RISC Microprocessor, 32-Bit, 50MHz, CMOS, MQFP160
参数名称 | 属性值 |
厂商名称 | IDT (Integrated Device Technology) |
零件包装代码 | QFP |
针数 | 160 |
Reach Compliance Code | compliant |
其他特性 | 5 PIPELINE STAGES |
地址总线宽度 | 32 |
位大小 | 32 |
边界扫描 | NO |
外部数据总线宽度 | 32 |
格式 | FIXED POINT |
集成缓存 | NO |
JESD-30 代码 | S-MQFP-G160 |
JESD-609代码 | e0 |
低功率模式 | NO |
DMA 通道数量 | |
外部中断装置数量 | 6 |
串行 I/O 数 | |
端子数量 | 160 |
片上数据RAM宽度 | |
最高工作温度 | 85 °C |
最低工作温度 | |
封装主体材料 | METAL |
封装代码 | QFP |
封装形状 | SQUARE |
封装形式 | FLATPACK |
认证状态 | Not Qualified |
RAM(字数) | 0 |
速度 | 50 MHz |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | OTHER |
端子面层 | TIN LEAD |
端子形式 | GULL WING |
端子位置 | QUAD |
uPs/uCs/外围集成电路类型 | MICROPROCESSOR, RISC |
IDT79R3000AE-50M | IDT79R3000A-50G144 | IDT79R3000A-50M | IDT79R3000AE-50G144 | IDT79R3000A-50G175 | IDT79R3000AE-50G175 | |
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描述 | RISC Microprocessor, 32-Bit, 50MHz, CMOS, MQFP160 | RISC Microprocessor, 32-Bit, 50MHz, CMOS, CPGA144, PGA-144 | RISC Microprocessor, 32-Bit, 50MHz, CMOS, MQFP160 | RISC Microprocessor, 32-Bit, 50MHz, CMOS, CPGA144, PGA-144 | RISC Microprocessor, 32-Bit, 50MHz, CMOS, CPGA175, PGA-175 | RISC Microprocessor, 32-Bit, 50MHz, CMOS, CPGA175, PGA-175 |
厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
零件包装代码 | QFP | PGA | QFP | PGA | PGA | PGA |
针数 | 160 | 144 | 160 | 144 | 175 | 175 |
Reach Compliance Code | compliant | unknown | compliant | unknown | unknown | unknown |
其他特性 | 5 PIPELINE STAGES | 5 PIPELINE STAGES | 5 PIPELINE STAGES | 5 PIPELINE STAGES | 5 PIPELINE STAGES | 5 PIPELINE STAGES |
地址总线宽度 | 32 | 32 | 32 | 32 | 32 | 32 |
位大小 | 32 | 32 | 32 | 32 | 32 | 32 |
边界扫描 | NO | NO | NO | NO | NO | NO |
外部数据总线宽度 | 32 | 32 | 32 | 32 | 32 | 32 |
格式 | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
集成缓存 | NO | NO | NO | NO | NO | NO |
JESD-30 代码 | S-MQFP-G160 | S-CPGA-P144 | S-MQFP-G160 | S-CPGA-P144 | S-CPGA-P175 | S-CPGA-P175 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
低功率模式 | NO | NO | NO | NO | NO | NO |
外部中断装置数量 | 6 | 6 | 6 | 6 | 6 | 6 |
端子数量 | 160 | 144 | 160 | 144 | 175 | 175 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
封装主体材料 | METAL | CERAMIC, METAL-SEALED COFIRED | METAL | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | QFP | PGA | QFP | PGA | PGA | PGA |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | FLATPACK | GRID ARRAY | FLATPACK | GRID ARRAY | GRID ARRAY | GRID ARRAY |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
速度 | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | NO | YES | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER |
端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
端子形式 | GULL WING | PIN/PEG | GULL WING | PIN/PEG | PIN/PEG | PIN/PEG |
端子位置 | QUAD | PERPENDICULAR | QUAD | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR |
uPs/uCs/外围集成电路类型 | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC |
包装说明 | - | PGA, | QFP, | PGA, | PGA, | PGA, |
长度 | - | 39.9923 mm | - | 39.9923 mm | 39.9923 mm | 39.9923 mm |
座面最大高度 | - | 4.826 mm | - | 4.826 mm | 5.207 mm | 5.207 mm |
端子节距 | - | 2.54 mm | - | 2.54 mm | 2.54 mm | 2.54 mm |
宽度 | - | 39.9923 mm | - | 39.9923 mm | 39.9923 mm | 39.9923 mm |
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