EEPROM, 16X8, Serial, CMOS, PDSO8, PLASTIC, SOIC-8
| 参数名称 | 属性值 |
| 厂商名称 | Xicor Inc |
| 包装说明 | PLASTIC, SOIC-8 |
| Reach Compliance Code | unknown |
| 其他特性 | 2 WIRE SERIAL INTERFACE |
| 最大时钟频率 (fCLK) | 1 MHz |
| JESD-30 代码 | R-PDSO-G8 |
| 长度 | 4.9 mm |
| 内存密度 | 128 bit |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 字数 | 16 words |
| 字数代码 | 16 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 16X8 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 并行/串行 | SERIAL |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.75 mm |
| 串行总线类型 | I2C |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 宽度 | 3.9 mm |
| 最长写入周期时间 (tWC) | 5 ms |
| X24C00S-3T1 | X24C00ST1 | X24C00SIT1 | X24C00SM-3T1 | X24C00SI-3T1 | X24C00SM-2.7T1 | X24C00S-2.7T1 | X24C00SMT1 | X24C00SI-2.7T1 | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | EEPROM, 16X8, Serial, CMOS, PDSO8, PLASTIC, SOIC-8 | EEPROM, 16X8, Serial, CMOS, PDSO8, PLASTIC, SOIC-8 | EEPROM, 16X8, Serial, CMOS, PDSO8, PLASTIC, SOIC-8 | EEPROM, 16X8, Serial, CMOS, PDSO8, PLASTIC, SOIC-8 | EEPROM, 16X8, Serial, CMOS, PDSO8, PLASTIC, SOIC-8 | EEPROM, 16X8, Serial, CMOS, PDSO8, PLASTIC, SOIC-8 | EEPROM, 16X8, Serial, CMOS, PDSO8, PLASTIC, SOIC-8 | EEPROM, 16X8, Serial, CMOS, PDSO8, PLASTIC, SOIC-8 | EEPROM, 16X8, Serial, CMOS, PDSO8, PLASTIC, SOIC-8 |
| 包装说明 | PLASTIC, SOIC-8 | PLASTIC, SOIC-8 | PLASTIC, SOIC-8 | PLASTIC, SOIC-8 | PLASTIC, SOIC-8 | PLASTIC, SOIC-8 | PLASTIC, SOIC-8 | PLASTIC, SOIC-8 | PLASTIC, SOIC-8 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 其他特性 | 2 WIRE SERIAL INTERFACE | 2 WIRE SERIAL INTERFACE | 2 WIRE SERIAL INTERFACE | 2 WIRE SERIAL INTERFACE | 2 WIRE SERIAL INTERFACE | 2 WIRE SERIAL INTERFACE | 2 WIRE SERIAL INTERFACE | 2 WIRE SERIAL INTERFACE | 2 WIRE SERIAL INTERFACE |
| 最大时钟频率 (fCLK) | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz |
| JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
| 长度 | 4.9 mm | 4.9 mm | 4.9 mm | 4.9 mm | 4.9 mm | 4.9 mm | 4.9 mm | 4.9 mm | 4.9 mm |
| 内存密度 | 128 bit | 128 bit | 128 bit | 128 bit | 128 bit | 128 bit | 128 bit | 128 bit | 128 bit |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 字数 | 16 words | 16 words | 16 words | 16 words | 16 words | 16 words | 16 words | 16 words | 16 words |
| 字数代码 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 85 °C | 125 °C | 85 °C | 125 °C | 70 °C | 125 °C | 85 °C |
| 最低工作温度 | - | - | -40 °C | -55 °C | -40 °C | -55 °C | - | -55 °C | -40 °C |
| 组织 | 16X8 | 16X8 | 16X8 | 16X8 | 16X8 | 16X8 | 16X8 | 16X8 | 16X8 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | SOP | SOP | SOP | SOP | SOP | SOP | SOP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm |
| 串行总线类型 | I2C | I2C | I2C | I2C | I2C | I2C | I2C | I2C | I2C |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 3 V | 4.5 V | 4.5 V | 3 V | 3 V | 2.7 V | 2.7 V | 4.5 V | 2.7 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | INDUSTRIAL | MILITARY | INDUSTRIAL | MILITARY | COMMERCIAL | MILITARY | INDUSTRIAL |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm |
| 最长写入周期时间 (tWC) | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms |
| 厂商名称 | Xicor Inc | - | - | Xicor Inc | Xicor Inc | Xicor Inc | Xicor Inc | Xicor Inc | Xicor Inc |
RF/无线
RF/无线
RF/无线
嵌入式系统
嵌入式系统
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