Fast Page DRAM, 512KX8, 100ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, TSOP-28
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | Micron Technology |
零件包装代码 | TSOP |
包装说明 | 0.400 INCH, PLASTIC, TSOP-28 |
针数 | 28 |
Reach Compliance Code | not_compliant |
ECCN代码 | EAR99 |
访问模式 | FAST PAGE |
最长访问时间 | 100 ns |
其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
I/O 类型 | COMMON |
JESD-30 代码 | R-PDSO-G28 |
JESD-609代码 | e0 |
长度 | 18.41 mm |
内存密度 | 4194304 bit |
内存集成电路类型 | FAST PAGE DRAM |
内存宽度 | 8 |
功能数量 | 1 |
端口数量 | 1 |
端子数量 | 28 |
字数 | 524288 words |
字数代码 | 512000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 512KX8 |
输出特性 | 3-STATE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSOP2 |
封装等效代码 | TSOP28,.46 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 5 V |
认证状态 | Not Qualified |
刷新周期 | 1024 |
座面最大高度 | 1.2 mm |
自我刷新 | NO |
最大待机电流 | 0.0002 A |
最大压摆率 | 0.09 mA |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 10.16 mm |
MT4C8513TG-10L | MT4C8513Z-10L | MT4C8512DJ-10L | MT4C8512DJ-10LTR | MT4C8513DJ-10L | MT4C8513DJ-10LTR | MT4C8512Z-10L | MT4C8513TG-10LTR | MT4C8512TG-10L | MT4C8512TG-10LTR | |
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描述 | Fast Page DRAM, 512KX8, 100ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, TSOP-28 | Fast Page DRAM, 512KX8, 100ns, CMOS, PZIP28, 0.375 INCH, PLASTIC, ZIP-28 | Fast Page DRAM, 512KX8, 100ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, SOJ-28 | Fast Page DRAM, 512KX8, 100ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, SOJ-28 | Fast Page DRAM, 512KX8, 100ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, SOJ-28 | Fast Page DRAM, 512KX8, 100ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, SOJ-28 | Fast Page DRAM, 512KX8, 100ns, CMOS, PZIP28, 0.375 INCH, PLASTIC, ZIP-28 | Fast Page DRAM, 512KX8, 100ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, TSOP2-28 | Fast Page DRAM, 512KX8, 100ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, TSOP-28 | Fast Page DRAM, 512KX8, 100ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, TSOP2-28 |
厂商名称 | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
零件包装代码 | TSOP | ZIP | SOJ | SOJ | SOJ | SOJ | ZIP | TSOP | TSOP | TSOP |
包装说明 | 0.400 INCH, PLASTIC, TSOP-28 | 0.375 INCH, PLASTIC, ZIP-28 | 0.400 INCH, PLASTIC, SOJ-28 | SOJ, | 0.400 INCH, PLASTIC, SOJ-28 | SOJ, | 0.375 INCH, PLASTIC, ZIP-28 | TSOP2, | 0.400 INCH, PLASTIC, TSOP-28 | TSOP2, |
针数 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
Reach Compliance Code | not_compliant | not_compliant | unknown | unknown | unknown | unknown | unknown | unknown | not_compliant | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
访问模式 | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE |
最长访问时间 | 100 ns | 100 ns | 100 ns | 100 ns | 100 ns | 100 ns | 100 ns | 100 ns | 100 ns | 100 ns |
其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
JESD-30 代码 | R-PDSO-G28 | R-PZIP-T28 | R-PDSO-J28 | R-PDSO-J28 | R-PDSO-J28 | R-PDSO-J28 | R-PZIP-T28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 |
长度 | 18.41 mm | 35.455 mm | 18.44 mm | 18.44 mm | 18.44 mm | 18.44 mm | 35.455 mm | 18.41 mm | 18.41 mm | 18.41 mm |
内存密度 | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
内存集成电路类型 | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
字数 | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words |
字数代码 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSOP2 | ZIP | SOJ | SOJ | SOJ | SOJ | ZIP | TSOP2 | TSOP2 | TSOP2 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
刷新周期 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 |
座面最大高度 | 1.2 mm | 10.16 mm | 3.66 mm | 3.66 mm | 3.66 mm | 3.66 mm | 10.16 mm | 1.2 mm | 1.2 mm | 1.2 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | NO | YES | YES | YES | YES | NO | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | GULL WING | THROUGH-HOLE | J BEND | J BEND | J BEND | J BEND | THROUGH-HOLE | GULL WING | GULL WING | GULL WING |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | ZIG-ZAG | DUAL | DUAL | DUAL | DUAL | ZIG-ZAG | DUAL | DUAL | DUAL |
宽度 | 10.16 mm | 2.795 mm | 10.21 mm | 10.21 mm | 10.21 mm | 10.21 mm | 2.795 mm | 10.16 mm | 10.16 mm | 10.16 mm |
是否无铅 | 含铅 | 含铅 | 含铅 | - | 含铅 | - | 含铅 | - | 含铅 | - |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | - | 不符合 | - | 不符合 | - | 不符合 | - |
I/O 类型 | COMMON | COMMON | COMMON | - | COMMON | - | COMMON | - | COMMON | - |
JESD-609代码 | e0 | e0 | e0 | - | e0 | - | e0 | e0 | e0 | e0 |
封装等效代码 | TSOP28,.46 | ZIP28,.1 | SOJ28,.44 | - | SOJ28,.44 | - | ZIP28,.1 | - | TSOP28,.46 | - |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - | NOT SPECIFIED | - | NOT SPECIFIED | - |
电源 | 5 V | 5 V | 5 V | - | 5 V | - | 5 V | - | 5 V | - |
自我刷新 | NO | NO | NO | - | NO | - | NO | - | NO | - |
最大待机电流 | 0.0002 A | 0.0002 A | 0.0002 A | - | 0.0002 A | - | 0.0002 A | - | 0.0002 A | - |
最大压摆率 | 0.09 mA | 0.09 mA | 0.09 mA | - | 0.09 mA | - | 0.09 mA | - | 0.09 mA | - |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | TIN LEAD | Tin/Lead (Sn/Pb) | TIN LEAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - | NOT SPECIFIED | - | NOT SPECIFIED | - |
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