RISC Microprocessor, 32-Bit, 33MHz, CMOS, PBGA196, MINI, PLASTIC, BGA-196
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Intel(英特尔) |
零件包装代码 | BGA |
包装说明 | BGA, BGA196(UNSPEC) |
针数 | 196 |
Reach Compliance Code | compliant |
其他特性 | OPERATING CASE TEMPERATURE 0 TO 100 C |
地址总线宽度 | 32 |
位大小 | 32 |
边界扫描 | YES |
最大时钟频率 | 16.67 MHz |
外部数据总线宽度 | 32 |
格式 | FIXED POINT |
集成缓存 | NO |
JESD-30 代码 | S-PBGA-B196 |
低功率模式 | YES |
湿度敏感等级 | 1 |
端子数量 | 196 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | BGA |
封装等效代码 | BGA196(UNSPEC) |
封装形状 | SQUARE |
封装形式 | GRID ARRAY |
峰值回流温度(摄氏度) | 225 |
电源 | 3.3,3.3/5 V |
认证状态 | Not Qualified |
速度 | 33 MHz |
最大压摆率 | 225 mA |
最大供电电压 | 3.45 V |
最小供电电压 | 3.15 V |
标称供电电压 | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
端子形式 | BALL |
端子位置 | BOTTOM |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
uPs/uCs/外围集成电路类型 | MICROPROCESSOR, RISC |
GD80960JC-33 | GD80960JS-33 | NG80960JC-40 | NG80960JC-33 | GD80960JC-50 | GD80960JS-16 | |
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描述 | RISC Microprocessor, 32-Bit, 33MHz, CMOS, PBGA196, MINI, PLASTIC, BGA-196 | RISC Microprocessor, 32-Bit, 33MHz, CMOS, PBGA196, PLASTIC, BGA-196 | RISC Microprocessor, 32-Bit, 40MHz, CMOS, PQFP132, PLASTIC, QFP-132 | RISC Microprocessor, 32-Bit, 33MHz, CMOS, PQFP132, PLASTIC, QFP-132 | RISC Microprocessor, 32-Bit, 50MHz, CMOS, PBGA196, MINI, PLASTIC, BGA-196 | RISC Microprocessor, 32-Bit, 16MHz, CMOS, PBGA196, MINI, PLASTIC, BGA-196 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | BGA | BGA | QFP | QFP | BGA | BGA |
包装说明 | BGA, BGA196(UNSPEC) | BGA, BGA196(UNSPEC) | BQFP, SPQFP132,1.1SQ | BQFP, SPQFP132,1.1SQ | BGA, BGA196(UNSPEC) | BGA, BGA196(UNSPEC) |
针数 | 196 | 196 | 132 | 132 | 196 | 196 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
其他特性 | OPERATING CASE TEMPERATURE 0 TO 100 C | OPERATING CASE TEMPERATURE 0 TO 100 C | OPERATING CASE TEMPERATURE 0 TO 100 C | OPERATING CASE TEMPERATURE 0 TO 100 C | OPERATING CASE TEMPERATURE 0 TO 100 C | OPERATING CASE TEMPERATURE 0 TO 100 C |
地址总线宽度 | 32 | 32 | 32 | 32 | 32 | 32 |
位大小 | 32 | 32 | 32 | 32 | 32 | 32 |
边界扫描 | YES | YES | YES | YES | YES | YES |
最大时钟频率 | 16.67 MHz | 33.3 MHz | 20 MHz | 16.67 MHz | 25 MHz | 16 MHz |
外部数据总线宽度 | 32 | 32 | 32 | 32 | 32 | 32 |
格式 | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
集成缓存 | NO | YES | NO | NO | NO | NO |
JESD-30 代码 | S-PBGA-B196 | S-PBGA-B196 | S-PQFP-G132 | S-PQFP-G132 | S-PBGA-B196 | S-PBGA-B196 |
低功率模式 | YES | YES | YES | YES | YES | YES |
端子数量 | 196 | 196 | 132 | 132 | 196 | 196 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | BGA | BGA | BQFP | BQFP | BGA | BGA |
封装等效代码 | BGA196(UNSPEC) | BGA196(UNSPEC) | SPQFP132,1.1SQ | SPQFP132,1.1SQ | BGA196(UNSPEC) | BGA196(UNSPEC) |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | GRID ARRAY | GRID ARRAY | FLATPACK, BUMPER | FLATPACK, BUMPER | GRID ARRAY | GRID ARRAY |
峰值回流温度(摄氏度) | 225 | 225 | NOT SPECIFIED | NOT SPECIFIED | 225 | 225 |
电源 | 3.3,3.3/5 V | 3.3,3.3/5 V | 3.3,3.3/5 V | 3.3,3.3/5 V | 3.3,3.3/5 V | 3.3,3.3/5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
速度 | 33 MHz | 33 MHz | 40 MHz | 33 MHz | 50 MHz | 16 MHz |
最大压摆率 | 225 mA | 250 mA | 267 mA | 225 mA | 330 mA | 120 mA |
最大供电电压 | 3.45 V | 3.45 V | 3.45 V | 3.45 V | 3.45 V | 3.45 V |
最小供电电压 | 3.15 V | 3.15 V | 3.15 V | 3.15 V | 3.15 V | 3.15 V |
标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
端子形式 | BALL | BALL | GULL WING | GULL WING | BALL | BALL |
端子位置 | BOTTOM | BOTTOM | QUAD | QUAD | BOTTOM | BOTTOM |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
uPs/uCs/外围集成电路类型 | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC |
厂商名称 | Intel(英特尔) | Intel(英特尔) | - | Intel(英特尔) | Intel(英特尔) | Intel(英特尔) |
湿度敏感等级 | 1 | 1 | - | - | 1 | 1 |
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