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MT48LC2M32B2B5-5:G

产品描述Synchronous DRAM, 2MX32, 4.5ns, CMOS, PBGA90, 8 X 13 MM, LEAD FREE, VFBGA-90
产品类别存储    存储   
文件大小4MB,共80页
制造商Micron Technology
官网地址http://www.mdtic.com.tw/
标准  
下载文档 详细参数 全文预览

MT48LC2M32B2B5-5:G概述

Synchronous DRAM, 2MX32, 4.5ns, CMOS, PBGA90, 8 X 13 MM, LEAD FREE, VFBGA-90

MT48LC2M32B2B5-5:G规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称Micron Technology
零件包装代码BGA
包装说明VFBGA, BGA90,9X15,32
针数90
Reach Compliance Codecompliant
ECCN代码EAR99
访问模式FOUR BANK PAGE BURST
最长访问时间4.5 ns
其他特性AUTO/SELF REFRESH
最大时钟频率 (fCLK)200 MHz
I/O 类型COMMON
交错的突发长度1,2,4,8
JESD-30 代码R-PBGA-B90
JESD-609代码e1
长度13 mm
内存密度67108864 bit
内存集成电路类型SYNCHRONOUS DRAM
内存宽度32
功能数量1
端口数量1
端子数量90
字数2097152 words
字数代码2000000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织2MX32
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码VFBGA
封装等效代码BGA90,9X15,32
封装形状RECTANGULAR
封装形式GRID ARRAY, VERY THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度)260
电源3.3 V
认证状态Not Qualified
刷新周期4096
座面最大高度1 mm
自我刷新YES
连续突发长度1,2,4,8,FP
最大待机电流0.002 A
最大压摆率0.28 mA
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)3 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Silver/Copper (Sn/Ag/Cu)
端子形式BALL
端子节距0.8 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间30
宽度8 mm

MT48LC2M32B2B5-5:G文档预览

64Mb: x32 SDRAM
Features
SDR SDRAM
MT48LC2M32B2 – 512K x 32 x 4 Banks
Features
• PC100-compliant
• Fully synchronous; all signals registered on positive
edge of system clock
• Internal pipelined operation; column address can
be changed every clock cycle
• Internal banks for hiding row access/precharge
• Programmable burst lengths: 1, 2, 4, 8, or full page
• Auto precharge, includes concurrent auto precharge
and auto refresh modes
• Self refresh mode (not available on AT devices)
• Auto refresh
– 64ms, 4096-cycle refresh
(commercial and industrial)
– 16ms, 4096-cycle refresh
(automotive)
• LVTTL-compatible inputs and outputs
• Single 3.3V ±0.3V power supply
• Supports CAS latency (CL) of 1, 2, and 3
Options
• Configuration
– 2 Meg x 32 (512K x 32 x 4 banks)
• Plastic package – OCPL
1
– 86-pin TSOP II (400 mil) standard
– 86-pin TSOP II (400 mil) Pb-free
– 90-ball VFBGA (8mm x 13mm) Pb-
free
• Timing – cycle time
– 5ns (200 MHz)
– 5.5ns (183 MHz)
– 6ns (167 MHz)
– 6ns (167 MHz)
– 7ns (143 MHz)
• Operating temperature range
– Commercial (0˚C to +70˚C)
– Industrial (–40˚C to +85˚C)
– Automotive (–40˚C to +105˚C)
• Revision
Notes:
1.
2.
3.
4.
Off-center parting line.
Available only on revision G.
Available only on revision J.
Contact Micron for availability.
Marking
2M32B2
TG
P
B5
-5
-55
2
-6A
3
-6
2
-7
2
None
IT
AT
4
:G/:J
Table 1: Key Timing Parameters
CL = CAS (READ) latency
Speed Grade
-5
-55
-6A
-6
-7
Clock
Frequency (MHz)
200
183
167
167
143
Target
t
RCD-
t
RP-CL
3-3-3
3-3-3
3-3-3
3-3-3
3-3-3
t
RCD
(ns)
t
RP
(ns)
CL (ns)
15
16.5
18
18
21
15
16.5
18
18
20
15
16.5
18
18
20
PDF: 09005aef811ce1fe
64mb_x32_sdram.pdf - Rev. T 04/13 EN
1
Products and specifications discussed herein are subject to change by Micron without notice.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
1999 Micron Technology, Inc. All rights reserved.
64Mb: x32 SDRAM
Features
Table 2: Address Table
Parameter
Configuration
Refresh count
Row addressing
Bank addressing
Column addressing
2 Meg x 32
512K x 32 x 4 banks
4K
2K A[10:0]
4 BA[1:0]
256 A[7:0]
Table 3: 64Mb (x32) SDR Part Numbering
Part Numbers
MT48LC2M32B2TG
MT48LCM32B2P
MT48LC2M3B2B5
1
Note:
Architecture
2 Meg x 32
2 Meg x 32
2 Meg x 32
Package
86-pin TSOP II
86-pin TSOP II
90-ball VFBGA
1. FBGA Device Decoder:
www.micron.com/decoder.
PDF: 09005aef811ce1fe
64mb_x32_sdram.pdf - Rev. T 04/13 EN
2
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
1999 Micron Technology, Inc. All rights reserved.
64Mb: x32 SDRAM
Features
Contents
General Description ......................................................................................................................................... 7
Automotive Temperature .............................................................................................................................. 7
Functional Block Diagrams ............................................................................................................................... 8
Pin and Ball Assignments and Descriptions ....................................................................................................... 9
Package Dimensions ....................................................................................................................................... 12
Temperature and Thermal Impedance ............................................................................................................ 14
Electrical Specifications .................................................................................................................................. 17
Electrical Specifications – I
DD
Parameters ........................................................................................................ 19
Electrical Specifications – AC Operating Conditions ......................................................................................... 21
Functional Description ................................................................................................................................... 24
Commands .................................................................................................................................................... 25
COMMAND INHIBIT .................................................................................................................................. 25
NO OPERATION (NOP) ............................................................................................................................... 26
LOAD MODE REGISTER (LMR) ................................................................................................................... 26
ACTIVE ...................................................................................................................................................... 26
READ ......................................................................................................................................................... 27
WRITE ....................................................................................................................................................... 28
PRECHARGE .............................................................................................................................................. 29
BURST TERMINATE ................................................................................................................................... 29
REFRESH ................................................................................................................................................... 30
AUTO REFRESH ..................................................................................................................................... 30
SELF REFRESH ....................................................................................................................................... 30
Truth Tables ................................................................................................................................................... 31
Initialization .................................................................................................................................................. 36
Mode Register ................................................................................................................................................ 38
Burst Length .............................................................................................................................................. 40
Burst Type .................................................................................................................................................. 40
CAS Latency ............................................................................................................................................... 42
Operating Mode ......................................................................................................................................... 42
Write Burst Mode ....................................................................................................................................... 42
Bank/Row Activation ...................................................................................................................................... 43
READ Operation ............................................................................................................................................. 44
WRITE Operation ........................................................................................................................................... 53
Burst Read/Single Write .............................................................................................................................. 60
PRECHARGE Operation .................................................................................................................................. 61
Auto Precharge ........................................................................................................................................... 61
AUTO REFRESH Operation ............................................................................................................................. 73
SELF REFRESH Operation ............................................................................................................................... 75
Power-Down .................................................................................................................................................. 77
Clock Suspend ............................................................................................................................................... 78
PDF: 09005aef811ce1fe
64mb_x32_sdram.pdf - Rev. T 04/13 EN
3
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
1999 Micron Technology, Inc. All rights reserved.
64Mb: x32 SDRAM
Features
List of Figures
Figure 1: 2 Meg x 32 Functional Block Diagram ................................................................................................. 8
Figure 2: 86-Pin TSOP (Top View) .................................................................................................................... 9
Figure 3: 90-Ball VFBGA (Top View) ............................................................................................................... 10
Figure 4: 86-Pin Plastic TSOP II (400 mil) – Package Codes TG/P ...................................................................... 12
Figure 5: 90-Ball VFBGA (8mm x 13mm) – Package Codes B5 ........................................................................... 13
Figure 6: Example: Temperature Test Point Location, 86-Pin TSOP (Top View) ................................................. 15
Figure 7: Example: Temperature Test Point Location, 90-Ball FBGA (Top View) ................................................ 16
Figure 8: ACTIVE Command .......................................................................................................................... 26
Figure 9: READ Command ............................................................................................................................. 27
Figure 10: WRITE Command ......................................................................................................................... 28
Figure 11: PRECHARGE Command ................................................................................................................ 29
Figure 12: Initialize and Load Mode Register .................................................................................................. 37
Figure 13: Mode Register Definition ............................................................................................................... 39
Figure 14: CAS Latency .................................................................................................................................. 42
Figure 15: Example: Meeting
t
RCD (MIN) When 2 <
t
RCD (MIN)/
t
CK < 3 .......................................................... 43
Figure 16: Consecutive READ Bursts .............................................................................................................. 45
Figure 17: Random READ Accesses ................................................................................................................ 46
Figure 18: READ-to-WRITE ............................................................................................................................ 47
Figure 19: READ-to-WRITE With Extra Clock Cycle ......................................................................................... 48
Figure 20: READ-to-PRECHARGE .................................................................................................................. 48
Figure 21: Terminating a READ Burst ............................................................................................................. 49
Figure 22: Alternating Bank Read Accesses ..................................................................................................... 50
Figure 23: READ Continuous Page Burst ......................................................................................................... 51
Figure 24: READ – DQM Operation ................................................................................................................ 52
Figure 25: WRITE Burst ................................................................................................................................. 53
Figure 26: WRITE-to-WRITE .......................................................................................................................... 54
Figure 27: Random WRITE Cycles .................................................................................................................. 55
Figure 28: WRITE-to-READ ............................................................................................................................ 55
Figure 29: WRITE-to-PRECHARGE ................................................................................................................. 56
Figure 30: Terminating a WRITE Burst ............................................................................................................ 57
Figure 31: Alternating Bank Write Accesses ..................................................................................................... 58
Figure 32: WRITE – Continuous Page Burst ..................................................................................................... 59
Figure 33: WRITE – DQM Operation ............................................................................................................... 60
Figure 34: READ With Auto Precharge Interrupted by a READ ......................................................................... 62
Figure 35: READ With Auto Precharge Interrupted by a WRITE ........................................................................ 63
Figure 36: READ With Auto Precharge ............................................................................................................ 64
Figure 37: READ Without Auto Precharge ....................................................................................................... 65
Figure 38: Single READ With Auto Precharge .................................................................................................. 66
Figure 39: Single READ Without Auto Precharge ............................................................................................. 67
Figure 40: WRITE With Auto Precharge Interrupted by a READ ........................................................................ 68
Figure 41: WRITE With Auto Precharge Interrupted by a WRITE ...................................................................... 68
Figure 42: WRITE With Auto Precharge ........................................................................................................... 69
Figure 43: WRITE Without Auto Precharge ..................................................................................................... 70
Figure 44: Single WRITE With Auto Precharge ................................................................................................. 71
Figure 45: Single WRITE Without Auto Precharge ............................................................................................ 72
Figure 46: Auto Refresh Mode ........................................................................................................................ 74
Figure 47: Self Refresh Mode .......................................................................................................................... 76
Figure 48: Power-Down Mode ........................................................................................................................ 77
Figure 49: Clock Suspend During WRITE Burst ............................................................................................... 78
Figure 50: Clock Suspend During READ Burst ................................................................................................. 79
PDF: 09005aef811ce1fe
64mb_x32_sdram.pdf - Rev. T 04/13 EN
4
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
1999 Micron Technology, Inc. All rights reserved.
64Mb: x32 SDRAM
Features
Figure 51: Clock Suspend Mode ..................................................................................................................... 80
PDF: 09005aef811ce1fe
64mb_x32_sdram.pdf - Rev. T 04/13 EN
5
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
1999 Micron Technology, Inc. All rights reserved.
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