Flash, 8MX16, 65ns, PBGA80, 11.50 X 9 MM, 0.80 MM PITCH, PLASTIC, FBGA-80
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | SPANSION |
| 零件包装代码 | BGA |
| 包装说明 | 11.50 X 9 MM, 0.80 MM PITCH, PLASTIC, FBGA-80 |
| 针数 | 80 |
| Reach Compliance Code | compliant |
| ECCN代码 | 3A991.B.1.A |
| 最长访问时间 | 65 ns |
| 启动块 | BOTTOM/TOP |
| JESD-30 代码 | R-PBGA-B80 |
| JESD-609代码 | e1 |
| 长度 | 11.5 mm |
| 内存密度 | 134217728 bit |
| 内存集成电路类型 | FLASH |
| 内存宽度 | 16 |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 端子数量 | 80 |
| 字数 | 8388608 words |
| 字数代码 | 8000000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 8MX16 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | BGA |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | 250 |
| 编程电压 | 3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 2.7 V |
| 标称供电电压 (Vsup) | 3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | TIN SILVER COPPER |
| 端子形式 | BALL |
| 端子节距 | 0.8 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 类型 | NOR TYPE |
| 宽度 | 9 mm |
| AM29PDL129H68VKF | AM29PDL129H63VKF | AM29PDL129H88VKF | AM29PDL129H53VKF | |
|---|---|---|---|---|
| 描述 | Flash, 8MX16, 65ns, PBGA80, 11.50 X 9 MM, 0.80 MM PITCH, PLASTIC, FBGA-80 | Flash, 8MX16, 65ns, PBGA80, 11.50 X 9 MM, 0.80 MM PITCH, PLASTIC, FBGA-80 | Flash, 8MX16, 85ns, PBGA80, 11.50 X 9 MM, 0.80 MM PITCH, PLASTIC, FBGA-80 | Flash, 8MX16, 55ns, PBGA80, 11.50 X 9 MM, 0.80 MM PITCH, PLASTIC, FBGA-80 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | SPANSION | SPANSION | SPANSION | SPANSION |
| 零件包装代码 | BGA | BGA | BGA | BGA |
| 包装说明 | 11.50 X 9 MM, 0.80 MM PITCH, PLASTIC, FBGA-80 | 11.50 X 9 MM, 0.80 MM PITCH, PLASTIC, FBGA-80 | 11.50 X 9 MM, 0.80 MM PITCH, PLASTIC, FBGA-80 | 11.50 X 9 MM, 0.80 MM PITCH, PLASTIC, FBGA-80 |
| 针数 | 80 | 80 | 80 | 80 |
| Reach Compliance Code | compliant | compliant | compliant | compliant |
| ECCN代码 | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A |
| 最长访问时间 | 65 ns | 65 ns | 85 ns | 55 ns |
| 启动块 | BOTTOM/TOP | BOTTOM/TOP | BOTTOM/TOP | BOTTOM/TOP |
| JESD-30 代码 | R-PBGA-B80 | R-PBGA-B80 | R-PBGA-B80 | R-PBGA-B80 |
| JESD-609代码 | e1 | e1 | e1 | e1 |
| 长度 | 11.5 mm | 11.5 mm | 11.5 mm | 11.5 mm |
| 内存密度 | 134217728 bit | 134217728 bit | 134217728 bit | 134217728 bit |
| 内存集成电路类型 | FLASH | FLASH | FLASH | FLASH |
| 内存宽度 | 16 | 16 | 16 | 16 |
| 湿度敏感等级 | 3 | 3 | 3 | 3 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 80 | 80 | 80 | 80 |
| 字数 | 8388608 words | 8388608 words | 8388608 words | 8388608 words |
| 字数代码 | 8000000 | 8000000 | 8000000 | 8000000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 8MX16 | 8MX16 | 8MX16 | 8MX16 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | BGA | BGA | BGA | BGA |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | 250 | 250 | 250 | 250 |
| 编程电压 | 3 V | 3 V | 3 V | 3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1 mm | 1 mm | 1 mm | 1 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 标称供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | TIN SILVER COPPER | TIN SILVER COPPER | TIN SILVER COPPER | TIN SILVER COPPER |
| 端子形式 | BALL | BALL | BALL | BALL |
| 端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 类型 | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
| 宽度 | 9 mm | 9 mm | 9 mm | 9 mm |
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