RISC Microprocessor, 64-Bit, 180MHz, PQFP128, QFP-128
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | QFP |
| 包装说明 | QFP, |
| 针数 | 128 |
| Reach Compliance Code | compliant |
| ECCN代码 | 3A001.A.3 |
| 地址总线宽度 | 64 |
| 位大小 | 64 |
| 边界扫描 | YES |
| 最大时钟频率 | 90 MHz |
| 外部数据总线宽度 | 64 |
| 格式 | FLOATING POINT |
| 集成缓存 | YES |
| JESD-30 代码 | S-PQFP-G128 |
| JESD-609代码 | e0 |
| 低功率模式 | YES |
| 湿度敏感等级 | 3 |
| 端子数量 | 128 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QFP |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK |
| 峰值回流温度（摄氏度） | 225 |
| 认证状态 | Not Qualified |
| 速度 | 180 MHz |
| 最大供电电压 | 3.465 V |
| 最小供电电压 | 3.135 V |
| 标称供电电压 | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | OTHER |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 20 |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR, RISC |
| IDT79RC64V475-180DZ | IDT79RC64V475-250DZI | IDT79RC64V475-200DZI | IDT79RC64V475-200DZ | IDT79RC64V475-180DZI | |
|---|---|---|---|---|---|
| 描述 | RISC Microprocessor, 64-Bit, 180MHz, PQFP128, QFP-128 | RISC Microprocessor, 64-Bit, 250MHz, PQFP128, QFP-128 | RISC Microprocessor, 64-Bit, 200MHz, PQFP128, QFP-128 | RISC Microprocessor, 64-Bit, 200MHz, PQFP128, QFP-128 | RISC Microprocessor, 64-Bit, 180MHz, PQFP128, QFP-128 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | QFP | QFP | QFP | QFP | QFP |
| 包装说明 | QFP, | QFP, | QFP, | QFP, | QFP, |
| 针数 | 128 | 128 | 128 | 128 | 128 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 |
| 地址总线宽度 | 64 | 64 | 64 | 64 | 64 |
| 位大小 | 64 | 64 | 64 | 64 | 64 |
| 边界扫描 | YES | YES | YES | YES | YES |
| 最大时钟频率 | 90 MHz | 125 MHz | 100 MHz | 100 MHz | 90 MHz |
| 外部数据总线宽度 | 64 | 64 | 64 | 64 | 64 |
| 格式 | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT |
| 集成缓存 | YES | YES | YES | YES | YES |
| JESD-30 代码 | S-PQFP-G128 | S-PQFP-G128 | S-PQFP-G128 | S-PQFP-G128 | S-PQFP-G128 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
| 低功率模式 | YES | YES | YES | YES | YES |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | 3 |
| 端子数量 | 128 | 128 | 128 | 128 | 128 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | - | -40 °C | -40 °C | - | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QFP | QFP | QFP | QFP | QFP |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK |
| 峰值回流温度（摄氏度） | 225 | 225 | 225 | 225 | 225 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 速度 | 180 MHz | 250 MHz | 200 MHz | 200 MHz | 180 MHz |
| 最大供电电压 | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V |
| 最小供电电压 | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V |
| 标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | OTHER | INDUSTRIAL | INDUSTRIAL | OTHER | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | 20 | 20 | 20 | 20 | 20 |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC |
| 厂商名称 | IDT (Integrated Device Technology) | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
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