Synchronous DRAM Module, 256MX72, CMOS, LEAD FREE, SORDIMM-200
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Micron Technology |
| 零件包装代码 | SODIMM |
| 包装说明 | DIMM, |
| 针数 | 200 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 访问模式 | DUAL BANK PAGE BURST |
| 其他特性 | AUTO/SELF REFRESH |
| JESD-30 代码 | R-XZMA-N200 |
| JESD-609代码 | e4 |
| 内存密度 | 19327352832 bit |
| 内存集成电路类型 | SYNCHRONOUS DRAM MODULE |
| 内存宽度 | 72 |
| 功能数量 | 1 |
| 端口数量 | 1 |
| 端子数量 | 200 |
| 字数 | 268435456 words |
| 字数代码 | 256000000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 256MX72 |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | DIMM |
| 封装形状 | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 自我刷新 | YES |
| 最大供电电压 (Vsup) | 1.9 V |
| 最小供电电压 (Vsup) | 1.7 V |
| 标称供电电压 (Vsup) | 1.8 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Gold (Au) |
| 端子形式 | NO LEAD |
| 端子位置 | ZIG-ZAG |
| 处于峰值回流温度下的最长时间 | 30 |
| MT18HVS25672RHY-53EXX | MT18HVS25672RHIY-53EXX | MT18HVS25672RHIY-40EXX | MT18HVS25672RHY-40EXX | MT18HVS25672RHY-667E1 | MT18HVS25672RHY-667XX | AF0603FR-079M76 | |
|---|---|---|---|---|---|---|---|
| 描述 | Synchronous DRAM Module, 256MX72, CMOS, LEAD FREE, SORDIMM-200 | Synchronous DRAM Module, 256MX72, CMOS, LEAD FREE, SORDIMM-200 | Synchronous DRAM Module, 256MX72, CMOS, LEAD FREE, SORDIMM-200 | Synchronous DRAM Module, 256MX72, CMOS, LEAD FREE, SORDIMM-200 | Synchronous DRAM Module, 256MX72, CMOS, LEAD FREE, SORDIMM-200 | Synchronous DRAM Module, 256MX72, CMOS, LEAD FREE, SORDIMM-200 | ANTI-SULFURATED CHIP RESISTORS |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | - | 不含铅 | - |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | - |
| 厂商名称 | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | - |
| 零件包装代码 | SODIMM | SODIMM | SODIMM | SODIMM | SODIMM | SODIMM | - |
| 包装说明 | DIMM, | LEAD FREE, SORDIMM-200 | LEAD FREE, SORDIMM-200 | LEAD FREE, SORDIMM-200 | DIMM, | DIMM, | - |
| 针数 | 200 | 200 | 200 | 200 | 200 | 200 | - |
| Reach Compliance Code | compliant | compliant | compliant | compliant | unknown | compliant | - |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - |
| 访问模式 | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST | - |
| 其他特性 | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | - |
| JESD-30 代码 | R-XZMA-N200 | R-XZMA-N200 | R-XZMA-N200 | R-XZMA-N200 | R-XZMA-N200 | R-XZMA-N200 | - |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 | - |
| 内存密度 | 19327352832 bit | 19327352832 bit | 19327352832 bit | 19327352832 bit | 19327352832 bit | 19327352832 bit | - |
| 内存集成电路类型 | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | - |
| 内存宽度 | 72 | 72 | 72 | 72 | 72 | 72 | - |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | - |
| 端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | - |
| 端子数量 | 200 | 200 | 200 | 200 | 200 | 200 | - |
| 字数 | 268435456 words | 268435456 words | 268435456 words | 268435456 words | 268435456 words | 268435456 words | - |
| 字数代码 | 256000000 | 256000000 | 256000000 | 256000000 | 256000000 | 256000000 | - |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - |
| 最高工作温度 | 70 °C | 85 °C | 85 °C | 70 °C | 70 °C | 70 °C | - |
| 组织 | 256MX72 | 256MX72 | 256MX72 | 256MX72 | 256MX72 | 256MX72 | - |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | - |
| 封装代码 | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | - |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 自我刷新 | YES | YES | YES | YES | YES | YES | - |
| 最大供电电压 (Vsup) | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V | - |
| 最小供电电压 (Vsup) | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | - |
| 标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | - |
| 表面贴装 | NO | NO | NO | NO | NO | NO | - |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - |
| 温度等级 | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | - |
| 端子面层 | Gold (Au) | Gold (Au) | Gold (Au) | Gold (Au) | Gold (Au) | Gold (Au) | - |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | - |
| 端子位置 | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | - |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | 30 | - |
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