DDR DRAM Module, 512MX72, 0.5ns, CMOS, ROHS COMPLIANT, DIMM-240
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | SK Hynix(海力士) |
| 零件包装代码 | DIMM |
| 包装说明 | DIMM, DIMM240,40 |
| 针数 | 240 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 访问模式 | DUAL BANK PAGE BURST |
| 最长访问时间 | 0.5 ns |
| 其他特性 | AUTO/SELF REFRESH |
| 最大时钟频率 (fCLK) | 267 MHz |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-XDMA-N240 |
| 内存密度 | 38654705664 bit |
| 内存集成电路类型 | DDR DRAM MODULE |
| 内存宽度 | 72 |
| 功能数量 | 1 |
| 端口数量 | 1 |
| 端子数量 | 240 |
| 字数 | 536870912 words |
| 字数代码 | 512000000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 55 °C |
| 最低工作温度 | |
| 组织 | 512MX72 |
| 输出特性 | 3-STATE |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | DIMM |
| 封装等效代码 | DIMM240,40 |
| 封装形状 | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 1.8 V |
| 认证状态 | Not Qualified |
| 刷新周期 | 8192 |
| 自我刷新 | YES |
| 最大供电电压 (Vsup) | 1.9 V |
| 最小供电电压 (Vsup) | 1.7 V |
| 标称供电电压 (Vsup) | 1.8 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | NO LEAD |
| 端子节距 | 1 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 20 |
| HYMP351R72AMP4-C4 | HYMP112P72AP8-E3 | HYMP125R72AP4-C4 | HYMP125P72AP4-E3 | HYMP351P72AMP4-E3 | HYMP112R72AP8-C4 | |
|---|---|---|---|---|---|---|
| 描述 | DDR DRAM Module, 512MX72, 0.5ns, CMOS, ROHS COMPLIANT, DIMM-240 | DDR DRAM Module, 128MX72, 0.6ns, CMOS, ROHS COMPLIANT, DIMM-240 | DDR DRAM Module, 256MX72, 0.5ns, CMOS, ROHS COMPLIANT, DIMM-240 | DDR DRAM Module, 256MX72, 0.6ns, CMOS, ROHS COMPLIANT, DIMM-240 | DDR DRAM Module, 512MX72, 0.6ns, CMOS, ROHS COMPLIANT, DIMM-240 | DDR DRAM Module, 128MX72, 0.5ns, CMOS, ROHS COMPLIANT, DIMM-240 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | SK Hynix(海力士) | SK Hynix(海力士) | SK Hynix(海力士) | SK Hynix(海力士) | SK Hynix(海力士) | SK Hynix(海力士) |
| 零件包装代码 | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM |
| 包装说明 | DIMM, DIMM240,40 | DIMM, DIMM240,40 | DIMM, DIMM240,40 | DIMM, DIMM240,40 | DIMM, DIMM240,40 | DIMM, DIMM240,40 |
| 针数 | 240 | 240 | 240 | 240 | 240 | 240 |
| Reach Compliance Code | compliant | compliant | compliant | unknown | compliant | compli |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 访问模式 | DUAL BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | DUAL BANK PAGE BURST | SINGLE BANK PAGE BURST |
| 最长访问时间 | 0.5 ns | 0.6 ns | 0.5 ns | 0.6 ns | 0.6 ns | 0.5 ns |
| 其他特性 | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
| 最大时钟频率 (fCLK) | 267 MHz | 200 MHz | 267 MHz | 200 MHz | 200 MHz | 267 MHz |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-XDMA-N240 | R-XDMA-N240 | R-XDMA-N240 | R-XDMA-N240 | R-XDMA-N240 | R-XDMA-N240 |
| 内存密度 | 38654705664 bit | 9663676416 bit | 19327352832 bit | 19327352832 bit | 38654705664 bit | 9663676416 bi |
| 内存集成电路类型 | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE |
| 内存宽度 | 72 | 72 | 72 | 72 | 72 | 72 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 240 | 240 | 240 | 240 | 240 | 240 |
| 字数 | 536870912 words | 134217728 words | 268435456 words | 268435456 words | 536870912 words | 134217728 words |
| 字数代码 | 512000000 | 128000000 | 256000000 | 256000000 | 512000000 | 128000000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 55 °C | 55 °C | 55 °C | 55 °C | 55 °C | 55 °C |
| 组织 | 512MX72 | 128MX72 | 256MX72 | 256MX72 | 512MX72 | 128MX72 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM |
| 封装等效代码 | DIMM240,40 | DIMM240,40 | DIMM240,40 | DIMM240,40 | DIMM240,40 | DIMM240,40 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 |
| 电源 | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 刷新周期 | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 |
| 自我刷新 | YES | YES | YES | YES | YES | YES |
| 最大供电电压 (Vsup) | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V |
| 最小供电电压 (Vsup) | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V |
| 标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 20 | 20 | 20 | 20 | 20 | 20 |
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