HI9P0302-9概述

IC,ANALOG SWITCH,DUAL,DPST,CMOS,SOP,14PIN,PLASTIC

HI9P0302-9规格参数

参数名称	属性值
是否Rohs认证	不符合
厂商名称	Renesas(瑞萨电子)
Reach Compliance Code	not_compliant
模拟集成电路 - 其他类型	DPST
JESD-30 代码	R-PDSO-G14
JESD-609代码	e0
标称负供电电压 (Vsup)	-15 V
正常位置	NO
功能数量	2
端子数量	14
最大通态电阻 (Ron)	75 Ω
最高工作温度	85 °C
最低工作温度	-40 °C
输出	SEPARATE OUTPUT
封装主体材料	PLASTIC/EPOXY
封装代码	SOP
封装等效代码	SOP14,.25
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE
电源	+-15 V
认证状态	Not Qualified
标称供电电压 (Vsup)	15 V
表面贴装	YES
最长接通时间	300 ns
切换	BREAK-BEFORE-MAKE
技术	CMOS
温度等级	INDUSTRIAL
端子面层	Tin/Lead (Sn/Pb)
端子形式	GULL WING
端子节距	1.27 mm
端子位置	DUAL

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HI9P0302-9相似产品对比

	HI9P0302-9	HI9P0300-9	HI9P0304-9	HI9P0300-5	HI9P0306-5	HI9P0304-5	HI9P0306-9	HI9P0305-9	HI9P0307-9	HI1-0306-2
描述	IC,ANALOG SWITCH,DUAL,DPST,CMOS,SOP,14PIN,PLASTIC	IC,ANALOG SWITCH,DUAL,SPST,CMOS,SOP,14PIN,PLASTIC	IC,ANALOG SWITCH,DUAL,SPST,CMOS,SOP,14PIN,PLASTIC	IC,ANALOG SWITCH,DUAL,SPST,CMOS,SOP,14PIN,PLASTIC	IC,ANALOG SWITCH,DUAL,DPST,CMOS,SOP,14PIN,PLASTIC	IC,ANALOG SWITCH,DUAL,SPST,CMOS,SOP,14PIN,PLASTIC	IC,ANALOG SWITCH,DUAL,DPST,CMOS,SOP,14PIN,PLASTIC	IC,ANALOG SWITCH,SINGLE,SPDT,CMOS,SOP,14PIN,PLASTIC	IC,ANALOG SWITCH,DUAL,SPDT,CMOS,SOP,14PIN,PLASTIC	IC,ANALOG SWITCH,DUAL,DPST,CMOS,DIP,14PIN,CERAMIC
是否Rohs认证	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	_compli
厂商名称	Renesas(瑞萨电子)	Renesas(瑞萨电子)	-	-	Renesas(瑞萨电子)	Renesas(瑞萨电子)	Renesas(瑞萨电子)	Renesas(瑞萨电子)	Renesas(瑞萨电子)	Renesas(瑞萨电子)
模拟集成电路 - 其他类型	DPST	SPST	SPST	SPST	DPST	-	DPST	SPDT	SPDT	DPST
JESD-30 代码	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	-	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	R-XDIP-T14
JESD-609代码	e0	e0	e0	e0	e0	-	e0	e0	e0	e0
标称负供电电压 (Vsup)	-15 V	-15 V	-15 V	-15 V	-15 V	-	-15 V	-15 V	-15 V	-15 V
正常位置	NO	NO	NO	NO	NO	-	NO	-	-	NO
功能数量	2	2	2	2	2	-	2	1	2	2
端子数量	14	14	14	14	14	-	14	14	14	14
最大通态电阻 (Ron)	75 Ω	75 Ω	75 Ω	75 Ω	75 Ω	-	75 Ω	75 Ω	75 Ω	75 Ω
最高工作温度	85 °C	85 °C	85 °C	70 °C	70 °C	-	85 °C	85 °C	85 °C	125 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-	-	-	-40 °C	-40 °C	-40 °C	-55 °C
输出	SEPARATE OUTPUT	SEPARATE OUTPUT	SEPARATE OUTPUT	SEPARATE OUTPUT	SEPARATE OUTPUT	-	SEPARATE OUTPUT	-	SEPARATE OUTPUT	SEPARATE OUTPUT
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC
封装代码	SOP	SOP	SOP	SOP	SOP	-	SOP	SOP	SOP	DIP
封装等效代码	SOP14,.25	SOP14,.25	SOP14,.25	SOP14,.25	SOP14,.25	-	SOP14,.25	SOP14,.25	SOP14,.25	DIP14,.3
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	-	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE
电源	+-15 V	+-15 V	+-15 V	+-15 V	+-15 V	-	+-15 V	+-15 V	+-15 V	+-15 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified
标称供电电压 (Vsup)	15 V	15 V	15 V	15 V	15 V	-	15 V	15 V	15 V	15 V
表面贴装	YES	YES	YES	YES	YES	-	YES	YES	YES	NO
最长接通时间	300 ns	300 ns	250 ns	300 ns	250 ns	-	250 ns	250 ns	250 ns	250 ns
切换	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	-	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE
技术	CMOS	CMOS	CMOS	CMOS	CMOS	-	CMOS	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	-	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	MILITARY
端子面层	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
端子形式	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	-	GULL WING	GULL WING	GULL WING	THROUGH-HOLE
端子节距	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	-	1.27 mm	1.27 mm	1.27 mm	2.54 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	-	DUAL	DUAL	DUAL	DUAL

HI9P0302-9

HI9P0302-9概述

HI9P0302-9规格参数

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HI9P0302-9相似产品对比

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