Issued Date : 2011.05.30
Revised Date :
Page No. : 3/ 5
Marking
SK22
SK24
SK26
S210
S215
SK220SC-SK2150SC
CYStek Product Specification
CYStech Electronics Corp.
Recommended temperature profile for IR reflow
Spec. No. : C347SC
Issued Date : 2011.05.30
Revised Date :
Page No. : 4/ 5
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Preheat
−Temperature
Min(T
S
min)
−Temperature
Max(T
S
max)
−Time(ts
min
to ts
max
)
Time maintained above:
−Temperature
(T
L
)
−
Time (t
L
)
Peak Temperature(T
P
)
Time within 5°C of actual peak
temperature(tp)
Ramp down rate
Time 25
°C
to peak
temperature
Sn-Pb eutectic Assembly
3°C/second max.
100°C
150°C
60-120 seconds
183°C
60-150 seconds
240 +0/-5
°C
10-30 seconds
6°C/second max.
6 minutes max.
Pb-free Assembly
3°C/second max.
150°C
200°C
60-180 seconds
217°C
60-150 seconds
260 +0/-5
°C
20-40 seconds
6°C/second max.
8 minutes max.
Note : All temperatures refer to topside of the package, measured on the package body surface.
SK220SC-SK2150SC
CYStek Product Specification
CYStech Electronics Corp.
DO-214AB/SMC Dimension
Spec. No. : C347SC
Issued Date : 2011.05.30
Revised Date :
Page No. : 5/ 5
DO-214AB/SMC Plastic
Surface Mounted Package
CYStek Package Code : SC
*:Typical
DIM
A
B
C
D
Inches
Min.
Max.
0.114
0.126
0.220
0.245
0.260
0.280
0.078
0.103
Millimeters
Min.
Max.
2.90
3.20
5.59
6.22
6.60
7.11
1.98
2.62
DIM
E
F
G
H
Inches
Min.
Max.
0.006
0.012
0.004
0.008
0.030
0.060
0.305
0.320
Millimeters
Min.
Max.
0.15
0.31
0.10
0.20
0.76
1.52
7.75
8.13
Notes :
1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
•
Lead : Pure tin plated.
•
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0.
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
•
CYStek reserves the right to make changes to its products without notice.
•
CYStek
semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
SK220SC-SK2150SC
CYStek Product Specification
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