Low Skew Clock Driver, FS60 Series, 18 True Output(s), 0 Inverted Output(s), CMOS, PDSO48, SSOP-48
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | AMI Semiconductor |
| 包装说明 | SSOP-48 |
| Reach Compliance Code | unknown |
| 系列 | FS60 |
| 输入调节 | STANDARD |
| JESD-30 代码 | R-PDSO-G48 |
| JESD-609代码 | e0 |
| 逻辑集成电路类型 | LOW SKEW CLOCK DRIVER |
| 功能数量 | 1 |
| 反相输出次数 | |
| 端子数量 | 48 |
| 实输出次数 | 18 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SSOP48,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 电源 | 3.3 V |
| Prop。Delay @ Nom-Sup | 4.2 ns |
| 传播延迟（tpd） | 4.2 ns |
| 认证状态 | Not Qualified |
| 最大供电电压 (Vsup) | 3.465 V |
| 最小供电电压 (Vsup) | 3.135 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 0.635 mm |
| 端子位置 | DUAL |
| 最小 fmax | 133 MHz |
| FS6050 | 11257-801 | FS6054 | FS6057 | |
|---|---|---|---|---|
| 描述 | Low Skew Clock Driver, FS60 Series, 18 True Output(s), 0 Inverted Output(s), CMOS, PDSO48, SSOP-48 | Low Skew Clock Driver, 18 True Output(s), 0 Inverted Output(s), PDSO48, 0.300 INCH, SSOP-48 | Low Skew Clock Driver, FS60 Series, 14 True Output(s), 0 Inverted Output(s), CMOS, PDSO28, 0.300 INCH, SOIC-28 | Low Skew Clock Driver, 17 True Output(s), 0 Inverted Output(s), CMOS, PDSO32, SOIC-32 |
| 厂商名称 | AMI Semiconductor | AMI Semiconductor | AMI Semiconductor | AMI Semiconductor |
| 包装说明 | SSOP-48 | 0.300 INCH, SSOP-48 | 0.300 INCH, SOIC-28 | SOIC-32 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| 输入调节 | STANDARD | STANDARD | STANDARD | STANDARD |
| JESD-30 代码 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G28 | R-PDSO-G32 |
| 逻辑集成电路类型 | LOW SKEW CLOCK DRIVER | LOW SKEW CLOCK DRIVER | LOW SKEW CLOCK DRIVER | LOW SKEW CLOCK DRIVER |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 48 | 48 | 28 | 32 |
| 实输出次数 | 18 | 18 | 14 | 17 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | SSOP | SOP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE |
| 传播延迟（tpd） | 4.2 ns | 5 ns | 4.2 ns | 5 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 3.465 V | 3.465 V | 3.465 V | 3.465 V |
| 最小供电电压 (Vsup) | 3.135 V | 3.135 V | 3.135 V | 3.135 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.635 mm | 0.635 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 是否Rohs认证 | 不符合 | - | 不符合 | 不符合 |
| JESD-609代码 | e0 | - | e0 | e0 |
| 封装等效代码 | SSOP48,.4 | - | SOP28,.4 | SOP32,.4 |
| 电源 | 3.3 V | - | 3.3 V | 3.3 V |
| Prop。Delay @ Nom-Sup | 4.2 ns | - | 4.2 ns | 4.2 ns |
| 技术 | CMOS | - | CMOS | CMOS |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Base Number Matches | - | 1 | 1 | 1 |
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