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A-70567-0288: 产品描述2.54mm Pitch C-GridÂ® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits, 0.38Î¼m Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing; 文件大小35KB，共2页; 制造商Molex; 官网地址https://www.molex.com/molex/home

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A-70567-0288概述

2.54mm Pitch C-GridÂ® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits, 0.38Î¼m Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing

A-70567-0288相似产品对比

	A-70567-0288	15-80-0369
描述	2.54mm Pitch C-GridÂ® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits, 0.38Î¼m Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing	2.54mm Pitch C-GridÂ® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits, 0.38Î¼m Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing

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