CREAT BY ART
BZD17C SERIES
0.8 Watts Voltage Regulator Diodes
Sub SMA
Features
Silicon zener diodes
Low profile surface-mount package
Zener and surge current specification
Low leakage current
Excellent stability
High temperature soldering guaranteed:
260℃ / 10 seconds
Green compound with suffix "G" on packing
code & prefix "G" on datecode
Mechanical Data
Case: Sub SMA Plastic
Terminals: Pure tin plated, lead free
Packaging method: refer to package code
Marking code: as table
Weight: 0.01 gram
Ordering Information (example)
Part No.
Package
Packing
3K / 7" REEL
Packing code
RV
Packing code
(Green)
RVG
BZD17C11P Sub-SMA
Maximum Ratings and Electrical Characteristics
Rating at 25
℃
ambient temperature unless otherwise specified.
Parameter
Forward Voltage @ I
F
=0.2A
Power Dissipation at T
L
=80℃
T
A
=25℃ (Note 1)
Non-Repetitive Peak Pulse Power Dissipation
100us square pulse (Note 2)
Thermal Resistance Junction to Ambient Air (Note 1)
Thermal Resistance Junction to Lead
Operating and Storage Temperature Range
Note 2: T
J
=25℃ Prior to Surge
Symbol
V
F
Ptot
P
ZSM
R
θJA
R
θJL
T
J
, T
STG
Value
1.2
2.3
0.8
300
180
30
-55 to +175
Unit
Volts
Watts
Watts
℃/W
℃/W
℃
Note 1: Mounted on Cu-Pad size 5mm x 5mm (≧40um thick)
Version:I13
RATINGS AND CHARACTERISTIC CURVES (BZD17C SERIES)
FIG. 2 TYP. DIODE CAPACITANCE vs
REVERSE VOLTAGE
10000
TYP. JUNCTION CAPACITANCE (pF)
FIG. 1 TYPICAL FORWARD CHARACTERISTICS
INSTANTANEOUS FORWARD CURRENT (A)
10
1000
C12P
1
TYP. VF
MAX. VF
100
C27P
0.1
0.6
0.7
0.8
0.9
1
1.1
1.2
1.3
1.4
1.5
1.6
FORWARD VOLTAGE (V)
10
0.0
0.5
C200P
1.0
1.5
2.0
2.5
3.0
REVERSE VOLTAGE
FIG.3 POWER DISSIPATION vs
AMBIENT TEMPERATURE
3
2.5
2
1.5
1
0.5
0
0
25
50
75
100
125
150
175
AMBIENT TEMPERATURE(
o
C)
AMBIENT TEMPERATURE
SEPOINT TEMPERATURE
POWER DISSIPATION(W)
Version:I13
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