Dual-Port SRAM, 128KX36, 3.8ns, CMOS, PBGA172, 15 X 15 MM, 0.51 MM HEIGHT, 1 MM PITCH, BGA-172
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Cypress(赛普拉斯) |
| 零件包装代码 | BGA |
| 包装说明 | 15 X 15 MM, 0.51 MM HEIGHT, 1 MM PITCH, BGA-172 |
| 针数 | 172 |
| Reach Compliance Code | compliant |
| ECCN代码 | 3A991.B.2.A |
| 最长访问时间 | 3.8 ns |
| I/O 类型 | COMMON |
| JESD-30 代码 | S-PBGA-B172 |
| JESD-609代码 | e0 |
| 长度 | 15 mm |
| 内存密度 | 4718592 bit |
| 内存集成电路类型 | DUAL-PORT SRAM |
| 内存宽度 | 36 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 172 |
| 字数 | 131072 words |
| 字数代码 | 128000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 128KX36 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LBGA |
| 封装等效代码 | BGA172,14X14,40 |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY, LOW PROFILE |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 3.3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.25 mm |
| 最小待机电流 | 3.14 V |
| 最大供电电压 (Vsup) | 3.465 V |
| 最小供电电压 (Vsup) | 3.135 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | BALL |
| 端子节距 | 1 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 15 mm |
| CY7C0852V-150BGI | CY7C0852V-133BGC | ADM6319CZ25ARJZRL7 | CY7C0852V-100BGC | CY7C0852V-133BGI | CY7C0852V-100BGI | |
|---|---|---|---|---|---|---|
| 描述 | Dual-Port SRAM, 128KX36, 3.8ns, CMOS, PBGA172, 15 X 15 MM, 0.51 MM HEIGHT, 1 MM PITCH, BGA-172 | Dual-Port SRAM, 128KX36, 4.2ns, CMOS, PBGA172, 15 X 15 MM, 0.51 MM HEIGHT, 1 MM PITCH, BGA-172 | Supervisory Circuits with Watchdog and Manual Reset in 5-Lead SOT-23 | Dual-Port SRAM, 128KX36, 5ns, CMOS, PBGA172, 15 X 15 MM, 0.51 MM HEIGHT, 1 MM PITCH, BGA-172 | Dual-Port SRAM, 128KX36, 4.2ns, CMOS, PBGA172, 15 X 15 MM, 0.51 MM HEIGHT, 1 MM PITCH, BGA-172 | Dual-Port SRAM, 128KX36, 5ns, CMOS, PBGA172, 15 X 15 MM, 0.51 MM HEIGHT, 1 MM PITCH, BGA-172 |
| 是否Rohs认证 | 不符合 | 不符合 | - | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Cypress(赛普拉斯) | - | - | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) |
| 零件包装代码 | BGA | BGA | - | BGA | BGA | BGA |
| 包装说明 | 15 X 15 MM, 0.51 MM HEIGHT, 1 MM PITCH, BGA-172 | 15 X 15 MM, 0.51 MM HEIGHT, 1 MM PITCH, BGA-172 | - | 15 X 15 MM, 0.51 MM HEIGHT, 1 MM PITCH, BGA-172 | 15 X 15 MM, 0.51 MM HEIGHT, 1 MM PITCH, BGA-172 | 15 X 15 MM, 0.51 MM HEIGHT, 1 MM PITCH, BGA-172 |
| 针数 | 172 | 172 | - | 172 | 172 | 172 |
| Reach Compliance Code | compliant | compliant | - | compliant | compliant | compliant |
| ECCN代码 | 3A991.B.2.A | 3A991.B.2.A | - | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
| 最长访问时间 | 3.8 ns | 4.2 ns | - | 5 ns | 4.2 ns | 5 ns |
| I/O 类型 | COMMON | COMMON | - | COMMON | COMMON | COMMON |
| JESD-30 代码 | S-PBGA-B172 | S-PBGA-B172 | - | S-PBGA-B172 | S-PBGA-B172 | S-PBGA-B172 |
| JESD-609代码 | e0 | e0 | - | e0 | e0 | e0 |
| 长度 | 15 mm | 15 mm | - | 15 mm | 15 mm | 15 mm |
| 内存密度 | 4718592 bit | 4718592 bit | - | 4718592 bit | 4718592 bit | 4718592 bit |
| 内存集成电路类型 | DUAL-PORT SRAM | DUAL-PORT SRAM | - | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM |
| 内存宽度 | 36 | 36 | - | 36 | 36 | 36 |
| 功能数量 | 1 | 1 | - | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | - | 2 | 2 | 2 |
| 端子数量 | 172 | 172 | - | 172 | 172 | 172 |
| 字数 | 131072 words | 131072 words | - | 131072 words | 131072 words | 131072 words |
| 字数代码 | 128000 | 128000 | - | 128000 | 128000 | 128000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 85 °C | 70 °C | - | 70 °C | 85 °C | 85 °C |
| 组织 | 128KX36 | 128KX36 | - | 128KX36 | 128KX36 | 128KX36 |
| 输出特性 | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LBGA | LBGA | - | LBGA | LBGA | LBGA |
| 封装等效代码 | BGA172,14X14,40 | BGA172,14X14,40 | - | BGA172,14X14,40 | BGA172,14X14,40 | BGA172,14X14,40 |
| 封装形状 | SQUARE | SQUARE | - | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | - | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE |
| 并行/串行 | PARALLEL | PARALLEL | - | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.25 mm | 1.25 mm | - | 1.25 mm | 1.25 mm | 1.25 mm |
| 最小待机电流 | 3.14 V | 3.14 V | - | 3.14 V | 3.14 V | 3.14 V |
| 最大供电电压 (Vsup) | 3.465 V | 3.465 V | - | 3.465 V | 3.465 V | 3.465 V |
| 最小供电电压 (Vsup) | 3.135 V | 3.135 V | - | 3.135 V | 3.135 V | 3.135 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | - | YES | YES | YES |
| 技术 | CMOS | CMOS | - | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | COMMERCIAL | - | COMMERCIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | BALL | BALL | - | BALL | BALL | BALL |
| 端子节距 | 1 mm | 1 mm | - | 1 mm | 1 mm | 1 mm |
| 端子位置 | BOTTOM | BOTTOM | - | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 15 mm | 15 mm | - | 15 mm | 15 mm | 15 mm |
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