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SZMMBZ15VALT1

产品描述40W, UNIDIRECTIONAL, 2 ELEMENT, SILICON, TVS DIODE, TO-236, PLASTIC, CASE 318-08, 3 PIN
产品类别分立半导体    二极管   
文件大小115KB,共7页
制造商ON Semiconductor(安森美)
官网地址http://www.onsemi.cn
下载文档 详细参数 选型对比 全文预览

SZMMBZ15VALT1概述

40W, UNIDIRECTIONAL, 2 ELEMENT, SILICON, TVS DIODE, TO-236, PLASTIC, CASE 318-08, 3 PIN

SZMMBZ15VALT1规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称ON Semiconductor(安森美)
零件包装代码SOT-23
包装说明PLASTIC, CASE 318-08, 3 PIN
针数3
制造商包装代码CASE 318-08
Reach Compliance Codenot_compliant
ECCN代码EAR99
Factory Lead Time1 week
最大击穿电压15.75 V
最小击穿电压14.25 V
配置COMMON ANODE, 2 ELEMENTS
二极管元件材料SILICON
二极管类型TRANS VOLTAGE SUPPRESSOR DIODE
JEDEC-95代码TO-236
JESD-30 代码R-PDSO-G3
JESD-609代码e0
最大非重复峰值反向功率耗散40 W
元件数量2
端子数量3
最高工作温度150 °C
最低工作温度-55 °C
封装主体材料PLASTIC/EPOXY
封装形状RECTANGULAR
封装形式SMALL OUTLINE
峰值回流温度(摄氏度)240
极性UNIDIRECTIONAL
最大功率耗散0.225 W
认证状态Not Qualified
最大重复峰值反向电压12 V
表面贴装YES
技术ZENER
端子面层Tin/Lead (Sn/Pb)
端子形式GULL WING
端子位置DUAL
处于峰值回流温度下的最长时间30

SZMMBZ15VALT1文档预览

MMBZ5V6ALT1 Series
24 and 40 Watt Peak Power
Zener Transient Voltage
Suppressors
SOT−23 Dual Common Anode Zeners
for ESD Protection
These dual monolithic silicon Zener diodes are designed for
applications requiring transient overvoltage protection capability. They
are intended for use in voltage and ESD sensitive equipment such as
computers, printers, business machines, communication systems,
medical equipment and other applications. Their dual junction common
anode design protects two separate lines using only one package. These
devices are ideal for situations where board space is at a premium.
Features
3
1
http://onsemi.com
1
2
3
MARKING
DIAGRAM
SOT−23
CASE 318
STYLE 12
xxxMG
G
1
SOT−23 Package Allows Either Two Separate Unidirectional
Configurations or a Single Bidirectional Configuration
Working Peak Reverse Voltage Range
3 V to 26 V
Standard Zener Breakdown Voltage Range
5.6 V to 33 V
Peak Power
24 or 40 W @ 1.0 ms (Unidirectional),
per Figure 6 Waveform
ESD Rating:
Class 3B (>16 kV) per the Human Body Model
Class C (>400 V) per the Machine Model
Maximum Clamping Voltage @ Peak Pulse Current
Low Leakage < 5.0
mA
Flammability Rating UL 94 V−0
Pb−Free Packages are Available
2
xxx = Specific Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the table on page 3 of this data sheet.
Mechanical Characteristics
CASE:
Void-free, transfer-molded, thermosetting plastic case
FINISH:
Corrosion resistant finish, easily solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260°C for 10 Seconds
Package designed for optimal automated board assembly
Small package size for high density applications
Available in 8 mm Tape and Reel
Use the Device Number to order the 7 inch/3,000 unit reel.
Replace the “T1” with “T3” in the Device Number to order the
13 inch/10,000 unit reel.
©
Semiconductor Components Industries, LLC, 2011
August, 2011
Rev. 11
1
Publication Order Number:
MMBZ5V6ALT1/D
MMBZ5V6ALT1 Series
MAXIMUM RATINGS
Rating
Peak Power Dissipation @ 1.0 ms (Note 1)
@ T
L
25°C
MMBZ5V6ALT1 thru MMBZ9V1ALT1
MMBZ12VALT1 thru MMBZ33VALT1
Symbol
P
pk
°P
D
°
R
qJA
°P
D
°
R
qJA
T
J
, T
stg
T
L
Value
24
40
225
1.8
556
300
2.4
417
55 to +150
260
Unit
W
°mW°
mW/°C
°C/W
°mW
mW/°C
°C/W
°C
°C
Total Power Dissipation on FR−5 Board (Note 2) @ T
A
= 25°C
Derate above 25°C
Thermal Resistance Junction−to−Ambient
Total Power Dissipation on Alumina Substrate (Note 3) @ T
A
= 25°C
Derate above 25°C
Thermal Resistance Junction−to−Ambient
Junction and Storage Temperature Range
Lead Solder Temperature
Maximum (10 Second Duration)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Non−repetitive current pulse per Figure 6 and derate above T
A
= 25°C per Figure 7.
2. FR−5 = 1.0 x 0.75 x 0.62 in.
3. Alumina = 0.4 x 0.3 x 0.024 in, 99.5% alumina.
*Other voltages may be available upon request.
ORDERING INFORMATION
Device
MMBZ5V6ALT1
MMBZ5V6ALT1G
MMBZ5V6ALT3
MMBZ5V6ALT3G
MMBZ6VxALT1
MMBZ6VxALT1G
MMBZ6VxALT3
MMBZ6VxALT3G
MMBZ9V1ALT1
MMBZ9V1ALT1G
MMBZ9V1ALT3
MMBZ9V1ALT13G
MMBZxxVALT1
MMBZxxVALT1G
MMBZxxVALT3
MMBZxxVALT3G
Package
SOT−23
SOT−23
(Pb−Free)
SOT−23
SOT−23
(Pb−Free)
SOT−23
SOT−23
(Pb−Free)
SOT−23
SOT−23
(Pb−Free)
SOT−23
SOT−23
(Pb−Free)
SOT−23
SOT−23
(Pb−Free)
SOT−23
SOT−23
(Pb−Free)
SOT−23
SOT−23
(Pb−Free)
Shipping
3000 Tape & Reel
3000 Tape & Reel
10,000 Tape & Reel
10,000 Tape & Reel
3000 Tape & Reel
3000 Tape & Reel
10,000 Tape & Reel
10,000 Tape & Reel
3000 Tape & Reel
3000 Tape & Reel
10,000 Tape & Reel
10,000 Tape & Reel
3000 Tape & Reel
3000 Tape & Reel
10,000 Tape & Reel
10,000 Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
http://onsemi.com
2
MMBZ5V6ALT1 Series
ELECTRICAL CHARACTERISTICS
(T
A
= 25°C unless otherwise noted)
UNIDIRECTIONAL
(Circuit tied to Pins 1 and 3 or 2 and 3)
Symbol
I
PP
V
C
V
RWM
I
R
V
BR
I
T
QV
BR
I
F
V
F
Z
ZT
I
ZK
Z
ZK
Parameter
Maximum Reverse Peak Pulse Current
Clamping Voltage @ I
PP
Working Peak Reverse Voltage
Maximum Reverse Leakage Current @ V
RWM
Breakdown Voltage @ I
T
Test Current
Maximum Temperature Coefficient of V
BR
Forward Current
Forward Voltage @ I
F
Maximum Zener Impedance @ I
ZT
Reverse Current
Maximum Zener Impedance @ I
ZK
I
PP
V
C
V
BR
V
RWM
I
R
V
F
I
T
V
I
F
I
Uni−Directional TVS
ELECTRICAL CHARACTERISTICS
(T
A
= 25°C unless otherwise noted)
UNIDIRECTIONAL
(Circuit tied to Pins 1 and 3 or Pins 2 and 3)
(V
F
= 0.9 V Max @ I
F
= 10 mA)
24 WATTS
Breakdown Voltage
V
RWM
Volts
3.0
3.0
4.5
6.0
I
R
@
V
RWM
mA
5.0
0.5
0.5
0.3
V
BR
(Note 4)
(V)
Min
5.32
5.89
6.46
8.65
Nom
5.6
6.2
6.8
9.1
Max
5.88
6.51
7.14
9.56
@ I
T
mA
20
1.0
1.0
1.0
Max Zener
Impedance
(Note 5)
Z
ZT
@ I
ZT
W
11
Z
ZK
@ I
ZK
W
1600
mA
0.25
V
C
@ I
PP
(Note 6)
V
C
V
8.0
8.7
9.6
14
I
PP
A
3.0
2.76
2.5
1.7
QV
BR
mV/5C
1.26
2.80
3.4
7.5
Device
MMBZ5V6AL
MMBZ6V2AL
MMBZ6V8AL
MMBZ9V1AL
Device
Marking
5A6
6A2
6A8
9A1
(V
F
= 0.9 V Max @ I
F
= 10 mA)
V
RWM
Volts
8.5
12
14.5
17
22
26
I
R
@
V
RWM
nA
200
50
50
50
50
50
40 WATTS
Breakdown Voltage
V
BR
(Note 4)
(V)
Min
11.40
14.25
17.10
19.00
25.65
31.35
Nom
12
15
18
20
27
33
Max
12.60
15.75
18.90
21.00
28.35
34.65
@ I
T
mA
1.0
1.0
1.0
1.0
1.0
1.0
V
C
@ I
PP
(Note 6)
V
C
V
17
21
25
28
40
46
I
PP
A
2.35
1.9
1.6
1.4
1.0
0.87
QV
BR
mV/5C
7.5
12.3
15.3
17.2
24.3
30.4
Device
MMBZ12VAL
MMBZ15VAL
MMBZ18VAL
MMBZ20VAL
MMBZ27VAL
MMBZ33VAL
Device
Marking
12A
15A
18A
20A
27A
33A
4. V
BR
measured at pulse test current I
T
at an ambient temperature of 25°C.
5. Z
ZT
and Z
ZK
are measured by dividing the AC voltage drop across the device by the AC current applied. The specified limits are for I
Z(AC)
= 0.1 I
Z(DC)
, with the AC frequency = 1.0 kHz.
6. Surge current waveform per Figure 6 and derate per Figure 7
http://onsemi.com
3
MMBZ5V6ALT1 Series
TYPICAL CHARACTERISTICS
18
BREAKDOWN VOLTAGE (VOLTS)
(V
BR
@ I
T
)
15
12
9
6
3
0
−40
0.1
0.01
−40
1000
100
10
I
R
(nA)
1
0
+ 50
+ 100
TEMPERATURE (°C)
+ 150
+ 85
+ 25
TEMPERATURE (°C)
+ 125
Figure 1. Typical Breakdown Voltage
versus Temperature
(Upper curve for each voltage is bidirectional mode,
lower curve is unidirectional mode)
320
280
C, CAPACITANCE (pF)
240
200
160
120
80
40
0
0
1
BIAS (V)
2
3
5.6 V
C, CAPACITANCE (pF)
60
50
40
30
20
10
0
Figure 2. Typical Leakage Current
versus Temperature
27 V
15 V
33 V
0
1
BIAS (V)
2
3
Figure 3. Typical Capacitance versus Bias Voltage
(Upper curve for each voltage is unidirectional mode,
lower curve is bidirectional mode)
300
P
D
, POWER DISSIPATION (mW)
250
200
150
100
50
0
Figure 4. Typical Capacitance versus Bias Voltage
(Upper curve for each voltage is unidirectional mode,
lower curve is bidirectional mode)
ALUMINA SUBSTRATE
FR−5 BOARD
0
25
50
75
100
125
TEMPERATURE (°C)
150
175
Figure 5. Steady State Power Derating Curve
http://onsemi.com
4
MMBZ5V6ALT1 Series
TYPICAL CHARACTERISTICS
t
r
10
ms
100
VALUE (%)
PULSE WIDTH (t
P
) IS DEFINED
AS THAT POINT WHERE THE
PEAK CURRENT DECAYS TO
50% OF I
PP
.
PEAK PULSE DERATING IN % OF PEAK
POWER OR CURRENT @ T
A
= 25°C
100
90
80
70
60
50
40
30
20
10
0
0
25
50
75
100
125
150 175
T
A
, AMBIENT TEMPERATURE (°C)
200
PEAK VALUE
I
PP
HALF VALUE
50
t
P
0
I
PP
2
0
1
2
3
t, TIME (ms)
4
Figure 6. Pulse Waveform
100
P
pk
, PEAK SURGE POWER (W)
RECTANGULAR
WAVEFORM, T
A
= 25°C
BIDIRECTIONAL
Figure 7. Pulse Derating Curve
100
P
pk
, PEAK SURGE POWER (W)
RECTANGULAR
WAVEFORM, T
A
= 25°C
BIDIRECTIONAL
10
UNIDIRECTIONAL
10
UNIDIRECTIONAL
1
0.1
1
10
100
1000
1
0.1
1
10
100
1000
PW, PULSE WIDTH (ms)
PW, PULSE WIDTH (ms)
Figure 8. Maximum Non−repetitive Surge
Power, P
pk
versus PW
Power is defined as V
RSM
x I
Z
(pk) where V
RSM
is
the clamping voltage at I
Z
(pk).
Figure 9. Maximum Non−repetitive Surge
Power, P
pk
(NOM) versus PW
Power is defined as V
Z
(NOM) x I
Z
(pk) where
V
Z
(NOM) is the nominal Zener voltage measured at
the low test current used for voltage classification.
http://onsemi.com
5

SZMMBZ15VALT1相似产品对比

SZMMBZ15VALT1 SZMMBZ20VALT3
描述 40W, UNIDIRECTIONAL, 2 ELEMENT, SILICON, TVS DIODE, TO-236, PLASTIC, CASE 318-08, 3 PIN 40W, UNIDIRECTIONAL, 2 ELEMENT, SILICON, TVS DIODE, TO-236, PLASTIC, CASE 318-08, 3 PIN
是否Rohs认证 不符合 不符合
厂商名称 ON Semiconductor(安森美) ON Semiconductor(安森美)
零件包装代码 SOT-23 SOT-23
包装说明 PLASTIC, CASE 318-08, 3 PIN PLASTIC, CASE 318-08, 3 PIN
针数 3 3
制造商包装代码 CASE 318-08 CASE 318-08
Reach Compliance Code not_compliant compliant
ECCN代码 EAR99 EAR99
最大击穿电压 15.75 V 21 V
最小击穿电压 14.25 V 19 V
配置 COMMON ANODE, 2 ELEMENTS COMMON ANODE, 2 ELEMENTS
二极管元件材料 SILICON SILICON
二极管类型 TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE
JEDEC-95代码 TO-236 TO-236
JESD-30 代码 R-PDSO-G3 R-PDSO-G3
JESD-609代码 e0 e0
最大非重复峰值反向功率耗散 40 W 40 W
元件数量 2 2
端子数量 3 3
最高工作温度 150 °C 150 °C
最低工作温度 -55 °C -55 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY
封装形状 RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE SMALL OUTLINE
峰值回流温度(摄氏度) 240 240
极性 UNIDIRECTIONAL UNIDIRECTIONAL
最大功率耗散 0.225 W 0.225 W
认证状态 Not Qualified Not Qualified
最大重复峰值反向电压 12 V 17 V
表面贴装 YES YES
技术 ZENER ZENER
端子面层 Tin/Lead (Sn/Pb) TIN LEAD
端子形式 GULL WING GULL WING
端子位置 DUAL DUAL
处于峰值回流温度下的最长时间 30 30

 
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