Datasheet> 器件分类 > 嵌入式处理器和控制器> 微控制器和处理器> RN80532KC0412M

文档预览

RN80532KC0412M: 产品描述Microprocessor, 32-Bit, 2000MHz, CMOS, CPGA603, INTERPOSER, MICRO, PGA-603; 产品类别嵌入式处理器和控制器微控制器和处理器; 文件大小2MB，共132页; 制造商Intel(英特尔); 官网地址http://www.intel.com/

下载文档详细参数选型对比全文预览文档解析

RN80532KC0412M概述

Microprocessor, 32-Bit, 2000MHz, CMOS, CPGA603, INTERPOSER, MICRO, PGA-603

RN80532KC0412M规格参数

参数名称	属性值
是否Rohs认证	不符合
厂商名称	Intel(英特尔)
零件包装代码	PGA
包装说明	SPGA, PGA603,25X31,50
针数	603
Reach Compliance Code	unknown
ECCN代码	3A001.A.3
地址总线宽度	36
位大小	32
边界扫描	YES
最大时钟频率	100 MHz
外部数据总线宽度	64
格式	FLOATING POINT
集成缓存	YES
JESD-30 代码	S-CPGA-P603
JESD-609代码	e0
长度	53.34 mm
低功率模式	YES
端子数量	603
封装主体材料	CERAMIC, METAL-SEALED COFIRED
封装代码	SPGA
封装等效代码	PGA603,25X31,50
封装形状	SQUARE
封装形式	GRID ARRAY, SHRINK PITCH
峰值回流温度（摄氏度）	NOT SPECIFIED
电源	1.5,3.3 V
认证状态	Not Qualified
速度	2000 MHz
最大供电电压	1.449 V
最小供电电压	1.333 V
表面贴装	NO
技术	CMOS
端子面层	Tin/Lead (Sn/Pb)
端子形式	PIN/PEG
端子节距	1.27 mm
端子位置	PERPENDICULAR
处于峰值回流温度下的最长时间	NOT SPECIFIED
宽度	53.34 mm
uPs/uCs/外围集成电路类型	MICROPROCESSOR

文档解析

这份数据手册中提到的系统总线（System Bus）和信号完整性（Signal Integrity）对于硬件工程师来说具有重要的实际应用价值，主要体现在以下几个方面：

系统设计和兼容性：手册中详细描述了Intel® Xeon™ Processor MP的系统总线规范，包括信号分组、时钟频率、电压级别等。硬件工程师可以根据这些规范设计兼容的主板和系统，确保处理器与其他系统组件之间的正确通信。
信号完整性分析：数据手册提供了信号完整性的详细要求，如环回容忍度（Ringback Tolerance）、过冲/下冲（Overshoot/Undershoot）规范等。这些信息对于工程师在进行高速信号传输设计时至关重要，以避免信号失真和确保数据传输的准确性。
电源管理：手册中描述了处理器的电源需求和电源管理特性，如电压识别（Voltage Identification）和电源好（PWRGOOD）信号。硬件工程师可以利用这些信息设计出满足处理器电源要求的电源供应系统，并确保系统的稳定运行。
热设计：提供了处理器的热规格和测量方法，这对于硬件工程师设计有效的散热解决方案至关重要，以防止处理器过热并确保长期可靠性。
系统管理功能：手册介绍了系统管理总线（SMBus）接口，包括处理器信息ROM（PIROM）、Scratch EEPROM和热传感器等。这些功能可以帮助工程师实现更高级的系统监控和管理。
调试和测试：提供了测试访问端口（TAP）和逻辑分析器接口（LAI）的规范，这些接口对于硬件调试和故障排除非常有用。
机械规格：包括处理器的尺寸、重量和安装规格，这些信息对于设计处理器插槽和确保机械兼容性至关重要。
电气规格：提供了处理器的电气特性，如输入/输出电压、电流要求等，这些对于设计电路板和确保电气兼容性至关重要。
性能优化：通过理解信号完整性和系统总线规范，工程师可以优化系统设计，提高处理器性能，减少延迟，并提高数据处理速度。
长期可靠性：遵循手册中的规范和建议，可以帮助工程师设计出能够承受长期运行压力的系统，减少故障率，延长硬件的使用寿命。

总之，这份数据手册为硬件工程师提供了全面的设计和实现指南，确保了基于Intel® Xeon™ Processor MP的系统设计能够满足高性能、高可靠性和兼容性的要求。

文档预览

下载PDF文档

全文
预览

Intel® Xeon™ Processor MP with up to 2MB L3 Cache (on the 0.13 Micron Process)

Datasheet

Product Features

Available at 1.50, 1.90, 2, 2.50, and

2.80 GHz

Multi-processing server support

Binary compatible with applications

running on previous members of the Intel

IA32 microprocessor line

Intel

NetBurst™ microarchitecture

Hyper-Threading Technology

— Hardware support for multi-threaded

applications

400 MHz System bus

— Bandwidth up to 3.2 GB/second

512

KB Advanced Transfer L2 Cache (on-

die, full speed Level 2 cache) with 8-way

associativity and Error Correcting Code

(ECC)

1-MB or 2-MB L3 Cache (on-die, full

speed Level 3 cache) with 8-way

associativity and Error Correcting Code

(ECC)

Enables system support of up to 64 GB of

physical memory

Streaming SIMD Extensions 2 (SSE2)

— 144 new instructions for double-precision

floating point operations, media/video

streaming, and secure transactions

Rapid Execution Engine: Arithmetic Logic

Units (ALUs) run at twice the processor

core frequency

Hyper-Pipelined Technology

Advance Dynamic Execution

— Very deep out-of-order execution

— Enhanced branch prediction

Enhanced floating point and multimedia

unit for enhanced video, audio, encryption,

and 3D performance

Power Management capabilities

— System Management mode

— Multiple low-power states

Level 1 Execution Trace Cache stores 12 K

micro-ops and removes decoder latency

from main execution loops

— Includes 8- KB Level 1 data cache

Advanced System Management Features

— System Management Bus

— Processor Information ROM (PIROM)

— OEM Scratch EEPROM

— Thermal Monitor

— Machine Check Architecture (MCA)

The Intel

Xeon™ processor MP with up to 2

MB L3 cache on the 0.13 micron process is designed for high-

performance multi-processor server applications. Based on the Intel

NetBurst™ microarchitecture and the new

Hyper-Threading Technology, it is binary compatible with previous Intel Architecture (IA-32) processors. The Intel

Xeon processor MP with up to 2

MB L3 cache is scalable to four processors in a multiprocessor system providing

exceptional performance for applications running on advanced operating systems such as Microsoft Windows* XP

and Windows* 2000 operating systems, Linux*, and UNIX*. The Intel Xeon processor MP with up to 2 MB L3

cache delivers compute power at unparalleled value and flexibility for internet infrastructure and departmental

server applications. The Intel NetBurst microarchitecture and Hyper-Threading Technology deliver outstanding

performance and headroom for peak internet server workloads, resulting in faster response times, support for more

users, and improved scalability.

Document Number 251931-002

June 2003

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS

OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS

DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL

ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO

SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A

PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER

INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, life sustaining applications.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel

reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future

changes to them.

The Intel

Xeon

™

processor MP with up to 2-MB L3 Cache may contain design defects or errors known as errata which may

cause the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

C is a two-wire communications bus/protocol developed by Philips. SMBus is a subset of the I

C bus/protocol and was developed

by Intel. Implementations of the I

C bus/protocol or the SMBus bus/protocol may require licenses from various entities, including

Philips Electronics N.V. and North American Philips Corporation.

Intel, Pentium, Pentium III Xeon, Intel Xeon and Intel NetBurst are trademarks or registered trademarks of Intel Corporation or its

subsidiaries in the United States and other countries.

* Other names and brands may be claimed as the property of others.

Intel® Xeon™ Processor MP with up to 2MB L3 Cache

Contents

Introduction

............................................................................................................................. 1-1

1.1

1.2

Terminology .................................................................................................................... 1-3

1.1.1

Processor Packaging Terminology.................................................................... 1-3

References ....................................................................................................................... 1-4

Electrical Specifications

...................................................................................................... 2-1

2.1

2.2

2.3

System Bus and GTLREF ............................................................................................... 2-1

Power and Ground Pins ................................................................................................... 2-1

Decoupling Guidelines .................................................................................................... 2-1

2.3.1

VCC Decoupling ............................................................................................... 2-2

2.3.2

System Bus AGTL+ Decoupling ...................................................................... 2-2

System Bus Clock (BCLK[1:0]) and Processor Clocking .............................................. 2-2

2.4.1

Bus Clock......................................................................................................... 2-3

PLL Filter ........................................................................................................................ 2-4

2.5.1

Mixing Processors............................................................................................. 2-5

Voltage Identification..................................................................................................... 2-6

2.6.1

Mixing Processors of Different Voltages.......................................................... 2-7

Reserved or Unused Pins................................................................................................. 2-8

System Bus Signal Groups .............................................................................................. 2-8

Asynchronous GTL+ Signals .......................................................................................... 2-9

Maximum Ratings ......................................................................................................... 2-10

Processor DC Specifications ......................................................................................... 2-10

AGTL+ System Bus Specifications .............................................................................. 2-16

System Bus AC Specifications...................................................................................... 2-17

Processor AC Timing Waveforms................................................................................. 2-22

2.4

2.5

2.6

2.7

2.8

2.9

2.10

2.11

2.12

2.13

2.14

System Bus Signal Quality Specifications

.................................................................... 3-1

3.1

3.2

3.3

System Bus Clock (BCLK) Signal Quality Specifications and Measurement Guidelines 3-

System Bus Signal Quality Specifications and Measurement Guidelines ...................... 3-2

System Bus Signal Quality Specifications and Measurement Guidelines ...................... 3-5

3.3.1

Overshoot/Undershoot Guidelines .................................................................... 3-5

3.3.2

Overshoot/Undershoot Magnitude.................................................................... 3-6

3.3.3

Overshoot/Undershoot Pulse Duration ............................................................. 3-6

3.3.4

Activity Factor .................................................................................................. 3-6

3.3.5

Reading Overshoot/Undershoot Specification Tables ...................................... 3-7

3.3.6

Determining if a System Meets the Overshoot/Undershoot Specifications...... 3-7

Mechanical Specifications

.................................................................................................. 4-1

4.1

4.2

4.3

4.4

4.5

4.6

4.7

Mechanical Specifications............................................................................................... 4-3

Package Load Specifications........................................................................................... 4-8

Insertion Specifications ................................................................................................... 4-8

Mass Specifications ......................................................................................................... 4-8

Materials .......................................................................................................................... 4-9

Markings.......................................................................................................................... 4-9

Pinout Diagram.............................................................................................................. 4-10

Intel® Xeon™ Processor MP with up to 2MB L3 Cache

iii

Thermal Specifications

........................................................................................................ 5-1

5.1

5.2

Thermal Specifications .................................................................................................... 5-3

Measurements for Thermal Specifications ...................................................................... 5-5

5.2.1

Processor Case Temperature Measurement ...................................................... 5-5

Features

...................................................................................................................................... 6-1

6.1

6.2

Power-On Configuration Options.................................................................................... 6-1

Clock Control and Low Power States.............................................................................. 6-1

6.2.1

Normal State—State 1....................................................................................... 6-1

6.2.2

AutoHALT Powerdown State—State 2 ............................................................ 6-1

6.2.3

Stop-Grant State—State 3 ................................................................................. 6-2

6.2.4

HALT/Grant Snoop State—State 4................................................................... 6-3

6.2.5

Sleep State—State 5 .......................................................................................... 6-3

6.2.6

Bus Response during Low Power States........................................................... 6-4

Thermal Monitor.............................................................................................................. 6-4

6.3.1

Thermal Diode................................................................................................... 6-4

System Management Bus (SMBus) Interface ................................................................. 6-5

6.4.1

Processor Information ROM (PIROM)............................................................. 6-6

6.4.2

Scratch EEPROM.............................................................................................. 6-8

6.4.3

PIROM and Scratch EEPROM Supported SMBus Transactions ..................... 6-8

6.4.4

SMBus Thermal Sensor .................................................................................... 6-8

6.4.5

Thermal Sensor Supported SMBus Transactions.............................................. 6-9

6.4.6

SMBus Thermal Sensor Registers................................................................... 6-11

6.4.6.1 Thermal Reference Registers............................................................ 6-11

6.4.6.2 Thermal Limit Registers ................................................................... 6-11

6.4.6.3 Status Register .................................................................................. 6-11

6.4.6.4 Configuration Register...................................................................... 6-12

6.4.6.5 Conversion Rate Registers................................................................ 6-13

6.4.7

SMBus Thermal Sensor Alert Interrupt .......................................................... 6-13

6.4.8

SMBus Device Addressing ............................................................................. 6-13

6.3

6.4

Boxed Processor Specifications

........................................................................................ 7-1

7.1

7.2

Introduction ..................................................................................................................... 7-1

Mechanical Specifications ............................................................................................... 7-2

7.2.1

Boxed Processor Heatsink Dimensions............................................................. 7-2

7.2.2

Boxed Processor Heatsink Weight.................................................................... 7-2

7.2.3

Boxed Processor Retention Mechanism and Heatsink Supports ...................... 7-2

Boxed Processor Requirements ....................................................................................... 7-5

7.3.1

Intel

Xeon™ Processor MP on the 0.13 Micron Process Processor ....................

........................................................................................................................... 7-5

Thermal Specifications .................................................................................................... 7-5

7.4.1

Boxed Processor Cooling Requirements........................................................... 7-5

7.3

7.4

Debug Tools Specifications

......................................................................................... 8-1

8.1

Logic Analyzer Interface (LAI)....................................................................................... 8-1

8.1.1

Mechanical Considerations ............................................................................... 8-1

8.1.2

Electrical Considerations................................................................................... 8-1

Intel

Xeon™ Processor MP on the 0.13 Micron Process Processor Pin Assignments . 9-1

9.1.1

Pin Listing by Pin Number.............................................................................. 9-10

Signal Definitions .......................................................................................................... 9-19

Pin Listing and Signal Definitions

........................................................................... 9-1

9.1

9.2

Intel® Xeon™ Processor MP with up to 2MB L3 Cache

Figures

Typical VCCIOPLL, VCCA and VSSA Power Distribution.......................................... 2-4

Phase Lock Loop (PLL) Filter Requirements ................................................................. 2-5

Intel

Xeon™ Processor MP on the 0.13 Micron Process Processor Voltage-Current Pro-

jections........................................................................................................................... 2-12

Electrical Test Circuit.................................................................................................... 2-22

TCK Clock Waveform .................................................................................................. 2-23

Differential Clock Waveform........................................................................................ 2-23

Differential Clock Crosspoint Specification ................................................................. 2-24

System Bus Common Clock Valid Delay Timing Waveform ...................................... 2-24

System Bus Source Synchronous 2X (Address) Timing Waveform............................. 2-25

System Bus Source Synchronous 4X (Data) Timing Waveform .................................. 2-26

System Bus Reset and Configuration Timing Waveform ............................................. 2-27

Power-On Reset and Configuration Timing Waveform................................................ 2-27

TAP Valid Delay Timing Waveform ............................................................................ 2-28

Test Reset (TRST#), Async GTL+ Input, and PROCHOT# Timing Waveform..................

....................................................................................................................................... 2-28

THERMTRIP# to Vcc Timing ...................................................................................... 2-28

SMBus Timing Waveform ............................................................................................ 2-29

SMBus Valid Delay Timing Waveform........................................................................ 2-29

Example 3.3 Volt/SM_VCC Sequencing ...................................................................... 2-30

FERR#/PBE# Valid Delay Timing ............................................................................... 2-31

BCLK[1:0] Signal Integrity Waveform........................................................................... 3-2

Low-to-High System Bus Receiver Ringback Tolerance for AGTL+ and Asynchronous

GTL+ Buffers .................................................................................................................. 3-3

High-to-Low System Bus Receiver Ringback Tolerance for AGTL+ and Asynchronous

GTL+ Buffers .................................................................................................................. 3-3

Low-to-High System Bus Receiver Ringback Tolerance for PWRGOOD and TAP Buffers

3-4

High-to-Low System Bus Receiver Ringback Tolerance for PWRGOOD and TAP Buffers

3-5

Maximum Acceptable Overshoot/Undershoot Waveform ............................................ 3-10

Intel

Xeon™ Processor MP on the 0.13 Micron Process Processor and Intel

Xeon™ Pro-

cessor with 512-KB L2 Cache in INT-mPGA Package - Assembly Drawing (Including

Socket)............................................................................................................................. 4-2

Intel

Xeon™ Processor MP on the 0.13 Micron Process Processor Package Top View

Component Placement Detail .......................................................................................... 4-3

Intel

Xeon™ Processor MP on the 0.13 Micron Process Processor Package Drawing 4-3

Intel

Xeon™ Processor MP on the 0.13 Micron Process Processor Top View - Compo-

nent Keep-In .................................................................................................................... 4-5

Intel

Xeon™ Processor MP on the 0.13 Micron Process Processor and Intel

Xeon™ Pro-

cessor with 512-KB L2 Cache in INT-mPGA Package - Cross Section View - Pin Side

Component Keep-In ........................................................................................................ 4-5

Intel

Xeon™ Processor MP on the 0.13 Micron Process Processor and Intel

Xeon™ Pro-

cessor with 512-KB L2 Cache in INT-mPGA Package - Processor Pin Details............. 4-6

Intel

Xeon™ Processor MP on the 0.13 Micron Process Processor Package IHS Flatness

and Tilt Drawing.............................................................................................................. 4-7

Intel® Xeon™ Processor MP on the 0.13 Micron Process INT-mPGA Package IHS Flat-

ness and Tilt Drawing...................................................................................................... 4-7

Intel

Xeon™ Processor MP on the 0.13 Micron Process Processor Top-Side Markings

Intel® Xeon™ Processor MP with up to 2MB L3 Cache

RN80532KC0412M相似产品对比

	RN80532KC0412M	RN80532KC0411M	RN80532KC0722M	RN80532KC0211M	RN80532KC0371M	RN80532KC0601M
描述	Microprocessor, 32-Bit, 2000MHz, CMOS, CPGA603, INTERPOSER, MICRO, PGA-603	Microprocessor, 32-Bit, 2000MHz, CMOS, CPGA603, INTERPOSER, MICRO, PGA-603	Microprocessor, 32-Bit, 2800MHz, CMOS, CPGA603, INTERPOSER, MICRO, PGA-603	Microprocessor, 32-Bit, 1500MHz, CMOS, CPGA603, INTERPOSER, MICRO, PGA-603	Microprocessor, 32-Bit, 1900MHz, CMOS, CPGA603, INTERPOSER, MICRO, PGA-603	Microprocessor, 32-Bit, 2500MHz, CMOS, CPGA603, INTERPOSER, MICRO, PGA-603
是否Rohs认证	不符合	不符合	不符合	不符合	不符合	不符合
厂商名称	Intel(英特尔)	Intel(英特尔)	Intel(英特尔)	Intel(英特尔)	Intel(英特尔)	Intel(英特尔)
零件包装代码	PGA	PGA	PGA	PGA	PGA	PGA
包装说明	SPGA, PGA603,25X31,50	SPGA, PGA604,25X31,50	SPGA, PGA603,25X31,50	SPGA, PGA603,25X31,50	SPGA, PGA603,25X31,50	SPGA, PGA604,25X31,50
针数	603	603	603	603	603	603
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
ECCN代码	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3
地址总线宽度	36	36	36	36	36	36
位大小	32	32	32	32	32	32
边界扫描	YES	YES	YES	YES	YES	YES
最大时钟频率	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz
外部数据总线宽度	64	64	64	64	64	64
格式	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT
集成缓存	YES	YES	YES	YES	YES	YES
JESD-30 代码	S-CPGA-P603	S-CPGA-P603	S-CPGA-P603	S-CPGA-P603	S-CPGA-P603	S-CPGA-P603
JESD-609代码	e0	e0	e0	e0	e0	e0
长度	53.34 mm	53.34 mm	53.34 mm	53.34 mm	53.34 mm	53.34 mm
低功率模式	YES	YES	YES	YES	YES	YES
端子数量	603	603	603	603	603	603
封装主体材料	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
封装代码	SPGA	SPGA	SPGA	SPGA	SPGA	SPGA
封装等效代码	PGA603,25X31,50	PGA604,25X31,50	PGA603,25X31,50	PGA603,25X31,50	PGA603,25X31,50	PGA604,25X31,50
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	GRID ARRAY, SHRINK PITCH	GRID ARRAY, SHRINK PITCH	GRID ARRAY, SHRINK PITCH	GRID ARRAY, SHRINK PITCH	GRID ARRAY, SHRINK PITCH	GRID ARRAY, SHRINK PITCH
峰值回流温度（摄氏度）	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
电源	1.5,3.3 V	1.4,3.3 V	1.5,3.3 V	1.5,3.3 V	1.5,3.3 V	1.4,3.3 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
速度	2000 MHz	2000 MHz	2800 MHz	1500 MHz	1900 MHz	2500 MHz
最大供电电压	1.449 V	1.449 V	1.441 V	1.453 V	1.45 V	1.432 V
最小供电电压	1.333 V	1.333 V	1.314 V	1.345 V	1.336 V	1.327 V
表面贴装	NO	NO	NO	NO	NO	NO
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
端子面层	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
端子形式	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG
端子节距	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
端子位置	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
宽度	53.34 mm	53.34 mm	53.34 mm	53.34 mm	53.34 mm	53.34 mm
uPs/uCs/外围集成电路类型	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR

RN80532KC0412M

RN80532KC0412M概述

RN80532KC0412M规格参数

文档解析

文档预览

RN80532KC0412M相似产品对比

推荐资源