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W19B160BTT9M

产品描述Flash, 1MX16, 90ns, PDSO48, 12 X 20 MM, GREEN, TSOP-48
产品类别存储    存储   
文件大小537KB,共47页
制造商Winbond(华邦电子)
官网地址http://www.winbond.com.tw
标准
下载文档 详细参数 选型对比 全文预览

W19B160BTT9M概述

Flash, 1MX16, 90ns, PDSO48, 12 X 20 MM, GREEN, TSOP-48

W19B160BTT9M规格参数

参数名称属性值
是否Rohs认证符合
厂商名称Winbond(华邦电子)
零件包装代码TSOP
包装说明12 X 20 MM, GREEN, TSOP-48
针数48
Reach Compliance Codecompliant
ECCN代码EAR99
最长访问时间90 ns
备用内存宽度8
启动块TOP
命令用户界面YES
通用闪存接口YES
数据轮询YES
JESD-30 代码R-PDSO-G48
长度18.4 mm
内存密度16777216 bit
内存集成电路类型FLASH
内存宽度16
功能数量1
部门数/规模1,2,1,31
端子数量48
字数1048576 words
字数代码1000000
工作模式ASYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织1MX16
封装主体材料PLASTIC/EPOXY
封装代码TSOP1
封装等效代码TSSOP48,.8,20
封装形状RECTANGULAR
封装形式SMALL OUTLINE, THIN PROFILE
并行/串行PARALLEL
电源3/3.3 V
编程电压2.7 V
认证状态Not Qualified
就绪/忙碌YES
座面最大高度1.2 mm
部门规模16K,8K,32K,64K
最大待机电流0.000005 A
最大压摆率0.03 mA
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)2.7 V
标称供电电压 (Vsup)3 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子形式GULL WING
端子节距0.5 mm
端子位置DUAL
切换位YES
类型NOR TYPE
宽度12 mm

W19B160BTT9M文档预览

W19B160BT/B DATA SHEET
-Table of Contents-
1.
2.
3.
4.
5.
6.
GENERAL DESCRIPTION ......................................................................................................... 4
FEATURES ................................................................................................................................. 4
PIN CONFIGURATIONS ............................................................................................................ 6
BLOCK DIAGRAM ...................................................................................................................... 7
PIN DESCRIPTION..................................................................................................................... 8
FUNCTIONAL DESCRIPTION ................................................................................................... 9
6.1
DEVICE BUS OPERATION............................................................................................ 9
6.1.1
6.1.2
6.1.3
6.1.4
6.1.5
6.1.6
6.1.7
6.1.8
6.1.9
6.1.10
6.1.11
6.1.12
6.1.13
6.1.14
6.1.15
Word/Byte Configuration ..................................................................................................9
Reading Array Data ..........................................................................................................9
Writing Commands/Command Sequences.......................................................................9
Program and Erase Operation Status...............................................................................9
Standby Mode ..................................................................................................................9
Automatic Sleep Mode ...................................................................................................10
#RESET: Hardware Reset Pin........................................................................................10
Output Disable Mode......................................................................................................10
Auto-select Mode............................................................................................................10
Sector Protection and Un-protection.............................................................................11
Temporary Sector Unprotect ........................................................................................11
Hardware Data Protection ............................................................................................11
Write Pulse “Glitch” Protection .....................................................................................11
Logical Inhibit ...............................................................................................................11
Power-Up Write Inhibit..................................................................................................11
Reading Array Data ........................................................................................................12
Reset Command.............................................................................................................12
Auto-select Command Sequence ...................................................................................12
Byte/Word Program Command Sequence......................................................................13
Chip Erase Command Sequence ...................................................................................13
Sector Erase Command Sequence ................................................................................13
Unlock Bypass Command Sequence .............................................................................14
DQ7: #Data Polling.........................................................................................................14
RY/#BY: Ready/#Busy ...................................................................................................15
DQ6: Toggle Bit..............................................................................................................15
6.2
COMMAND DEFINITIONS ........................................................................................... 12
6.2.1
6.2.2
6.2.3
6.2.4
6.2.5
6.2.6
6.2.7
6.3
WRITE OPERATION STATUS..................................................................................... 14
6.3.1
6.3.2
6.3.3
-1-
Publication Release Date:Apr. /20/2009
Revision A9
W19B160BT/B DATA SHEET
6.3.4
6.3.5
6.3.6
Reading Toggle Bits DQ6/DQ2 ......................................................................................15
DQ3: Sector Erase Timer ...............................................................................................16
DQ5 : Exceeded Timing Limits .......................................................................................16
7.
8.
SPECIAL CHARACTERISTIC .................................................................................................. 16
TABLE OF OPERATION MODES ............................................................................................ 17
8.1
8.2
8.3
8.4
8.5
8.6
8.7
8.8
8.9
8.10
8.11
8.12
8.13
8.14
8.15
8.16
Device Bus Operations ................................................................................................. 17
Sector Address Table (Top Boot Block) ....................................................................... 18
Sector Address Table (Bottom Boot Block) .................................................................. 19
CFI Query Identification String...................................................................................... 20
System Interface String ................................................................................................ 20
Device Geometry Definition .......................................................................................... 21
Primary Vendor-Specific Extended Query.................................................................... 22
Command Definitions ................................................................................................... 23
Write Operation Status ................................................................................................. 24
Temporary Sector Unprotect Algorithm ........................................................................ 25
In-System Sector Protect/Unprotect Algorithms........................................................... 26
Program Algorithm........................................................................................................ 27
Erase Algorithm (Polling) .............................................................................................. 27
Erase Algorithm (Toggle).............................................................................................. 28
Data Polling Algorithm .................................................................................................. 29
Toggle Bit Algorithm ..................................................................................................... 30
Absolute Maximum Ratings .......................................................................................... 31
Operating Ranges......................................................................................................... 31
DC CHARACTERISTICS.............................................................................................. 32
AC CHARACTERISTICS.............................................................................................. 33
9.4.1
9.4.2
9.4.3
9.4.4
9.4.5
9.4.6
9.4.7
9.4.8
9.4.9
Test Condition ................................................................................................................33
AC Test Load and Waveforms .......................................................................................33
Read-Only Operations....................................................................................................34
Read-Only Operations....................................................................................................34
Hardware Reset (#RESET) ............................................................................................35
Word/Byte Configuration (#BYTE)..................................................................................35
Erase and Program Operation........................................................................................36
Temporary Sector Unprotect ..........................................................................................36
Alternate #CE Controlled Erase and Program Operation ...............................................37
9.
ELECTRICAL CHARACTERISTICS......................................................................................... 31
9.1
9.2
9.3
9.4
10.
TIMING WAVEFORMS ............................................................................................................. 38
10.1
AC Read Waveform...................................................................................................... 38
-2-
W19B160BT/B DATA SHEET
10.2
10.3
10.4
10.5
10.6
10.7
10.8
10.9
10.10
10.11
11.
12.
13.
Reset Waveform ........................................................................................................... 38
#BYTE Waveform for Read Operation ......................................................................... 39
#BYTE Waveform for Write Operation ......................................................................... 39
Programming Waveform............................................................................................... 40
Chip/Sector Erase Waveform ....................................................................................... 40
#Data Polling Waveform (During Embedded Algorithms) ............................................ 41
Toggle Bit Waveform (During Embedded Algorithms) ................................................. 41
Temporary Sector Unprotect Timing Diagram.............................................................. 42
Sector Protect and Unprotect Timing Diagram ........................................................ 42
Alternate #CE Controlled Write (Erase/Program) Operation Timing ....................... 43
LATCHUP CHARACTERISTICS .............................................................................................. 44
CAPACITANCE......................................................................................................................... 44
ORDERING INFORMATION .................................................................................................... 45
Quality Grade & Green
:
H: Extended (-20℃ ~85
)with Green package
M:Industrial (-40℃ ~85
)with Green package
SPEEDOPTION
7 : 70 ~ 79ns
9 : 90 ~ 99ns
PACKAGE TYPE
T = 48 - Pin TSOP Package, 12 x 20mm
BOOT CODE SECTOR ARCHITECTURE
T = Top sector
B = Bottom sector
DEVICE NUMBER/DESCRIPTION
W19B160B
16 Megabit (2M x-8Bit/ 1 M x 16 Bit) CMOS Flash Memory
-
PACKAGE DIMENSIONS ..................................................................................................................... 45
PACKAGE DIMENSIONS ..................................................................................................................... 46
14.
VERSION HISTORY ................................................................................................................. 47
-3-
Publication Release Date Apr,20, 2009
Revision A9
W19B160BT/B DATA SHEET
1. GENERAL DESCRIPTION
The W19B160B is a 16Mbit, 2.7~3.6 volt CMOS flash memory organized as 2M
×
8 or 1M
×
16 bits.
For flexible erase capability, the 16Mbits of data are divided into one 16Kbyte, two 8Kbyte, one
32Kbyte, and thirty-one 64Kbyte sectors. The word-wide (× 16) data appears on DQ15-DQ0, and
byte-wide (× 8) data appears on DQ7−DQ0. The device can be programmed and erased in-system
with a standard 2.7~3.6V power supply. A 12-volt V
PP
is not required. The unique cell architecture of
the W19B160B results in fast program/erase operations with extremely low current consumption. The
device can also be programmed and erased by using standard EPROM programmers.
2. FEATURES
Performance
2.7~3.6-volt write (program and erase) operations
Fast write operation
Sector erase time: 0.7s (Typical)
Chip erases time: 25 s (Typical)
Byte/Word programming time: 5/7 µs (Typical)
Read access time: 70 ns
Typical program/erase cycles:
100K
Twenty-year data retention
Ultra low power consumption
Active current (Read): 9mA (Typical)
Active current (Program/erase): 20mA (Typical)
Standby current: 0.2
μA
(Typical)
Architecture
Sector erases architecture
One 16Kbyte, two 8Kbyte, one 32Kbyte, and thirty-one 64Kbyte sectors
Top or bottom boot block configurations available
Supports full chip erase
JEDEC standard byte-wide and word-wide pin-outs TTL compatible I/O
Manufactured on WinStack-S 0.13µm process technology
Available packages: 48-pin TSOP
Compatible with common Flash Memory Interface (CFI) specification
Software Features
Flash device parameters stored directly on the device
Allows software driver to identify and use a variety of different current and future Flash products
End of program detection
-4-
W19B160BT/B DATA SHEET
Software method: Toggle bit/Data polling
Unlock bypass program command
Allows the system to program bytes or words to device faster than standard program command.
Hardware Features
Ready/#Busy output (RY/#BY)
Detect program or erase cycle completion
Hardware reset pin (#RESET)
Reset the internal state machine to the read mode
Sector Protection
Sectors can be locked in-system or via programmer
Temporary Sector Unprotect allows changing data in protected sectors in-system
Temperature range
Extended temperature range (-20℃ to 85
℃)
Industrial devices ambient temperature(-40
to +85
)
-5-
Publication Release Date Apr,20, 2009
Revision A9

W19B160BTT9M相似产品对比

W19B160BTT9M W19B160BBT9M W19B160BTT9H W19B160BBT9H W19B160BBT7M W19B160BBT7H W19B160BTT7M
描述 Flash, 1MX16, 90ns, PDSO48, 12 X 20 MM, GREEN, TSOP-48 Flash, 1MX16, 90ns, PDSO48, 12 X 20 MM, GREEN, TSOP-48 Flash, 1MX16, 90ns, PDSO48, 12 X 20 MM, GREEN, TSOP-48 Flash, 1MX16, 90ns, PDSO48, 12 X 20 MM, GREEN, TSOP-48 Flash, 1MX16, 70ns, PDSO48, 12 X 20 MM, GREEN, TSOP-48 Flash, 1MX16, 70ns, PDSO48, 12 X 20 MM, GREEN, TSOP-48 Flash, 1MX16, 70ns, PDSO48, 12 X 20 MM, GREEN, TSOP-48
是否Rohs认证 符合 符合 符合 符合 符合 符合 符合
厂商名称 Winbond(华邦电子) Winbond(华邦电子) Winbond(华邦电子) Winbond(华邦电子) Winbond(华邦电子) Winbond(华邦电子) Winbond(华邦电子)
零件包装代码 TSOP TSOP TSOP TSOP TSOP TSOP TSOP
包装说明 12 X 20 MM, GREEN, TSOP-48 12 X 20 MM, GREEN, TSOP-48 12 X 20 MM, GREEN, TSOP-48 12 X 20 MM, GREEN, TSOP-48 12 X 20 MM, GREEN, TSOP-48 12 X 20 MM, GREEN, TSOP-48 12 X 20 MM, GREEN, TSOP-48
针数 48 48 48 48 48 48 48
Reach Compliance Code compliant compliant compliant compliant compliant unknown compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
最长访问时间 90 ns 90 ns 90 ns 90 ns 70 ns 70 ns 70 ns
备用内存宽度 8 8 8 8 8 8 8
启动块 TOP BOTTOM TOP BOTTOM BOTTOM BOTTOM TOP
命令用户界面 YES YES YES YES YES YES YES
通用闪存接口 YES YES YES YES YES YES YES
数据轮询 YES YES YES YES YES YES YES
JESD-30 代码 R-PDSO-G48 R-PDSO-G48 R-PDSO-G48 R-PDSO-G48 R-PDSO-G48 R-PDSO-G48 R-PDSO-G48
长度 18.4 mm 18.4 mm 18.4 mm 18.4 mm 18.4 mm 18.4 mm 18.4 mm
内存密度 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit
内存集成电路类型 FLASH FLASH FLASH FLASH FLASH FLASH FLASH
内存宽度 16 16 16 16 16 16 16
功能数量 1 1 1 1 1 1 1
部门数/规模 1,2,1,31 1,2,1,31 1,2,1,31 1,2,1,31 1,2,1,31 1,2,1,31 1,2,1,31
端子数量 48 48 48 48 48 48 48
字数 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words
字数代码 1000000 1000000 1000000 1000000 1000000 1000000 1000000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -20 °C -20 °C -40 °C -20 °C -40 °C
组织 1MX16 1MX16 1MX16 1MX16 1MX16 1MX16 1MX16
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSOP1 TSOP1 TSOP1 TSOP1 TSOP1 TSOP1 TSOP1
封装等效代码 TSSOP48,.8,20 TSSOP48,.8,20 TSSOP48,.8,20 TSSOP48,.8,20 TSSOP48,.8,20 TSSOP48,.8,20 TSSOP48,.8,20
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
电源 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V
编程电压 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
就绪/忙碌 YES YES YES YES YES YES YES
座面最大高度 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm
部门规模 16K,8K,32K,64K 16K,8K,32K,64K 16K,8K,32K,64K 16K,8K,32K,64K 16K,8K,32K,64K 16K,8K,32K,64K 16K,8K,32K,64K
最大待机电流 0.000005 A 0.000005 A 0.000005 A 0.000005 A 0.000005 A 0.000005 A 0.000005 A
最大压摆率 0.03 mA 0.03 mA 0.03 mA 0.03 mA 0.03 mA 0.03 mA 0.03 mA
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
标称供电电压 (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V 3 V
表面贴装 YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL OTHER OTHER INDUSTRIAL OTHER INDUSTRIAL
端子形式 GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
端子节距 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL
切换位 YES YES YES YES YES YES YES
类型 NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE
宽度 12 mm 12 mm 12 mm 12 mm 12 mm 12 mm 12 mm

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