1Gb: x4, x8, x16 DDR2 SDRAM
Features
DDR2 SDRAM
MT47H256M4 – 32 Meg x 4 x 8 banks
MT47H128M8 – 16 Meg x 8 x 8 banks
MT47H64M16 – 8 Meg x 16 x 8 banks
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Vdd = +1.8V ±0.1V, VddQ = +1.8V ±0.1V
JEDEC-standard 1.8V I/O (SSTL_18-compatible)
Differential data strobe (DQS, DQS#) option
4n-bit prefetch architecture
Duplicate output strobe (RDQS) option for x8
DLL to align DQ and DQS transitions with CK
8 internal banks for concurrent operation
Programmable CAS latency (CL)
Posted CAS additive latency (AL)
WRITE latency = READ latency - 1
t
CK
Selectable burst lengths (BL): 4 or 8
Adjustable data-output drive strength
64ms, 8,192-cycle refresh
On-die termination (ODT)
Industrial temperature (IT) option
RoHS compliant
Supports JEDEC clock jitter specification
Options
1
•
Configuration
–
256 Meg x 4 (32 Meg x 4 x 8 banks)
–
128 Meg x 8 (16 Meg x 8 x 8 banks)
–
64 Meg x 16 (8 Meg x 16 x 8 banks)
•
FBGA package (Pb-free) – x16
–
84-ball FBGA (8mm x 12.5mm) Rev. E, G
•
FBGA package (Pb-free) – x4, x8
–
60-ball FBGA (8mm x 11.5mm) Rev. E, G
•
FBGA package (lead solder) – x16
–
84-ball FBGA (8mm x 12.5mm) Rev. E, G
•
FBGA package (lead solder) – x4, x8
–
60-ball FBGA (8mm x 11.5mm) Rev. E, G
•
Timing – cycle time
–
1.875ns @ CL = 7 (DDR2-1066)
–
2.5ns @ CL = 5 (DDR2-800)
–
2.5ns @ CL = 6 (DDR2-800)
–
3.0ns @ CL = 4 (DDR2-667)
–
3.0ns @ CL = 5 (DDR2-667)
–
3.75ns @ CL = 4 (DDR2-533)
•
Self refresh
–
Standard
–
Low-power
•
Operating temperature
–
Commercial (0°C
≤
T
C
≤
85°C)
–
Industrial (–40°C
≤
T
C
≤
95°C;
–40°C
≤
T
A
≤
85°C)
–
Automotive (–40°C
≤
T
C
, T
A
≤
105ºC)
•
Revision
Note:
Marking
256M4
128M8
64M16
HR
HQ
HW
HV
-187E
-25E
-25
-3E
-3
-37E
None
L
None
IT
AT
:E/:G
1. Not all options listed can be combined to
define an offered product. Use the Part
Catalog Search on
www.micron.com
for
product offerings and availability.
PDF: 09005aef821ae8bf
Rev. P 1/09 EN
1
Products and specifications discussed herein are subject to change by Micron without notice.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2004 Micron Technology, Inc. All rights reserved.
1Gb: x4, x8, x16 DDR2 SDRAM
Features
Table 1: Key Timing Parameters
Speed Grade
-187E
-25E
-25
-3E
-3
-37E
Data Rate (MT/s)
CL = 3
400
400
400
400
400
400
CL = 4
533
533
533
667
533
533
CL = 5
667
800
667
667
667
n/a
CL = 6
800
800
800
n/a
n/a
n/a
CL = 7
1066
n/a
n/a
n/a
n/a
n/a
t
RC
(ns)
54
55
55
54
55
55
Table 2: Addressing
Parameter
Configuration
Refresh count
Row address
Bank address
Column address
256 Meg x 4
32 Meg x 4 x 8 banks
8K
A[13:0] (16K)
BA[2:0] (8)
A[11, 9:0] (2K)
128 Meg x 8
16 Meg x 8 x 8 banks
8K
A[13:0] (16K)
BA[2:0] (8)
A[9:0] (1K)
64 Meg x 16
8 Meg x 16 x 8 banks
8K
A[12:0] (8K)
BA[2:0] (8)
A[9:0] (1K)
PDF: 09005aef821ae8bf
Rev. P 1/09 EN
2
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2004 Micron Technology, Inc. All rights reserved.
1Gb: x4, x8, x16 DDR2 SDRAM
Features
Figure 1: 1Gb DDR2 Part Numbers
Example Part Number: MT47H128M8HQ-37E
-
MT47H
Configuration
Package
Speed
:
Revision
{
:E/:G
Configuration
256 Meg x 4
128 Meg x 8
64 Meg x 16
Package
Pb-free
84-ball 8mm x 12.5mm FBGA
60-ball 8mm x 11.5mm FBGA
Lead solder
84-ball 8mm x 12.5mm FBGA
60-ball 8mm x 11.5mm FBGA
HW
HV
HR
HQ
256M4
128M8
64M16
-187E
-25E
-25
-3E
-3
-37E
Speed Grade
tCK = 1.875ns, CL = 7
tCK = 2.5ns, CL = 5
tCK = 2.5ns, CL = 6
tCK = 3ns, CL = 4
tCK = 3ns, CL = 5
tCK = 3.75ns, CL = 4
Revision
L Low power
IT Industrial temperature
AT Automotive temperature
Note:
1. Not all speeds and configurations are available in all packages.
FBGA Part Number System
Due to space limitations, FBGA-packaged components have an abbreviated part marking that is different from the
part number. For a quick conversion of an FBGA code, see the FBGA Part Marking Decoder on Micron’s Web site:
http://www.micron.com.
PDF: 09005aef821ae8bf
Rev. P 1/09 EN
3
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2004 Micron Technology, Inc. All rights reserved.
1Gb: x4, x8, x16 DDR2 SDRAM
State Diagram .................................................................................................................................................. 9
Functional Description ................................................................................................................................... 10
Industrial Temperature .............................................................................................................................. 10
Automotive Temperature ........................................................................................................................... 11
General Notes ............................................................................................................................................ 11
Functional Block Diagrams ............................................................................................................................. 12
Ball Assignments and Descriptions ................................................................................................................. 15
Packaging ...................................................................................................................................................... 20
Package Dimensions .................................................................................................................................. 20
FBGA Package Capacitance ......................................................................................................................... 22
Electrical Specifications – Absolute Ratings ..................................................................................................... 23
Temperature and Thermal Impedance ........................................................................................................ 23
Electrical Specifications – Idd Parameters ........................................................................................................ 26
Idd Specifications and Conditions ............................................................................................................... 26
Idd7 Conditions ......................................................................................................................................... 27
AC Timing Operating Specifications ................................................................................................................ 31
AC and DC Operating Conditions .................................................................................................................... 42
ODT DC Electrical Characteristics ................................................................................................................... 43
Input Electrical Characteristics and Operating Conditions ............................................................................... 44
Output Electrical Characteristics and Operating Conditions ............................................................................. 47
Output Driver Characteristics ......................................................................................................................... 49
Power and Ground Clamp Characteristics ....................................................................................................... 53
AC Overshoot/Undershoot Specification ......................................................................................................... 54
Input Slew Rate Derating ................................................................................................................................ 56
Commands .................................................................................................................................................... 70
Truth Tables ............................................................................................................................................... 70
DESELECT ................................................................................................................................................. 74
NO OPERATION (NOP) .............................................................................................................................. 75
LOAD MODE (LM) ..................................................................................................................................... 75
ACTIVATE .................................................................................................................................................. 75
READ ......................................................................................................................................................... 75
WRITE ....................................................................................................................................................... 75
PRECHARGE .............................................................................................................................................. 76
REFRESH ................................................................................................................................................... 76
SELF REFRESH ........................................................................................................................................... 76
Mode Register (MR) ........................................................................................................................................ 76
Burst Length .............................................................................................................................................. 77
Burst Type ................................................................................................................................................. 77
Operating Mode ......................................................................................................................................... 79
DLL RESET ................................................................................................................................................. 79
Write Recovery ........................................................................................................................................... 80
Power-Down Mode .................................................................................................................................... 80
CAS Latency (CL) ........................................................................................................................................ 81
Extended Mode Register (EMR) ....................................................................................................................... 82
DLL Enable/Disable ................................................................................................................................... 83
Output Drive Strength ................................................................................................................................ 83
DQS# Enable/Disable ................................................................................................................................. 83
RDQS Enable/Disable ................................................................................................................................. 83
Output Enable/Disable ............................................................................................................................... 83
On-Die Termination (ODT) ........................................................................................................................ 84
Contents
PDF: 09005aef821ae8bf
Rev. P 1/09 EN
4
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2004 Micron Technology, Inc. All rights reserved.
1Gb: x4, x8, x16 DDR2 SDRAM
Off-Chip Driver (OCD) Impedance Calibration ............................................................................................ 84
Posted CAS Additive Latency (AL) ............................................................................................................... 84
Extended Mode Register 2 (EMR2) .................................................................................................................. 86
Extended Mode Register 3 (EMR3) .................................................................................................................. 87
Initialization .................................................................................................................................................. 88
ACTIVATE ...................................................................................................................................................... 92
READ ............................................................................................................................................................. 94
READ with Precharge ................................................................................................................................. 98
READ with Auto Precharge ......................................................................................................................... 100
WRITE .......................................................................................................................................................... 105
PRECHARGE ................................................................................................................................................. 115
REFRESH ...................................................................................................................................................... 116
SELF REFRESH .............................................................................................................................................. 117
Power-Down Mode ....................................................................................................................................... 119
Precharge Power-Down Clock Frequency Change .......................................................................................... 126
Reset ............................................................................................................................................................. 127
CKE Low Anytime ...................................................................................................................................... 127
ODT Timing .................................................................................................................................................. 129
MRS Command to ODT Update Delay ........................................................................................................ 131
PDF: 09005aef821ae8bf
Rev. P 1/09 EN
5
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2004 Micron Technology, Inc. All rights reserved.
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